FR2741501B1 - Procede et appareil de fabrication de cartes dielectriques, de circuit imprime et multicouches - Google Patents

Procede et appareil de fabrication de cartes dielectriques, de circuit imprime et multicouches

Info

Publication number
FR2741501B1
FR2741501B1 FR9613875A FR9613875A FR2741501B1 FR 2741501 B1 FR2741501 B1 FR 2741501B1 FR 9613875 A FR9613875 A FR 9613875A FR 9613875 A FR9613875 A FR 9613875A FR 2741501 B1 FR2741501 B1 FR 2741501B1
Authority
FR
France
Prior art keywords
printed
circuit boards
layer circuit
manufacturing dielectric
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9613875A
Other languages
English (en)
Other versions
FR2741501A1 (fr
Inventor
Taihei Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of FR2741501A1 publication Critical patent/FR2741501A1/fr
Application granted granted Critical
Publication of FR2741501B1 publication Critical patent/FR2741501B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14—Reflecting surfaces; Equivalent structures
    • H01Q15/141—Apparatus or processes specially adapted for manufacturing reflecting surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3456—Antennas, e.g. radomes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
FR9613875A 1995-11-16 1996-11-14 Procede et appareil de fabrication de cartes dielectriques, de circuit imprime et multicouches Expired - Fee Related FR2741501B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7298369A JPH09139619A (ja) 1995-11-16 1995-11-16 曲面形状基板の製造方法及びその製造装置

Publications (2)

Publication Number Publication Date
FR2741501A1 FR2741501A1 (fr) 1997-05-23
FR2741501B1 true FR2741501B1 (fr) 2001-12-28

Family

ID=17858805

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9613875A Expired - Fee Related FR2741501B1 (fr) 1995-11-16 1996-11-14 Procede et appareil de fabrication de cartes dielectriques, de circuit imprime et multicouches

Country Status (3)

Country Link
US (1) US5876789A (fr)
JP (1) JPH09139619A (fr)
FR (1) FR2741501B1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124612A (ja) * 1998-01-19 2000-04-28 Toshiba Corp 配線基板とその製造方法、その配線基板を具える電気機器
US6246381B1 (en) * 1999-07-01 2001-06-12 Telaxis Communications Corporation Insert mold process for forming polarizing grid element
US6727787B2 (en) * 2000-12-21 2004-04-27 The Charles Stark Draper Laboratory, Inc. Method and device for achieving a high-Q microwave resonant cavity
US7324066B2 (en) * 2003-07-29 2008-01-29 Hitec Luxembourg S.A. Antenna reflector
JP4370139B2 (ja) * 2003-09-30 2009-11-25 三菱重工業株式会社 電波ステルス性および／または電磁波シールド性を有する窓の製造方法並びに電波ステルス性および／または電磁波シールド性を有する窓材
JP4020097B2 (ja) 2004-05-11 2007-12-12 セイコーエプソン株式会社 半導体チップ、半導体装置及びその製造方法、並びに電子機器
CN102595778B (zh) 2012-03-13 2015-12-16 华为技术有限公司 一种多层印制电路板及其制造方法
DE102016103047A1 (de) * 2016-02-22 2017-08-24 Itz Innovations- Und Technologiezentrum Gmbh Herstellungsverfahren für eine Leuchtenkomponente und mit dem Verfahren hergestellte Leuchtenkomponente
US11764077B2 (en) * 2021-07-23 2023-09-19 Innolux Corporation Composite layer circuit element and manufacturing method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3007997A (en) * 1958-07-01 1961-11-07 Gen Electric Printed circuit board
US3536800A (en) * 1966-02-25 1970-10-27 Montecatini Edison Ellettronic Method of forming radio frequency devices employing a destructible mold
US3889363A (en) * 1971-02-16 1975-06-17 Richard P Davis Method of making printed circuit boards
US4200975A (en) * 1978-05-30 1980-05-06 Western Electric Company, Incorporated Additive method of forming circuit crossovers
US4861640A (en) * 1982-09-03 1989-08-29 John Fluke Mfg. Co., Inc. Molded circuit board and manufacturing method therefor
US4772496A (en) * 1985-06-15 1988-09-20 Showa Denko Kabushiki Kaisha Molded product having printed circuit board
GB2199183B (en) * 1986-12-23 1990-07-04 Gen Electric Plc Interconnection formation in multilayer circuits
FR2619984B1 (fr) * 1987-08-24 1996-03-01 Aerospatiale Procede de realisation de circuits imprimes presentant des surfaces complexes a priori non developpables
US5182569A (en) * 1988-09-23 1993-01-26 Alcatel N.V. Antenna having a circularly symmetrical reflector
US4944087A (en) * 1988-10-05 1990-07-31 Rogers Corporation Method of making a curved plastic body with circuit pattern
US5449591A (en) * 1991-03-06 1995-09-12 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing a curved surface multi-layer wiring board

Also Published As

Publication number Publication date
JPH09139619A (ja) 1997-05-27
US5876789A (en) 1999-03-02
FR2741501A1 (fr) 1997-05-23

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20070731