DE69603331D1 - Herstellungsverfahren von einem elektronischen vielschichtbauteil - Google Patents

Herstellungsverfahren von einem elektronischen vielschichtbauteil

Info

Publication number
DE69603331D1
DE69603331D1 DE69603331T DE69603331T DE69603331D1 DE 69603331 D1 DE69603331 D1 DE 69603331D1 DE 69603331 T DE69603331 T DE 69603331T DE 69603331 T DE69603331 T DE 69603331T DE 69603331 D1 DE69603331 D1 DE 69603331D1
Authority
DE
Germany
Prior art keywords
manufacturing
electronic component
layer electronic
layer
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69603331T
Other languages
English (en)
Other versions
DE69603331T2 (de
Inventor
Antonius Nellissen
Grunsven Erik Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69603331D1 publication Critical patent/DE69603331D1/de
Application granted granted Critical
Publication of DE69603331T2 publication Critical patent/DE69603331T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/306—Stacked capacitors made by thin film techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Thermistors And Varistors (AREA)
  • Fuses (AREA)
DE69603331T 1995-03-27 1996-03-21 Herstellungsverfahren von einem elektronischen vielschichtbauteil Expired - Fee Related DE69603331T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP95200751 1995-03-27
EP96200395 1996-02-16
PCT/IB1996/000248 WO1996030916A2 (en) 1995-03-27 1996-03-21 Method of manufacturing an electronic multilayer component

Publications (2)

Publication Number Publication Date
DE69603331D1 true DE69603331D1 (de) 1999-08-26
DE69603331T2 DE69603331T2 (de) 2000-02-17

Family

ID=26139175

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69603331T Expired - Fee Related DE69603331T2 (de) 1995-03-27 1996-03-21 Herstellungsverfahren von einem elektronischen vielschichtbauteil

Country Status (5)

Country Link
US (1) US5875531A (de)
EP (1) EP0761011B1 (de)
JP (1) JP2002515178A (de)
DE (1) DE69603331T2 (de)
WO (1) WO1996030916A2 (de)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
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WO1999008297A2 (en) 1997-08-05 1999-02-18 Koninklijke Philips Electronics N.V. Method of manufacturing a plurality of electronic components
US6210128B1 (en) * 1999-04-16 2001-04-03 The United States Of America As Represented By The Secretary Of The Navy Fluidic drive for miniature acoustic fluidic pumps and mixers
US6689976B1 (en) * 2002-10-08 2004-02-10 Agilent Technologies, Inc. Electrically isolated liquid metal micro-switches for integrally shielded microcircuits
US7078849B2 (en) * 2001-10-31 2006-07-18 Agilent Technologies, Inc. Longitudinal piezoelectric optical latching relay
US6741767B2 (en) * 2002-03-28 2004-05-25 Agilent Technologies, Inc. Piezoelectric optical relay
US20030194170A1 (en) * 2002-04-10 2003-10-16 Wong Marvin Glenn Piezoelectric optical demultiplexing switch
US6750594B2 (en) 2002-05-02 2004-06-15 Agilent Technologies, Inc. Piezoelectrically actuated liquid metal switch
US6927529B2 (en) 2002-05-02 2005-08-09 Agilent Technologies, Inc. Solid slug longitudinal piezoelectric latching relay
US6756551B2 (en) 2002-05-09 2004-06-29 Agilent Technologies, Inc. Piezoelectrically actuated liquid metal switch
WO2003105131A1 (en) * 2002-06-05 2003-12-18 Sae Magnetics (H.K.) Ltd. A system and method for preventing operational and manufacturing imperfections in piezoelectric micro-actuators
US6743990B1 (en) 2002-12-12 2004-06-01 Agilent Technologies, Inc. Volume adjustment apparatus and method for use
US6855898B2 (en) * 2002-12-12 2005-02-15 Agilent Technologies, Inc. Ceramic channel plate for a switch
US6787719B2 (en) * 2002-12-12 2004-09-07 Agilent Technologies, Inc. Switch and method for producing the same
US6774324B2 (en) * 2002-12-12 2004-08-10 Agilent Technologies, Inc. Switch and production thereof
US7022926B2 (en) * 2002-12-12 2006-04-04 Agilent Technologies, Inc. Ultrasonically milled channel plate for a switch
US20040112727A1 (en) * 2002-12-12 2004-06-17 Wong Marvin Glenn Laser cut channel plate for a switch
US7019235B2 (en) * 2003-01-13 2006-03-28 Agilent Technologies, Inc. Photoimaged channel plate for a switch
US6809277B2 (en) * 2003-01-22 2004-10-26 Agilent Technologies, Inc. Method for registering a deposited material with channel plate channels, and switch produced using same
US6747222B1 (en) * 2003-02-04 2004-06-08 Agilent Technologies, Inc. Feature formation in a nonphotoimagable material and switch incorporating same
US6825429B2 (en) * 2003-03-31 2004-11-30 Agilent Technologies, Inc. Hermetic seal and controlled impedance RF connections for a liquid metal micro switch
US6924443B2 (en) * 2003-04-14 2005-08-02 Agilent Technologies, Inc. Reducing oxides on a switching fluid in a fluid-based switch
US6903492B2 (en) * 2003-04-14 2005-06-07 Agilent Technologies, Inc. Wetting finger latching piezoelectric relay
US6882088B2 (en) * 2003-04-14 2005-04-19 Agilent Technologies, Inc. Bending-mode latching relay
US6961487B2 (en) * 2003-04-14 2005-11-01 Agilent Technologies, Inc. Method and structure for a pusher-mode piezoelectrically actuated liquid metal optical switch
US6879089B2 (en) * 2003-04-14 2005-04-12 Agilent Technologies, Inc. Damped longitudinal mode optical latching relay
US6946775B2 (en) * 2003-04-14 2005-09-20 Agilent Technologies, Inc. Method and structure for a slug assisted longitudinal piezoelectrically actuated liquid metal optical switch
US7048519B2 (en) * 2003-04-14 2006-05-23 Agilent Technologies, Inc. Closed-loop piezoelectric pump
US6876133B2 (en) * 2003-04-14 2005-04-05 Agilent Technologies, Inc. Latching relay with switch bar
US6885133B2 (en) * 2003-04-14 2005-04-26 Agilent Technologies, Inc. High frequency bending-mode latching relay
US7070908B2 (en) * 2003-04-14 2006-07-04 Agilent Technologies, Inc. Feature formation in thick-film inks
US6730866B1 (en) 2003-04-14 2004-05-04 Agilent Technologies, Inc. High-frequency, liquid metal, latching relay array
US7071432B2 (en) * 2003-04-14 2006-07-04 Agilent Technologies, Inc. Reduction of oxides in a fluid-based switch
US6770827B1 (en) 2003-04-14 2004-08-03 Agilent Technologies, Inc. Electrical isolation of fluid-based switches
US6956990B2 (en) * 2003-04-14 2005-10-18 Agilent Technologies, Inc. Reflecting wedge optical wavelength multiplexer/demultiplexer
US6888977B2 (en) * 2003-04-14 2005-05-03 Agilent Technologies, Inc. Polymeric liquid metal optical switch
US6925223B2 (en) * 2003-04-14 2005-08-02 Agilent Technologies, Inc. Pressure actuated optical latching relay
US6900578B2 (en) * 2003-04-14 2005-05-31 Agilent Technologies, Inc. High frequency latching relay with bending switch bar
US6803842B1 (en) 2003-04-14 2004-10-12 Agilent Technologies, Inc. Longitudinal mode solid slug optical latching relay
US6798937B1 (en) 2003-04-14 2004-09-28 Agilent Technologies, Inc. Pressure actuated solid slug optical latching relay
US6876131B2 (en) * 2003-04-14 2005-04-05 Agilent Technologies, Inc. High-frequency, liquid metal, latching relay with face contact
US20040201447A1 (en) * 2003-04-14 2004-10-14 Wong Marvin Glenn Thin-film resistor device
