KR960028736A - 프린트 기판 - Google Patents

프린트 기판 Download PDF

Info

Publication number
KR960028736A
KR960028736A KR1019950045150A KR19950045150A KR960028736A KR 960028736 A KR960028736 A KR 960028736A KR 1019950045150 A KR1019950045150 A KR 1019950045150A KR 19950045150 A KR19950045150 A KR 19950045150A KR 960028736 A KR960028736 A KR 960028736A
Authority
KR
South Korea
Prior art keywords
ground pattern
pattern region
circuit board
printed circuit
printed board
Prior art date
Application number
KR1019950045150A
Other languages
English (en)
Inventor
유지 코바야시
시니치로 야마시타
Original Assignee
오오가 노리오
소니 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오오가 노리오, 소니 주식회사 filed Critical 오오가 노리오
Publication of KR960028736A publication Critical patent/KR960028736A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Abstract

신호선 간의 크로스토크나 완충을 경감하는 프린트기판의 제공을 목적으로 한다. 인접하는 각 선로(1, 7, 8, 9)를 따라서 일정한 간격으로 그라운드 패턴영역(10, 12)및 다른 그라운드 패턴영역(3, 5)으로 도통하도록 설치된 바이어 홀(11)을 구비한 인접하는 각 선로(1, 7, 8, 9)를 차폐하도록 하므로서 인접하는 각 선로(1, 7, 8, 9)에 대해서 3차원적인 차폐를 실시할 수 있고, 이에 따라 각 선로(1, 7, 8, 9)간의 크로스토크나 완충을 경감할 수 있다.

Description

프린트 기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 프린트 기판의 한 실시예의 그라운드(ground)안전화시킨 4층 기판을 도시하는 측면도, 제2도는 본 발명의 프린트기판의 한 실시예의 그라운드 안전화시킨 4층을 도시하는 평면도, 제3도는 본발명의 프린트기판의 한 실시예의 그라운드 안전화시킨 6층 기판을 도시하는 측면도.

Claims (3)

  1. 복수의 정임피던스의 선로가 설치된 프린트기판에 있어서, 인접하는 각 선로간에 설치한 그라운트 패턴영역 및, 상기 그라운드 패턴 영역위에 각 선로에 따라서 일정한 간격으로 상기 그라운드 패턴영역 및 다른 그라운드 패턴영역에 도통하도록 설치된 바이어 홀을 구비하고, 상기 인접하는 각 선로를 차폐하도록 한것을 특징으로 하는 프린트기판.
  2. 제1항에 있어서, 상기 프린트기판은 2층기판이고, 상기 그라운드 패턴영역 및 상기 다른 그라운드 패턴영역은 다른층에 설치되어 있는 것을 특징으로 하는 프린트기판.
  3. 제1항에 있어서, 상기 프린트기판은 다층기판이고 상기 그라운드 패턴영역 및 상기 다른 그라운드 패턴영역은 다른층에 설치되어 있음과 함께 다른 그라운드 패턴영역은 서로 다른층에 복수로 설치되어 있는 것을 특징으로 하는 프린트기판.
KR1019950045150A 1994-12-07 1995-11-30 프린트 기판 KR960028736A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30388694 1994-12-07
JP94-303886 1994-12-07

Publications (1)

Publication Number Publication Date
KR960028736A true KR960028736A (ko) 1996-07-22

Family

ID=17926459

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950045150A KR960028736A (ko) 1994-12-07 1995-11-30 프린트 기판

Country Status (2)

Country Link
US (1) US6040524A (ko)
KR (1) KR960028736A (ko)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6204453B1 (en) * 1998-12-02 2001-03-20 International Business Machines Corporation Two signal one power plane circuit board
KR100700235B1 (ko) * 1998-09-10 2007-03-26 지멘스 악티엔게젤샤프트 다극성 플러그-인 커넥터를 가진 인쇄회로기판
US6175087B1 (en) * 1998-12-02 2001-01-16 International Business Machines Corporation Composite laminate circuit structure and method of forming the same
SE516087C2 (sv) * 1999-02-02 2001-11-19 Ericsson Telefon Ab L M Anordning vid ledningsbärare och förfaranden för tillverkning av sådana ledningsbärare
JP2000307452A (ja) * 1999-02-16 2000-11-02 Murata Mfg Co Ltd 高周波複合部品及びそれを用いた携帯無線機
US6553555B1 (en) * 1999-08-27 2003-04-22 Dell Products L.P. Maintaining signal guard bands when routing through a field of obstacles
US6586682B2 (en) * 2000-02-23 2003-07-01 Kulicke & Soffa Holdings, Inc. Printed wiring board with controlled line impedance
US7170361B1 (en) * 2000-04-13 2007-01-30 Micron Technology, Inc. Method and apparatus of interposing voltage reference traces between signal traces in semiconductor devices
US6683260B2 (en) * 2000-07-04 2004-01-27 Matsushita Electric Industrial Co., Ltd. Multilayer wiring board embedded with transmission line conductor
JP3565768B2 (ja) * 2000-07-27 2004-09-15 ソニーケミカル株式会社 配線基板
US7088002B2 (en) * 2000-12-18 2006-08-08 Intel Corporation Interconnect
US7397320B1 (en) 2001-05-16 2008-07-08 Cadence Design Systems, Inc. Non-uniform transmission line for reducing cross-talk from an aggressor transmission line
US8847696B2 (en) * 2002-03-18 2014-09-30 Qualcomm Incorporated Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric
US7145411B1 (en) * 2002-03-18 2006-12-05 Applied Micro Circuits Corporation Flexible differential interconnect cable with isolated high frequency electrical transmission line
US7336139B2 (en) * 2002-03-18 2008-02-26 Applied Micro Circuits Corporation Flexible interconnect cable with grounded coplanar waveguide
JP3920237B2 (ja) * 2002-04-04 2007-05-30 セイコーエプソン株式会社 プリント配線基板
US7209368B2 (en) * 2003-01-30 2007-04-24 Endicott Interconnect Technologies, Inc. Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making
US7096450B2 (en) * 2003-06-28 2006-08-22 International Business Machines Corporation Enhancement of performance of a conductive wire in a multilayered substrate
JP4259311B2 (ja) * 2003-12-19 2009-04-30 株式会社日立製作所 多層配線基板
JP2005223127A (ja) * 2004-02-05 2005-08-18 Sharp Corp 平行導体板伝送路
US7470864B2 (en) * 2004-03-02 2008-12-30 Via Technologies, Inc. Multi-conducting through hole structure
US7478472B2 (en) * 2004-03-03 2009-01-20 Endicott Interconnect Technologies, Inc. Method of making circuitized substrate with signal wire shielding
US7679005B2 (en) * 2005-03-23 2010-03-16 Endicott Interconnect Technologies, Inc. Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same
US7609125B2 (en) * 2006-10-13 2009-10-27 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. System, device and method for reducing cross-talk in differential signal conductor pairs
KR100779431B1 (ko) * 2007-07-19 2007-11-26 브로콜리 주식회사 전자파 차폐기능을 갖는 평면 균일 전송선로
FR2919131B1 (fr) * 2007-07-20 2011-03-11 Excem Procede et dispositif pour les transmissions pseudo-differentielles
KR101120508B1 (ko) * 2007-08-22 2012-02-29 (주) 와이팜 간섭 현상을 줄이기 위한 레이아웃 구조
US7812694B2 (en) * 2008-04-03 2010-10-12 International Business Machines Corporation Coplanar waveguide integrated circuits having arrays of shield conductors connected by bridging conductors
US8028406B2 (en) * 2008-04-03 2011-10-04 International Business Machines Corporation Methods of fabricating coplanar waveguide structures
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
KR100949508B1 (ko) * 2008-04-24 2010-03-24 엘지디스플레이 주식회사 무선 광역 네트워크 노이즈 감소를 위한 인쇄 회로 기판
CN101686599B (zh) * 2008-09-24 2011-08-10 欣兴电子股份有限公司 线路板的线路结构及其制作方法
US8378759B2 (en) * 2009-01-16 2013-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. First and second coplanar microstrip lines separated by rows of vias for reducing cross-talk there between
JP2010272318A (ja) * 2009-05-20 2010-12-02 Fujitsu Component Ltd コネクタ
FR2950760B1 (fr) * 2009-09-28 2012-02-10 Excem Procede de transmission utilisant une interconnexion non uniforme
FR2950761B1 (fr) * 2009-09-28 2012-02-10 Excem Procede de transmission pseudo-differentiel utilisant une interconnexion non uniforme
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
JP5762119B2 (ja) * 2011-05-06 2015-08-12 日東電工株式会社 回路付きサスペンション基板およびその製造方法
US8918991B2 (en) * 2011-11-04 2014-12-30 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Process for providing electrical connections with reduced via capacitance on circuit boards
US9035197B2 (en) 2011-11-04 2015-05-19 International Business Machines Corporation Circuit boards with vias exhibiting reduced via capacitance
US9131602B2 (en) * 2012-02-24 2015-09-08 Mediatek Inc. Printed circuit board for mobile platforms
EP2667690B1 (en) * 2012-05-23 2019-09-11 Tyco Electronics Belgium EC BVBA Three-dimensional circuit board
US9622339B2 (en) * 2012-09-11 2017-04-11 Intel Corporation Routing design for high speed input/output links
TWI578856B (zh) * 2013-06-19 2017-04-11 Adv Flexible Circuits Co Ltd Anti - Attenuation Control Structure of High Frequency Signal Transmission Line on Flexible Circuit Board
US9651585B2 (en) * 2013-12-18 2017-05-16 National Instruments Corporation Via layout techniques for improved low current measurements
US9647310B2 (en) * 2014-03-04 2017-05-09 Raytheon Company Coplanar waveguide transmission line structure configured into non-linear paths to define inductors which inhibit unwanted signals and pass desired signals
JP6272173B2 (ja) 2014-07-31 2018-01-31 京セラ株式会社 配線基板
US9537197B2 (en) * 2014-12-03 2017-01-03 Qualcomm Incorporated Transmission line implementation in wafer-level packaging
US20170085243A1 (en) * 2015-09-21 2017-03-23 Intel Corporation Impedance matching interconnect
US20170093005A1 (en) * 2015-09-24 2017-03-30 Qualcomm Incorporated High-density stacked grounded coplanar waveguides
TWI576019B (zh) * 2015-11-27 2017-03-21 中原大學 印刷電路板
CN209329126U (zh) * 2016-05-17 2019-08-30 株式会社村田制作所 传输线路基板及电子设备
CN110915314B (zh) 2017-05-15 2021-08-13 申泰公司 具有共同化接地板的印刷电路板
JP7368932B2 (ja) * 2017-12-28 2023-10-25 日本ルメンタム株式会社 光モジュール及び光伝送装置
CN108901125A (zh) * 2018-08-20 2018-11-27 索尔思光电（成都）有限公司 一种印制线路板、光收发组件及光模块
KR102457122B1 (ko) * 2020-12-03 2022-10-20 주식회사 기가레인 다중 신호 전송용 연성회로기판
US20230030534A1 (en) * 2021-07-28 2023-02-02 Dell Products L.P. Guard trace ground via optimization for high-speed signaling

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3613230A (en) * 1969-04-29 1971-10-19 Bunker Ramo Method of fabricating coaxial circuitry
GB1589519A (en) * 1976-11-19 1981-05-13 Solartron Electronic Group Printed circuits
GB2060266B (en) * 1979-10-05 1984-05-31 Borrill P L Multilayer printed circuit board
US4798918A (en) * 1987-09-21 1989-01-17 Intel Corporation High density flexible circuit
US5003273A (en) * 1989-12-04 1991-03-26 Itt Corporation Multilayer printed circuit board with pseudo-coaxial transmission lines
JPH0770837B2 (ja) * 1992-05-20 1995-07-31 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層配線を有する電子パッケージ基板及び方法
US5272600A (en) * 1992-09-02 1993-12-21 Microelectronics And Computer Technology Corporation Electrical interconnect device with interwoven power and ground lines and capacitive vias
JPH06169175A (ja) * 1992-11-30 1994-06-14 Nec Corp 多層印刷配線板及びその製造方法
US5275330A (en) * 1993-04-12 1994-01-04 International Business Machines Corp. Solder ball connect pad-on-via assembly process
JP3355353B2 (ja) * 1993-08-20 2002-12-09 ケル株式会社 電気コネクタ

Also Published As

Publication number Publication date
US6040524A (en) 2000-03-21

Similar Documents

Publication Publication Date Title
KR960028736A (ko) 프린트 기판
KR900007859Y1 (ko) 시일드구조
US5038252A (en) Printed circuit boards with improved electrical current control
EP0028657A4 (en) MULTI-LAYER HOLLOW PRINTED CIRCUIT MOUNTING PANEL AND MANUFACTURING METHOD THEREOF.
KR900001002A (ko) 반도체집적회로
EP0817548A4 (en) PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
US5955704A (en) Optimal PWA high density routing to minimize EMI substrate coupling in a computer system
US5220135A (en) Printed wiring board having shielding layer
JPH08242078A (ja) プリント基板
US5416667A (en) Printed wiring board having an electromagnetic wave shielding layer
JPH0684913A (ja) 半導体集積回路
JPS61161797A (ja) 多層プリント板
JPH0548272A (ja) プリント配線板
KR20060029457A (ko) 4층 인쇄회로기판
JPH0534139Y2 (ko)
JPH0593068U (ja) プリント基板のクロストーク防止装置
KR890003269A (ko) 다층패턴을 가진 플렉시블 프린트배선판 및 그 제조방법
JPH0325993A (ja) プリント配線基板
KR970073245A (ko) 인쇄회로기판(a print circuit board)
JPH11261237A (ja) 多層プリント基板
JPH04336494A (ja) 積層プリント回路基板
JPS58124297A (ja) 多層プリント配線基板
JPH01174970U (ko)
JPS6484786A (en) Multilayer printed wiring board
JPS60254794A (ja) 多層プリント板

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid