FR2716329B1 - Feuille de cuivre pour carte de câblage imprimé et son procédé de fabrication. - Google Patents

Feuille de cuivre pour carte de câblage imprimé et son procédé de fabrication.

Info

Publication number
FR2716329B1
FR2716329B1 FR9412979A FR9412979A FR2716329B1 FR 2716329 B1 FR2716329 B1 FR 2716329B1 FR 9412979 A FR9412979 A FR 9412979A FR 9412979 A FR9412979 A FR 9412979A FR 2716329 B1 FR2716329 B1 FR 2716329B1
Authority
FR
France
Prior art keywords
manufacturing process
wiring board
copper foil
printed wiring
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9412979A
Other languages
English (en)
Other versions
FR2716329A1 (fr
Inventor
Hiroaki Tsuyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of FR2716329A1 publication Critical patent/FR2716329A1/fr
Application granted granted Critical
Publication of FR2716329B1 publication Critical patent/FR2716329B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
FR9412979A 1994-02-15 1994-10-28 Feuille de cuivre pour carte de câblage imprimé et son procédé de fabrication. Expired - Fee Related FR2716329B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03931794A JP3292774B2 (ja) 1994-02-15 1994-02-15 プリント配線板用銅箔およびその製造方法

Publications (2)

Publication Number Publication Date
FR2716329A1 FR2716329A1 (fr) 1995-08-18
FR2716329B1 true FR2716329B1 (fr) 1996-08-14

Family

ID=12549739

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9412979A Expired - Fee Related FR2716329B1 (fr) 1994-02-15 1994-10-28 Feuille de cuivre pour carte de câblage imprimé et son procédé de fabrication.

Country Status (4)

Country Link
JP (1) JP3292774B2 (fr)
FR (1) FR2716329B1 (fr)
MY (1) MY113830A (fr)
TW (1) TW231396B (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3142259B2 (ja) * 1998-11-30 2001-03-07 三井金属鉱業株式会社 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法
US6579568B2 (en) 1999-11-29 2003-06-17 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP2001177204A (ja) * 1999-12-15 2001-06-29 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔の製造方法
JP3670186B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3670185B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3661763B2 (ja) * 2000-01-28 2005-06-22 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3306404B2 (ja) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板
JP3743702B2 (ja) 2000-04-28 2006-02-08 三井金属鉱業株式会社 プリント配線板のセミアディティブ製造法
JP4379854B2 (ja) 2001-10-30 2009-12-09 日鉱金属株式会社 表面処理銅箔
WO2003096776A1 (fr) * 2002-05-13 2003-11-20 Mitsui Mining & Smelting Co.,Ltd. Carte imprimee souple pour puce montee sur bande
JP5116943B2 (ja) * 2003-02-04 2013-01-09 古河電気工業株式会社 高周波回路用銅箔及びその製造方法
US7156904B2 (en) * 2003-04-30 2007-01-02 Mec Company Ltd. Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
US7029761B2 (en) * 2003-04-30 2006-04-18 Mec Company Ltd. Bonding layer for bonding resin on copper surface
JP2006222185A (ja) * 2005-02-09 2006-08-24 Furukawa Circuit Foil Kk ポリイミド系フレキシブル銅張積層板用銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板
JP4683646B2 (ja) * 2006-03-31 2011-05-18 Ｊｘ日鉱日石金属株式会社 プリント配線基板用銅又は銅合金箔
JP5024930B2 (ja) * 2006-10-31 2012-09-12 三井金属鉱業株式会社 表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法
JP5474316B2 (ja) * 2008-05-30 2014-04-16 三井金属鉱業株式会社 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板
JP2011162860A (ja) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The 表面粗化銅箔とその製造方法及び銅張積層板
WO2011105318A1 (fr) * 2010-02-24 2011-09-01 Jx日鉱日石金属株式会社 Feuille de cuivre pour circuits imprimés et stratifié plaqué de cuivre pour circuit imprimé
JP5685061B2 (ja) * 2010-11-19 2015-03-18 株式会社Ｓｈカッパープロダクツ プリント配線板用銅箔、及びプリント配線板
JP6030401B2 (ja) * 2012-10-12 2016-11-24 三井金属鉱業株式会社 表面処理銅箔の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856758B2 (ja) * 1975-12-17 1983-12-16 ミツイアナコンダドウハク カブシキガイシヤ ドウハクヒヨウメンシヨリホウホウ
JPS5515216A (en) * 1978-07-20 1980-02-02 Mitsui Anakonda Dohaku Kk Printed circut copper foil and method of manufacturing same
JPS5856758A (ja) * 1981-09-28 1983-04-04 Hitachi Ltd 大型工作物の自動芯出し装置
JPS5920621A (ja) * 1982-07-12 1984-02-02 Nippon Denkai Kk 印刷回路用銅箔とその製造方法
JPS61110794A (ja) * 1984-11-06 1986-05-29 Mitsui Mining & Smelting Co Ltd 銅箔の表面処理方法
JPS62216294A (ja) * 1986-03-17 1987-09-22 日本電解株式会社 プリント回路用銅箔の製造方法
JPH0226097A (ja) * 1988-07-15 1990-01-29 Nikko Guruude Fuoiru Kk プリント配線板用銅箔及びその製造方法
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
JPH04274389A (ja) * 1991-03-01 1992-09-30 Furukawa Saakitsuto Foil Kk プリント配線板用銅箔

Also Published As

Publication number Publication date
MY113830A (en) 2002-06-29
TW231396B (en) 1994-10-01
FR2716329A1 (fr) 1995-08-18
JPH07231161A (ja) 1995-08-29
JP3292774B2 (ja) 2002-06-17

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100630