FR2716329B1 - Feuille de cuivre pour carte de câblage imprimé et son procédé de fabrication. - Google Patents
Feuille de cuivre pour carte de câblage imprimé et son procédé de fabrication.Info
- Publication number
- FR2716329B1 FR2716329B1 FR9412979A FR9412979A FR2716329B1 FR 2716329 B1 FR2716329 B1 FR 2716329B1 FR 9412979 A FR9412979 A FR 9412979A FR 9412979 A FR9412979 A FR 9412979A FR 2716329 B1 FR2716329 B1 FR 2716329B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing process
- wiring board
- copper foil
- printed wiring
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03931794A JP3292774B2 (ja) | 1994-02-15 | 1994-02-15 | プリント配線板用銅箔およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2716329A1 FR2716329A1 (fr) | 1995-08-18 |
FR2716329B1 true FR2716329B1 (fr) | 1996-08-14 |
Family
ID=12549739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9412979A Expired - Fee Related FR2716329B1 (fr) | 1994-02-15 | 1994-10-28 | Feuille de cuivre pour carte de câblage imprimé et son procédé de fabrication. |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3292774B2 (fr) |
FR (1) | FR2716329B1 (fr) |
MY (1) | MY113830A (fr) |
TW (1) | TW231396B (fr) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3142259B2 (ja) * | 1998-11-30 | 2001-03-07 | 三井金属鉱業株式会社 | 耐薬品性および耐熱性に優れたプリント配線板用銅箔およびその製造方法 |
US6579568B2 (en) | 1999-11-29 | 2003-06-17 | Mitsui Mining & Smelting Co., Ltd. | Copper foil for printed wiring board having excellent chemical resistance and heat resistance |
JP2001177204A (ja) * | 1999-12-15 | 2001-06-29 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔及びその表面処理銅箔の製造方法 |
JP3306404B2 (ja) * | 2000-01-28 | 2002-07-24 | 三井金属鉱業株式会社 | 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板 |
JP3661763B2 (ja) * | 2000-01-28 | 2005-06-22 | 三井金属鉱業株式会社 | プリント配線板用表面処理銅箔の製造方法 |
JP3670185B2 (ja) * | 2000-01-28 | 2005-07-13 | 三井金属鉱業株式会社 | プリント配線板用表面処理銅箔の製造方法 |
JP3670186B2 (ja) * | 2000-01-28 | 2005-07-13 | 三井金属鉱業株式会社 | プリント配線板用表面処理銅箔の製造方法 |
JP3743702B2 (ja) | 2000-04-28 | 2006-02-08 | 三井金属鉱業株式会社 | プリント配線板のセミアディティブ製造法 |
JP4379854B2 (ja) | 2001-10-30 | 2009-12-09 | 日鉱金属株式会社 | 表面処理銅箔 |
US6984456B2 (en) | 2002-05-13 | 2006-01-10 | Mitsui Mining & Smelting Co., Ltd. | Flexible printed wiring board for chip-on flexibles |
JP5116943B2 (ja) * | 2003-02-04 | 2013-01-09 | 古河電気工業株式会社 | 高周波回路用銅箔及びその製造方法 |
US7029761B2 (en) * | 2003-04-30 | 2006-04-18 | Mec Company Ltd. | Bonding layer for bonding resin on copper surface |
US7156904B2 (en) * | 2003-04-30 | 2007-01-02 | Mec Company Ltd. | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby |
JP2006222185A (ja) * | 2005-02-09 | 2006-08-24 | Furukawa Circuit Foil Kk | ポリイミド系フレキシブル銅張積層板用銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板 |
JP4683646B2 (ja) * | 2006-03-31 | 2011-05-18 | Jx日鉱日石金属株式会社 | プリント配線基板用銅又は銅合金箔 |
JP5024930B2 (ja) * | 2006-10-31 | 2012-09-12 | 三井金属鉱業株式会社 | 表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法 |
JP5474316B2 (ja) * | 2008-05-30 | 2014-04-16 | 三井金属鉱業株式会社 | 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板 |
JP2011162860A (ja) * | 2010-02-12 | 2011-08-25 | Furukawa Electric Co Ltd:The | 表面粗化銅箔とその製造方法及び銅張積層板 |
KR101344176B1 (ko) * | 2010-02-24 | 2013-12-20 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 인쇄 회로 기판용 동박 및 인쇄 회로 기판용 동장 적층판 |
JP5685061B2 (ja) * | 2010-11-19 | 2015-03-18 | 株式会社Shカッパープロダクツ | プリント配線板用銅箔、及びプリント配線板 |
JP6030401B2 (ja) * | 2012-10-12 | 2016-11-24 | 三井金属鉱業株式会社 | 表面処理銅箔の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5856758B2 (ja) * | 1975-12-17 | 1983-12-16 | ミツイアナコンダドウハク カブシキガイシヤ | ドウハクヒヨウメンシヨリホウホウ |
JPS5515216A (en) * | 1978-07-20 | 1980-02-02 | Mitsui Anakonda Dohaku Kk | Printed circut copper foil and method of manufacturing same |
JPS5856758A (ja) * | 1981-09-28 | 1983-04-04 | Hitachi Ltd | 大型工作物の自動芯出し装置 |
JPS5920621A (ja) * | 1982-07-12 | 1984-02-02 | Nippon Denkai Kk | 印刷回路用銅箔とその製造方法 |
JPS61110794A (ja) * | 1984-11-06 | 1986-05-29 | Mitsui Mining & Smelting Co Ltd | 銅箔の表面処理方法 |
JPS62216294A (ja) * | 1986-03-17 | 1987-09-22 | 日本電解株式会社 | プリント回路用銅箔の製造方法 |
JPH0226097A (ja) * | 1988-07-15 | 1990-01-29 | Nikko Guruude Fuoiru Kk | プリント配線板用銅箔及びその製造方法 |
US5071520A (en) * | 1989-10-30 | 1991-12-10 | Olin Corporation | Method of treating metal foil to improve peel strength |
JPH04274389A (ja) * | 1991-03-01 | 1992-09-30 | Furukawa Saakitsuto Foil Kk | プリント配線板用銅箔 |
-
1994
- 1994-02-15 JP JP03931794A patent/JP3292774B2/ja not_active Expired - Fee Related
- 1994-02-22 TW TW083101482A patent/TW231396B/zh not_active IP Right Cessation
- 1994-10-28 FR FR9412979A patent/FR2716329B1/fr not_active Expired - Fee Related
- 1994-11-19 MY MYPI94003097A patent/MY113830A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW231396B (en) | 1994-10-01 |
JPH07231161A (ja) | 1995-08-29 |
MY113830A (en) | 2002-06-29 |
FR2716329A1 (fr) | 1995-08-18 |
JP3292774B2 (ja) | 2002-06-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100630 |