MY113830A - Copper foil for printed wiring board and its production method. - Google Patents

Copper foil for printed wiring board and its production method.

Info

Publication number
MY113830A
MY113830A MYPI94003097A MYPI19943097A MY113830A MY 113830 A MY113830 A MY 113830A MY PI94003097 A MYPI94003097 A MY PI94003097A MY PI19943097 A MYPI19943097 A MY PI19943097A MY 113830 A MY113830 A MY 113830A
Authority
MY
Malaysia
Prior art keywords
wiring board
printed wiring
copper foil
copper
production method
Prior art date
Application number
MYPI94003097A
Inventor
Tsuyoshi Hiroaki
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY113830A publication Critical patent/MY113830A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

THE PRESENT INVENTION PROVIDES A COPPER FOIL FOR A PRINTED WIRING BOARD, WHICH HAS HIGH HEAT RESISTANCE, HIGH CHEMICAL RESISTANCE AND HIGH BONDABILITY TO A SUBSTRATE FOR THE PRINTED WIRING BOARD, CHARACTERIZED IN THAT A TERNAY ALLOY LAYER OF COPPER-ZINC-TIN OR COPPER-ZINC-NICKEL IS PROVIDED ON A GRANULAR COPPER LAYER PROVIDED ON A SURFACE SIDE OF A COPPER FOIL TO BE BONDED TO A SUBSTRATE FOR A PRINTED WIRING BOARD. A CHROMATE RUST-PROOFING LAYER IS PROVIDED ON SAID TERNAY ALLOY LAYER, AND A RUST-PROOFING LAYER CONTAINING A SILANE COUPLING AGENT AND ACHROMIUM (VI) COMPOUND IS PROVIDED ON SAID CHROMATE RUST-PROOFING LAYER, AND ITS PRODUCTION METHOD.
MYPI94003097A 1994-02-15 1994-11-19 Copper foil for printed wiring board and its production method. MY113830A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03931794A JP3292774B2 (en) 1994-02-15 1994-02-15 Copper foil for printed wiring board and method for producing the same

Publications (1)

Publication Number Publication Date
MY113830A true MY113830A (en) 2002-06-29

Family

ID=12549739

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94003097A MY113830A (en) 1994-02-15 1994-11-19 Copper foil for printed wiring board and its production method.

Country Status (4)

Country Link
JP (1) JP3292774B2 (en)
FR (1) FR2716329B1 (en)
MY (1) MY113830A (en)
TW (1) TW231396B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3142259B2 (en) * 1998-11-30 2001-03-07 三井金属鉱業株式会社 Copper foil for printed wiring board excellent in chemical resistance and heat resistance and method for producing the same
US6579568B2 (en) 1999-11-29 2003-06-17 Mitsui Mining & Smelting Co., Ltd. Copper foil for printed wiring board having excellent chemical resistance and heat resistance
JP2001177204A (en) * 1999-12-15 2001-06-29 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil and method of manufacturing the same
JP3670186B2 (en) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 Method for producing surface-treated copper foil for printed wiring board
JP3670185B2 (en) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 Method for producing surface-treated copper foil for printed wiring board
JP3306404B2 (en) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 Method for producing surface-treated copper foil and copper-clad laminate using surface-treated copper foil obtained by the method
JP3661763B2 (en) * 2000-01-28 2005-06-22 三井金属鉱業株式会社 Method for producing surface-treated copper foil for printed wiring board
JP3743702B2 (en) 2000-04-28 2006-02-08 三井金属鉱業株式会社 Semi-additive manufacturing method for printed wiring boards
JP4379854B2 (en) 2001-10-30 2009-12-09 日鉱金属株式会社 Surface treated copper foil
US6984456B2 (en) 2002-05-13 2006-01-10 Mitsui Mining & Smelting Co., Ltd. Flexible printed wiring board for chip-on flexibles
JP5116943B2 (en) * 2003-02-04 2013-01-09 古河電気工業株式会社 Copper foil for high frequency circuit and manufacturing method thereof
US7029761B2 (en) * 2003-04-30 2006-04-18 Mec Company Ltd. Bonding layer for bonding resin on copper surface
US7156904B2 (en) * 2003-04-30 2007-01-02 Mec Company Ltd. Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
JP2006222185A (en) * 2005-02-09 2006-08-24 Furukawa Circuit Foil Kk Polyimide flexible copper clad laminate, copper foil therefor, and polyimide flexible printed wiring board
JP4683646B2 (en) * 2006-03-31 2011-05-18 Ｊｘ日鉱日石金属株式会社 Copper or copper alloy foil for printed circuit boards
JP5024930B2 (en) * 2006-10-31 2012-09-12 三井金属鉱業株式会社 Surface-treated copper foil, surface-treated copper foil with ultra-thin primer resin layer, method for producing the surface-treated copper foil, and method for producing surface-treated copper foil with an ultra-thin primer resin layer
JP5474316B2 (en) * 2008-05-30 2014-04-16 三井金属鉱業株式会社 Copper-clad laminate, surface-treated copper foil used for manufacturing the copper-clad laminate, and printed wiring board obtained using the copper-clad laminate
JP2011162860A (en) * 2010-02-12 2011-08-25 Furukawa Electric Co Ltd:The Surface-roughened copper foil, method of producing the same and copper-clad laminate plate
WO2011105318A1 (en) * 2010-02-24 2011-09-01 Jx日鉱日石金属株式会社 Copper foil for printed circuit board and copper-clad laminate for printed circuit board
JP5685061B2 (en) * 2010-11-19 2015-03-18 株式会社Ｓｈカッパープロダクツ Copper foil for printed wiring board and printed wiring board
JP6030401B2 (en) * 2012-10-12 2016-11-24 三井金属鉱業株式会社 Method for producing surface-treated copper foil

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856758B2 (en) * 1975-12-17 1983-12-16 ミツイアナコンダドウハク カブシキガイシヤ Douhakuhiyoumenshiyorihouhou
JPS5515216A (en) * 1978-07-20 1980-02-02 Mitsui Anakonda Dohaku Kk Printed circut copper foil and method of manufacturing same
JPS5856758A (en) * 1981-09-28 1983-04-04 Hitachi Ltd Automatic centering device for larger works
JPS5920621A (en) * 1982-07-12 1984-02-02 Nippon Denkai Kk Copper foil for printed circuit and manufacture thereof
JPS61110794A (en) * 1984-11-06 1986-05-29 Mitsui Mining & Smelting Co Ltd Surface treatment of copper foil
JPS62216294A (en) * 1986-03-17 1987-09-22 日本電解株式会社 Manufacture of printed circuit copper foil
JPH0226097A (en) * 1988-07-15 1990-01-29 Nikko Guruude Fuoiru Kk Copper foil for printed board and its manufacture
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
JPH04274389A (en) * 1991-03-01 1992-09-30 Furukawa Saakitsuto Foil Kk Copper foil for printed circuit board

Also Published As

Publication number Publication date
FR2716329B1 (en) 1996-08-14
TW231396B (en) 1994-10-01
FR2716329A1 (en) 1995-08-18
JPH07231161A (en) 1995-08-29
JP3292774B2 (en) 2002-06-17

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