US6876130B2 (en) * 2003-04-14 2005-04-05 Agilent Technologies, Inc. Damped longitudinal mode latching relay
US6762378B1 (en) 2003-04-14 2004-07-13 Agilent Technologies, Inc. Liquid metal, latching relay with face contact
US6768068B1 (en) 2003-04-14 2004-07-27 Agilent Technologies, Inc. Method and structure for a slug pusher-mode piezoelectrically actuated liquid metal switch
US6894237B2 (en) * 2003-04-14 2005-05-17 Agilent Technologies, Inc. Formation of signal paths to increase maximum signal-carrying frequency of a fluid-based switch
US6903287B2 (en) * 2003-04-14 2005-06-07 Agilent Technologies, Inc. Liquid metal optical relay
US6903493B2 (en) * 2003-04-14 2005-06-07 Agilent Technologies, Inc. Inserting-finger liquid metal relay
US6879088B2 (en) * 2003-04-14 2005-04-12 Agilent Technologies, Inc. Insertion-type liquid metal latching relay array
US6841746B2 (en) * 2003-04-14 2005-01-11 Agilent Technologies, Inc. Bent switching fluid cavity
US6740829B1 (en) 2003-04-14 2004-05-25 Agilent Technologies, Inc. Insertion-type liquid metal latching relay
US6774325B1 (en) 2003-04-14 2004-08-10 Agilent Technologies, Inc. Reducing oxides on a switching fluid in a fluid-based switch
US6906271B2 (en) * 2003-04-14 2005-06-14 Agilent Technologies, Inc. Fluid-based switch
US6891116B2 (en) * 2003-04-14 2005-05-10 Agilent Technologies, Inc. Substrate with liquid electrode
US6870111B2 (en) * 2003-04-14 2005-03-22 Agilent Technologies, Inc. Bending mode liquid metal switch
US6818844B2 (en) * 2003-04-14 2004-11-16 Agilent Technologies, Inc. Method and structure for a slug assisted pusher-mode piezoelectrically actuated liquid metal optical switch
US6894424B2 (en) * 2003-04-14 2005-05-17 Agilent Technologies, Inc. High frequency push-mode latching relay
US6891315B2 (en) * 2003-04-14 2005-05-10 Agilent Technologies, Inc. Shear mode liquid metal switch
US6920259B2 (en) * 2003-04-14 2005-07-19 Agilent Technologies, Inc. Longitudinal electromagnetic latching optical relay
US6946776B2 (en) * 2003-04-14 2005-09-20 Agilent Technologies, Inc. Method and apparatus for maintaining a liquid metal switch in a ready-to-switch condition
US6838959B2 (en) * 2003-04-14 2005-01-04 Agilent Technologies, Inc. Longitudinal electromagnetic latching relay
US6831532B2 (en) * 2003-04-14 2004-12-14 Agilent Technologies, Inc. Push-mode latching relay
US6794591B1 (en) 2003-04-14 2004-09-21 Agilent Technologies, Inc. Fluid-based switches
US7012354B2 (en) * 2003-04-14 2006-03-14 Agilent Technologies, Inc. Method and structure for a pusher-mode piezoelectrically actuated liquid metal switch
US6876132B2 (en) * 2003-04-14 2005-04-05 Agilent Technologies, Inc. Method and structure for a solid slug caterpillar piezoelectric relay
US6765161B1 (en) 2003-04-14 2004-07-20 Agilent Technologies, Inc. Method and structure for a slug caterpillar piezoelectric latching reflective optical relay
US6816641B2 (en) * 2003-04-14 2004-11-09 Agilent Technologies, Inc. Method and structure for a solid slug caterpillar piezoelectric optical relay
US6903490B2 (en) * 2003-04-14 2005-06-07 Agilent Technologies, Inc. Longitudinal mode optical latching relay
US6750413B1 (en) 2003-04-25 2004-06-15 Agilent Technologies, Inc. Liquid metal micro switches using patterned thick film dielectric as channels and a thin ceramic or glass cover plate
US6777630B1 (en) 2003-04-30 2004-08-17 Agilent Technologies, Inc. Liquid metal micro switches using as channels and heater cavities matching patterned thick film dielectric layers on opposing thin ceramic plates
US6759610B1 (en) 2003-06-05 2004-07-06 Agilent Technologies, Inc. Multi-layer assembly of stacked LIMMS devices with liquid metal vias
US6833520B1 (en) * 2003-06-16 2004-12-21 Agilent Technologies, Inc. Suspended thin-film resistor
US6759611B1 (en) 2003-06-16 2004-07-06 Agilent Technologies, Inc. Fluid-based switches and methods for producing the same
US6781074B1 (en) 2003-07-30 2004-08-24 Agilent Technologies, Inc. Preventing corrosion degradation in a fluid-based switch
US6787720B1 (en) 2003-07-31 2004-09-07 Agilent Technologies, Inc. Gettering agent and method to prevent corrosion in a fluid switch
US7638928B2 (en) * 2005-06-30 2009-12-29 Intel Corporation Piezo actuator for cooling
DE102006003847B4 (de) * 2006-01-26 2011-08-18 Siemens AG, 80333 Verfahren und Vorrichtung zum Herstellen eines polykristallinen Keramikfilms auf einem Substrat
JP5882053B2 (ja) * 2011-12-28 2016-03-09 太陽誘電株式会社 弾性波デバイスの製造方法
JP6454107B2 (ja) * 2014-09-05 2019-01-16 太陽誘電株式会社 薄膜キャパシタ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3326718A (en) * 1963-12-30 1967-06-20 Hughes Aircraft Co Method for making an electrical capacitor
US3894872A (en) * 1974-07-17 1975-07-15 Rca Corp Technique for fabricating high Q MIM capacitors
US4469719A (en) * 1981-12-21 1984-09-04 Applied Magnetics-Magnetic Head Divison Corporation Method for controlling the edge gradient of a layer of deposition material

Also Published As

Publication number Publication date
WO1996030916A2 (en) 1996-10-03
US5875531A (en) 1999-03-02
JP2002515178A (ja) 2002-05-21
EP0761011A1 (de) 1997-03-12
DE69603331T2 (de) 2000-02-17
EP0761011B1 (de) 1999-07-21
WO1996030916A3 (en) 1996-12-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee