KR960702938A - 다층 회로기판의 인접 회로기판층 사이에 전기 상호접속을 제공하는 방법(method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board) - Google Patents
다층 회로기판의 인접 회로기판층 사이에 전기 상호접속을 제공하는 방법(method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board)Info
- Publication number
- KR960702938A KR960702938A KR1019950705493A KR19950705493A KR960702938A KR 960702938 A KR960702938 A KR 960702938A KR 1019950705493 A KR1019950705493 A KR 1019950705493A KR 19950705493 A KR19950705493 A KR 19950705493A KR 960702938 A KR960702938 A KR 960702938A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- providing electrical
- electrical interconnections
- layers
- layer circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/074,113 US5401913A (en) | 1993-06-08 | 1993-06-08 | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
PCT/US1994/006387 WO1994029897A1 (en) | 1993-06-08 | 1994-06-07 | Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960702938A true KR960702938A (ko) | 1996-05-23 |
Family
ID=22117818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950705493A KR960702938A (ko) | 1993-06-08 | 1995-12-05 | 다층 회로기판의 인접 회로기판층 사이에 전기 상호접속을 제공하는 방법(method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board) |
Country Status (7)
Country | Link |
---|---|
US (2) | US5401913A (ko) |
EP (1) | EP0702847A1 (ko) |
JP (1) | JPH08510868A (ko) |
KR (1) | KR960702938A (ko) |
CN (1) | CN1125998A (ko) |
CA (1) | CA2162499A1 (ko) |
WO (1) | WO1994029897A1 (ko) |
Families Citing this family (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69419219T2 (de) * | 1993-09-03 | 2000-01-05 | Toshiba Kawasaki Kk | Leiterplatte und Verfahren zur Herstellung solcher Leiterplatten |
US5745987A (en) * | 1995-10-20 | 1998-05-05 | Lucent Technologies Inc. | Method for bonding circuit boards to pallets |
JP3510024B2 (ja) * | 1995-11-02 | 2004-03-22 | 矢崎総業株式会社 | 平面回路体の端末接続部およびその製造方法 |
US5839188A (en) | 1996-01-05 | 1998-11-24 | Alliedsignal Inc. | Method of manufacturing a printed circuit assembly |
US6147870A (en) * | 1996-01-05 | 2000-11-14 | Honeywell International Inc. | Printed circuit assembly having locally enhanced wiring density |
JP3145331B2 (ja) * | 1996-04-26 | 2001-03-12 | 日本特殊陶業株式会社 | 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体および中継基板と取付基板の接続体の製造方法 |
US5819401A (en) * | 1996-06-06 | 1998-10-13 | Texas Instruments Incorporated | Metal constrained circuit board side to side interconnection technique |
DE19681758B4 (de) * | 1996-06-14 | 2006-09-14 | Ibiden Co., Ltd. | Einseitiges Schaltkreissubstrat für mehrlagige Schaltkreisplatine, mehrlagige Schaltkreisplatine und Verfahren zur Herstellung selbiger |
US5829127A (en) * | 1996-06-24 | 1998-11-03 | Circuitronics, Inc. | Latticework with plurality of overlying lines |
US6112407A (en) * | 1996-06-24 | 2000-09-05 | Circuitronics, Inc. | Latticework with plurality of overlying lines |
US5873161A (en) * | 1996-07-23 | 1999-02-23 | Minnesota Mining And Manufacturing Company | Method of making a Z axis interconnect circuit |
JP3299679B2 (ja) * | 1996-12-27 | 2002-07-08 | 新光電気工業株式会社 | 多層配線基板及びその製造方法 |
DE69839964D1 (de) * | 1997-06-06 | 2008-10-16 | Ibiden Co Ltd | Einseitige leiterplatte und verfahren zu deren herstellung |
US6431695B1 (en) | 1998-06-18 | 2002-08-13 | 3M Innovative Properties Company | Microstructure liquid dispenser |
US6375871B1 (en) | 1998-06-18 | 2002-04-23 | 3M Innovative Properties Company | Methods of manufacturing microfluidic articles |
US6514412B1 (en) | 1998-06-18 | 2003-02-04 | 3M Innovative Properties Company | Microstructured separation device |
US6290685B1 (en) | 1998-06-18 | 2001-09-18 | 3M Innovative Properties Company | Microchanneled active fluid transport devices |
US6907921B2 (en) | 1998-06-18 | 2005-06-21 | 3M Innovative Properties Company | Microchanneled active fluid heat exchanger |
US6071597A (en) * | 1997-08-28 | 2000-06-06 | 3M Innovative Properties Company | Flexible circuits and carriers and process for manufacture |
US6156484A (en) * | 1997-11-07 | 2000-12-05 | International Business Machines Corporation | Gray scale etching for thin flexible interposer |
US6038133A (en) * | 1997-11-25 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method for producing the same |
US6063647A (en) * | 1997-12-08 | 2000-05-16 | 3M Innovative Properties Company | Method for making circuit elements for a z-axis interconnect |
US6294407B1 (en) * | 1998-05-06 | 2001-09-25 | Virtual Integration, Inc. | Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same |
US6140707A (en) * | 1998-05-07 | 2000-10-31 | 3M Innovative Properties Co. | Laminated integrated circuit package |
FR2783354B1 (fr) * | 1998-08-25 | 2002-07-12 | Commissariat Energie Atomique | Procede collectif de conditionnement d'une pluralite de composants formes initialement dans un meme substrat |
US6400018B2 (en) | 1998-08-27 | 2002-06-04 | 3M Innovative Properties Company | Via plug adapter |
US6163957A (en) * | 1998-11-13 | 2000-12-26 | Fujitsu Limited | Multilayer laminated substrates with high density interconnects and methods of making the same |
US6246010B1 (en) * | 1998-11-25 | 2001-06-12 | 3M Innovative Properties Company | High density electronic package |
US6274224B1 (en) | 1999-02-01 | 2001-08-14 | 3M Innovative Properties Company | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
JP2000332369A (ja) * | 1999-05-25 | 2000-11-30 | Mitsui Mining & Smelting Co Ltd | プリント回路板及びその製造方法 |
US6326555B1 (en) | 1999-02-26 | 2001-12-04 | Fujitsu Limited | Method and structure of z-connected laminated substrate for high density electronic packaging |
US6462414B1 (en) | 1999-03-05 | 2002-10-08 | Altera Corporation | Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad |
US6492600B1 (en) * | 1999-06-28 | 2002-12-10 | International Business Machines Corporation | Laminate having plated microvia interconnects and method for forming the same |
US7223364B1 (en) | 1999-07-07 | 2007-05-29 | 3M Innovative Properties Company | Detection article having fluid control film |
US6583364B1 (en) * | 1999-08-26 | 2003-06-24 | Sony Chemicals Corp. | Ultrasonic manufacturing apparatuses, multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards |
JP3183653B2 (ja) * | 1999-08-26 | 2001-07-09 | ソニーケミカル株式会社 | フレキシブル基板 |
JP3587748B2 (ja) | 1999-10-18 | 2004-11-10 | ソニーケミカル株式会社 | 多層フレキシブル配線板及び多層フレキシブル配線板製造方法 |
SE521704C2 (sv) * | 1999-10-29 | 2003-11-25 | Ericsson Telefon Ab L M | Förfarande för att anordna koppling mellan olika skikt i ett kretskort samt kretskort |
US6451191B1 (en) * | 1999-11-18 | 2002-09-17 | 3M Innovative Properties Company | Film based addressable programmable electronic matrix articles and methods of manufacturing and using the same |
JP4444435B2 (ja) * | 2000-03-06 | 2010-03-31 | ソニーケミカル&インフォメーションデバイス株式会社 | プリント配線基板及びプリント配線基板の製造方法 |
US6316734B1 (en) | 2000-03-07 | 2001-11-13 | 3M Innovative Properties Company | Flexible circuits with static discharge protection and process for manufacture |
US6377433B1 (en) * | 2000-03-17 | 2002-04-23 | The Boeing Company | Electrical fuse/support assembly |
JP2001320167A (ja) * | 2000-05-10 | 2001-11-16 | Ibiden Co Ltd | 多層回路基板の製造方法 |
JP3951091B2 (ja) * | 2000-08-04 | 2007-08-01 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
US6624383B1 (en) * | 2000-08-30 | 2003-09-23 | Parker-Hannifin Corporation | Using laser etching to improve surface contact resistance of conductive fiber filler polymer composites |
US7331502B2 (en) * | 2001-03-19 | 2008-02-19 | Sumitomo Bakelite Company, Ltd. | Method of manufacturing electronic part and electronic part obtained by the method |
US6879492B2 (en) * | 2001-03-28 | 2005-04-12 | International Business Machines Corporation | Hyperbga buildup laminate |
US6459043B1 (en) | 2001-03-29 | 2002-10-01 | 3M Innovative Properties Company | Flexible circuit with electrostatic damage limiting feature and method of manufacture |
US6815620B2 (en) | 2001-03-29 | 2004-11-09 | 3M Innovative Properties Company | Flexible circuit with electrostatic damage limiting feature |
JP3826731B2 (ja) * | 2001-05-07 | 2006-09-27 | ソニー株式会社 | 多層プリント配線基板及び多層プリント配線基板の製造方法 |
US6995954B1 (en) | 2001-07-13 | 2006-02-07 | Magnecomp Corporation | ESD protected suspension interconnect |
US6558560B2 (en) * | 2001-07-27 | 2003-05-06 | Hewlett-Packard Company | Method for the fabrication of electrical contacts |
TWI312166B (en) * | 2001-09-28 | 2009-07-11 | Toppan Printing Co Ltd | Multi-layer circuit board, integrated circuit package, and manufacturing method for multi-layer circuit board |
US6818464B2 (en) * | 2001-10-17 | 2004-11-16 | Hymite A/S | Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes |
US7080445B2 (en) * | 2001-10-31 | 2006-07-25 | Denso Corporation | Method for connecting printed circuit boards and connected printed circuit boards |
US6805280B2 (en) * | 2002-01-08 | 2004-10-19 | International Business Machines Corporation | Z interconnect structure and method |
US20030155656A1 (en) * | 2002-01-18 | 2003-08-21 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
JP3807312B2 (ja) * | 2002-01-18 | 2006-08-09 | 富士通株式会社 | プリント基板とその製造方法 |
WO2003062133A2 (en) * | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Covered microchamber structures |
DE10392199T5 (de) * | 2002-01-18 | 2005-01-05 | Avery Dennison Corp., Pasadena | Folie mit Mikroarchitektur |
US6596384B1 (en) * | 2002-04-09 | 2003-07-22 | International Business Machines Corporation | Selectively roughening conductors for high frequency printed wiring boards |
TW530377B (en) * | 2002-05-28 | 2003-05-01 | Via Tech Inc | Structure of laminated substrate with high integration and method of production thereof |
US7260890B2 (en) * | 2002-06-26 | 2007-08-28 | Georgia Tech Research Corporation | Methods for fabricating three-dimensional all organic interconnect structures |
US6900708B2 (en) * | 2002-06-26 | 2005-05-31 | Georgia Tech Research Corporation | Integrated passive devices fabricated utilizing multi-layer, organic laminates |
WO2004049772A1 (ja) * | 2002-11-27 | 2004-06-10 | Sumitomo Bakelite Company Limited | 回路基板、多層配線板、回路基板の製造方法および多層配線板の製造方法 |
JP3981026B2 (ja) * | 2003-01-30 | 2007-09-26 | 株式会社東芝 | 多層配線層を有する半導体装置およびその製造方法 |
US7489914B2 (en) * | 2003-03-28 | 2009-02-10 | Georgia Tech Research Corporation | Multi-band RF transceiver with passive reuse in organic substrates |
JP3933094B2 (ja) * | 2003-05-27 | 2007-06-20 | セイコーエプソン株式会社 | 電子部品の実装方法 |
JP2007535123A (ja) * | 2003-07-14 | 2007-11-29 | エイブイエックス コーポレイション | モジュール式電子アッセンブリーおよび製造方法 |
US20050098605A1 (en) * | 2003-11-06 | 2005-05-12 | International Business Machines Corporation | Apparatus and method for low pressure wirebond |
US7489493B2 (en) * | 2003-12-01 | 2009-02-10 | Magnecomp Corporation | Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material |
US7828736B2 (en) * | 2004-01-27 | 2010-11-09 | Fujinon Corporation | Electronic scan type ultrasound diagnostic instrument |
US7012017B2 (en) * | 2004-01-29 | 2006-03-14 | 3M Innovative Properties Company | Partially etched dielectric film with conductive features |
US7772164B2 (en) * | 2004-06-02 | 2010-08-10 | Rhodia, Inc. | Multicomponent viscoelastic surfactant fluid and method of using as a fracturing fluid |
US8345433B2 (en) * | 2004-07-08 | 2013-01-01 | Avx Corporation | Heterogeneous organic laminate stack ups for high frequency applications |
US7446399B1 (en) | 2004-08-04 | 2008-11-04 | Altera Corporation | Pad structures to improve board-level reliability of solder-on-pad BGA structures |
JP4595471B2 (ja) * | 2004-09-30 | 2010-12-08 | 住友電気工業株式会社 | 導電性ペースト、及びそれを用いた多層プリント配線板の製造方法 |
JP2007141956A (ja) * | 2005-11-15 | 2007-06-07 | Three M Innovative Properties Co | プリント回路基板の接続方法 |
CN101421886B (zh) * | 2006-04-12 | 2010-12-15 | 日立化成工业株式会社 | 电路连接用粘接膜、电路部件的连接结构以及电路部件的连接方法 |
US7439840B2 (en) | 2006-06-27 | 2008-10-21 | Jacket Micro Devices, Inc. | Methods and apparatuses for high-performing multi-layer inductors |
US7808434B2 (en) * | 2006-08-09 | 2010-10-05 | Avx Corporation | Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices |
US7989895B2 (en) * | 2006-11-15 | 2011-08-02 | Avx Corporation | Integration using package stacking with multi-layer organic substrates |
CN100454669C (zh) * | 2007-07-26 | 2009-01-21 | 友达光电股份有限公司 | 电性连接装置、包含该电性连接装置的电子装置及电子产品 |
JP2009059814A (ja) * | 2007-08-30 | 2009-03-19 | Denso Corp | 多層プリント基板の製造方法 |
JP5306634B2 (ja) * | 2007-11-22 | 2013-10-02 | 新光電気工業株式会社 | 配線基板及び半導体装置及び配線基板の製造方法 |
US8179639B2 (en) * | 2009-03-02 | 2012-05-15 | Seagate Technology Llc | Head gimbal assembly without bus traces for plating |
JP5621311B2 (ja) * | 2010-05-11 | 2014-11-12 | 富士通株式会社 | 回路基板の製造方法 |
CN105101674A (zh) * | 2015-07-20 | 2015-11-25 | 惠州绿草电子科技有限公司 | 一种叠加式电路板制造方法及叠加式电路板 |
CN105578738B (zh) * | 2015-12-21 | 2019-01-25 | 上海交通大学 | 基于弹性衬底的可拉伸电路板的制备方法及可拉伸电路板 |
US10068851B1 (en) * | 2017-05-30 | 2018-09-04 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
CN108322997A (zh) * | 2018-03-07 | 2018-07-24 | 苏州诺莱声科技有限公司 | 一种柔性印刷电路板及吸声增强型超声换能器 |
WO2020060837A1 (en) * | 2018-09-20 | 2020-03-26 | Applied Materials, Inc. | Systems and methods for improving within die co-planarity uniformity |
Family Cites Families (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3562009A (en) * | 1967-02-14 | 1971-02-09 | Western Electric Co | Method of providing electrically conductive substrate through-holes |
US3471631A (en) * | 1968-04-03 | 1969-10-07 | Us Air Force | Fabrication of microminiature multilayer circuit boards |
US3646670A (en) * | 1968-07-19 | 1972-03-07 | Hitachi Chemical Co Ltd | Method for connecting conductors |
GB1353671A (en) * | 1971-06-10 | 1974-05-22 | Int Computers Ltd | Methods of forming circuit interconnections |
US3795047A (en) * | 1972-06-15 | 1974-03-05 | Ibm | Electrical interconnect structuring for laminate assemblies and fabricating methods therefor |
FR2204940B1 (ko) * | 1972-10-27 | 1976-01-30 | Thomson Csf Fr | |
US3888639A (en) * | 1974-01-02 | 1975-06-10 | Teledyne Electro Mechanisms | Method for connecting printed circuits |
US3953924A (en) * | 1975-06-30 | 1976-05-04 | Rockwell International Corporation | Process for making a multilayer interconnect system |
JPS5357481A (en) * | 1976-11-04 | 1978-05-24 | Canon Inc | Connecting process |
FR2402996A1 (fr) * | 1977-09-12 | 1979-04-06 | Labo Electronique Physique | Procede de realisation de bulles metalliques sur un substrat perce, substrat ainsi traite et utilisation |
US4184729A (en) * | 1977-10-13 | 1980-01-22 | Bunker Ramo Corporation | Flexible connector cable |
DE2820403C2 (de) * | 1978-05-10 | 1984-09-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Ankleben und zum Kontaktieren eines elektrischen Bauteils mit einer flächenförmigen Elektrode |
US4219708A (en) * | 1979-02-12 | 1980-08-26 | Detectors, Inc. | Shockswitch |
US4466184A (en) * | 1981-04-21 | 1984-08-21 | General Dynamics, Pomona Division | Method of making pressure point contact system |
US4396457A (en) * | 1982-03-17 | 1983-08-02 | E. I. Du Pont De Nemours And Company | Method of making bumped-beam tape |
US4627565A (en) * | 1982-03-18 | 1986-12-09 | Lomerson Robert B | Mechanical bonding of surface conductive layers |
JPS60227496A (ja) * | 1984-04-26 | 1985-11-12 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
US4554033A (en) * | 1984-10-04 | 1985-11-19 | Amp Incorporated | Method of forming an electrical interconnection means |
US4572764A (en) * | 1984-12-13 | 1986-02-25 | E. I. Du Pont De Nemours And Company | Preparation of photoformed plastic multistrate by via formation first |
US4685210A (en) * | 1985-03-13 | 1987-08-11 | The Boeing Company | Multi-layer circuit board bonding method utilizing noble metal coated surfaces |
JPS6284973U (ko) * | 1985-11-19 | 1987-05-30 | ||
US4635073A (en) * | 1985-11-22 | 1987-01-06 | Hewlett Packard Company | Replaceable thermal ink jet component and thermosonic beam bonding process for fabricating same |
US4681654A (en) * | 1986-05-21 | 1987-07-21 | International Business Machines Corporation | Flexible film semiconductor chip carrier |
EP0260490A1 (en) * | 1986-08-27 | 1988-03-23 | Kabushiki Kaisha Toshiba | Bonding sheet for electronic component and method of bonding electronic component using the same |
US4912020A (en) * | 1986-10-21 | 1990-03-27 | Westinghouse Electric Corp. | Printed circuit boards and method for manufacturing printed circuit boards |
JPH07112041B2 (ja) * | 1986-12-03 | 1995-11-29 | シャープ株式会社 | 半導体装置の製造方法 |
US4824521A (en) * | 1987-04-01 | 1989-04-25 | Fairchild Semiconductor Corporation | Planarization of metal pillars on uneven substrates |
JPS63249393A (ja) * | 1987-04-03 | 1988-10-17 | シャープ株式会社 | 電子部品の接続方法 |
US4788766A (en) * | 1987-05-20 | 1988-12-06 | Loral Corporation | Method of fabricating a multilayer circuit board assembly |
JPH0754872B2 (ja) * | 1987-06-22 | 1995-06-07 | 古河電気工業株式会社 | 二層印刷回路シ−トの製造方法 |
US4857482A (en) * | 1987-06-30 | 1989-08-15 | Kabushiki Kaisha Toshiba | Method of forming bump electrode and electronic circuit device |
US4867839A (en) * | 1987-09-04 | 1989-09-19 | Shinko Electric Industries Co., Ltd. | Process for forming a circuit substrate |
US4803450A (en) * | 1987-12-14 | 1989-02-07 | General Electric Company | Multilayer circuit board fabricated from silicon |
US4868350A (en) * | 1988-03-07 | 1989-09-19 | International Business Machines Corporation | High performance circuit boards |
US4864722A (en) * | 1988-03-16 | 1989-09-12 | International Business Machines Corporation | Low dielectric printed circuit boards |
US4854038A (en) * | 1988-03-16 | 1989-08-08 | International Business Machines Corporation | Modularized fabrication of high performance printed circuit boards |
US4935584A (en) * | 1988-05-24 | 1990-06-19 | Tektronix, Inc. | Method of fabricating a printed circuit board and the PCB produced |
US5008997A (en) * | 1988-09-16 | 1991-04-23 | National Semiconductor | Gold/tin eutectic bonding for tape automated bonding process |
US4925723A (en) * | 1988-09-29 | 1990-05-15 | Microwave Power, Inc. | Microwave integrated circuit substrate including metal filled via holes and method of manufacture |
GB8823537D0 (en) * | 1988-10-06 | 1988-11-16 | Telco Int Ltd | Circuit board manufacture |
JPH02137293A (ja) * | 1988-11-17 | 1990-05-25 | Toshiba Lighting & Technol Corp | 多層回路基板 |
US5031308A (en) * | 1988-12-29 | 1991-07-16 | Japan Radio Co., Ltd. | Method of manufacturing multilayered printed-wiring-board |
JPH0740496B2 (ja) * | 1989-03-01 | 1995-05-01 | シャープ株式会社 | 電極上への導電性粒子の配置方法 |
US4933045A (en) * | 1989-06-02 | 1990-06-12 | International Business Machines Corporation | Thin film multilayer laminate interconnection board assembly method |
US4970106A (en) * | 1989-06-02 | 1990-11-13 | International Business Machines Corporation | Thin film multilayer laminate interconnection board |
US5014162A (en) * | 1989-06-27 | 1991-05-07 | At&T Bell Laboratories | Solder assembly of components |
US5056216A (en) * | 1990-01-26 | 1991-10-15 | Sri International | Method of forming a plurality of solder connections |
US5046238A (en) * | 1990-03-15 | 1991-09-10 | Rogers Corporation | Method of manufacturing a multilayer circuit board |
JPH0410696A (ja) * | 1990-04-27 | 1992-01-14 | Nitto Denko Corp | 多層配線基板の製造方法 |
US5060844A (en) * | 1990-07-18 | 1991-10-29 | International Business Machines Corporation | Interconnection structure and test method |
US5129142A (en) * | 1990-10-30 | 1992-07-14 | International Business Machines Corporation | Encapsulated circuitized power core alignment and lamination |
JP2616588B2 (ja) * | 1991-01-09 | 1997-06-04 | 日本電気株式会社 | ポリイミド多層配線基板およびその製造方法 |
CA2059020C (en) * | 1991-01-09 | 1998-08-18 | Kohji Kimbara | Polyimide multilayer wiring board and method of producing same |
JP3016292B2 (ja) * | 1991-11-20 | 2000-03-06 | 日本電気株式会社 | ポリイミド多層配線基板およびその製造方法 |
JP2819859B2 (ja) * | 1991-05-29 | 1998-11-05 | 富士通株式会社 | 放熱ヴィアとその形成方法 |
US5146674A (en) * | 1991-07-01 | 1992-09-15 | International Business Machines Corporation | Manufacturing process of a high density substrate design |
CA2083072C (en) * | 1991-11-21 | 1998-02-03 | Shinichi Hasegawa | Method for manufacturing polyimide multilayer wiring substrate |
US5245135A (en) * | 1992-04-20 | 1993-09-14 | Hughes Aircraft Company | Stackable high density interconnection mechanism (SHIM) |
US5329423A (en) * | 1993-04-13 | 1994-07-12 | Scholz Kenneth D | Compressive bump-and-socket interconnection scheme for integrated circuits |
-
1993
- 1993-06-08 US US08/074,113 patent/US5401913A/en not_active Expired - Fee Related
-
1994
- 1994-06-07 CN CN94192341A patent/CN1125998A/zh active Pending
- 1994-06-07 WO PCT/US1994/006387 patent/WO1994029897A1/en not_active Application Discontinuation
- 1994-06-07 CA CA002162499A patent/CA2162499A1/en not_active Abandoned
- 1994-06-07 EP EP94919395A patent/EP0702847A1/en not_active Withdrawn
- 1994-06-07 JP JP7502035A patent/JPH08510868A/ja not_active Ceased
-
1995
- 1995-01-23 US US08/384,586 patent/US5601678A/en not_active Expired - Fee Related
- 1995-12-05 KR KR1019950705493A patent/KR960702938A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JPH08510868A (ja) | 1996-11-12 |
EP0702847A1 (en) | 1996-03-27 |
US5401913A (en) | 1995-03-28 |
US5601678A (en) | 1997-02-11 |
CN1125998A (zh) | 1996-07-03 |
WO1994029897A1 (en) | 1994-12-22 |
CA2162499A1 (en) | 1994-12-22 |
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