KR960020464A - 지지 필러, 금속화 지지 필러 및 마이크로미러 장치의 제조 방법 - Google Patents

지지 필러, 금속화 지지 필러 및 마이크로미러 장치의 제조 방법 Download PDF

Info

Publication number
KR960020464A
KR960020464A KR1019950039178A KR19950039178A KR960020464A KR 960020464 A KR960020464 A KR 960020464A KR 1019950039178 A KR1019950039178 A KR 1019950039178A KR 19950039178 A KR19950039178 A KR 19950039178A KR 960020464 A KR960020464 A KR 960020464A
Authority
KR
South Korea
Prior art keywords
filler
support pillar
filler material
spacer layer
depositing
Prior art date
Application number
KR1019950039178A
Other languages
English (en)
Inventor
제이. 호른벡 래리
Original Assignee
윌리엄 이. 힐러
텍사스 인스트루먼츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윌리엄 이. 힐러, 텍사스 인스트루먼츠 인코포레이티드 filed Critical 윌리엄 이. 힐러
Publication of KR960020464A publication Critical patent/KR960020464A/ko

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K15/00—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers
    • G06K15/02—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers
    • G06K15/12—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers
    • G06K15/1238—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point
    • G06K15/1242—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point on one main scanning line
    • G06K15/1252—Arrangements for producing a permanent visual presentation of the output data, e.g. computer output printers using printers by photographic printing, e.g. by laser printers simultaneously exposing more than one point on one main scanning line using an array of light modulators, e.g. a linear array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/74—Projection arrangements for image reproduction, e.g. using eidophor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0361—Tips, pillars
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S359/00—Optical: systems and elements
    • Y10S359/904—Micromirror

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Transforming Electric Information Into Light Information (AREA)
  • Video Image Reproduction Devices For Color Tv Systems (AREA)

Abstract

마이크로기계 장치, 특히 디지탈 마이크로미러 장치와 사용하기 위한 지지 필러(408)는 기판(400)에 의해 지지되는 필러 물질(404)을 포함하고, 금속층(406)으로 덮혀진다. 지지 필러(408)는 기판(400)상의 필러 물질층을 증착시키고, 지지필러 (408)를 정의하도록 필러층을 패턴화시키고, 지지 필러(408)위에 금속층(406)을 증착시켜 지지 필러를 밀봉하므로써 제조된다. 필러 상부와 동일 평면인 평면은 필러 (408)위의 스페이서층(410)을 적용하므로써 생성될 수 있다. 스페이서층(410)을 적용한 후, 필러를 덮고 있는 스페이서 물질을 제거하기 위하여 스페이서층으로 구멍(414)이 패턴화된다. 그다음, 스페이서층은 구멍을 채우고 표면이 지지 필러(408)의 상부와 동인 평면에 있도록 스페이서 표면을 낮추기 위하여 리플로우된다.

Description

지지 필러, 금속화 지지 필러 및 마이크로미러 장치의 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4A 내지 4S도는 본 발명의 일실시예에 따라 지지대를 가지는 DMD 소자의 제조시 각종 단계를 보여주는 DMD 어레이의 한 소자의 힌지 축을 따라 취한 절개 측단면을 도시한 도면,
제5도는 제4C도의 힌지 지지 필러의 금속 단계의 적용범위를 보여주는 절개 측단면을 도시한 도면,
제6도는 본 발명의 일실시예에 따라 개선된 지지대를 가지는 전형적인 토션빔 DMD의 일부의 투시도.

Claims (12)

  1. 기판상에 필러 물질을 증착시키는 단계와; 상기 필러 물질을 패턴화시켜 지지 필러를 정의하는 단계와; 상기 지지 필러위에 금속층을 증착시키므로써, 상기 지지 필러가 상기 금속층에 의해 밀봉되어 금속화 지지 필러를 형성하는 단계와; 상기 금속화 지지 필러 주위에 스페이서층을 증착시키는 단계와; 상기 금속화 지지 필러의 주위 및 최상단부상의 상기 스페이서층의 일부를 제거하는 단계와; 상기 제2스페이서층과 상기 금속화 지지 필러 간의 갭을 채우기 위하여 상기 스페이서층을 리플로우(reflow)시키는 단계를 포함하는 금속화 지지 필러를 제조하는 방법.
  2. 제1항에 있어서, 상기 필러 물질은 유기 포토레지스트인 금속화 지지 필러를 제조하는 방법.
  3. 제1항에 있어서, 상기 필러 물질은 포토레지스트이고, 상기 방법은 상기 필러 물질을 딥(deep) UV 경화시키는 단계를 더 포함하는 금속화 지지 필러를 제조하는 방법.
  4. 제1항에 있어서, 상기 스페이서층은 유기 포토레지스트인 금속화 지지 필러를 제조하는 방법.
  5. 제1항에 있어서, 필러 물질을 증착시키는 상기 단계는 유기 포토레지스트층상에 스퍼닝하는 단계를 포함하는 금속화 지지 필러를 제조하는 방법.
  6. 제1항에 있어서, 스페이서층을 증착시키는 상기 단계는 유기 포토레지스트층상에 스피닝하는 단계를 포함하는 금속화 지지 필러를 제조하는 방법.
  7. 제1항에 있어서, 상기 패턴화 단계는 상기 지지 필러를 남기기 위하여 상기 필러 물질을 부분적으로 제거하는 단계를 포함하는 금속화 지지 필러를 제조하는 방법.
  8. 제1항에 있어서, 금속층을 증착시키는 상기 단계는 상기 지지 필러위에 알루미늄 합금을 스퍼터링하는 단계를 포함하는 금속화 지지 필러를 제조하는 방법.
  9. 제1항에 있어서, 상기 리플로우 단계는 상기 스페이서층을 가열시키는 단계를 포함하는 금속화 지지 필러를 제조하는 방법.
  10. 기판상에 필러 물질을 증착 및 패턴화시켜 적어도 하나의 지지 필러를 정의하는 단계와; 상기 지지 필러상에 제1금속층을 증착시켜 금속화 지지 필러를 형성하는 단계와; 상기 기판상에 스페이서층을 증착시키는 단계와; 상기 금속화 지지 필러주위 및 최상단부로부터 상기 스페이서층의 일부를 제거하는 단계와; 상기 스폐이서와 상기 금속화 지지 필러 간의 갭을 채우기 위하여 상기 스페이서층을 리플로우시키는 단계와; 상기 스페이서층 및 상기 금속화 지지 필러 위에 적어도 하나의 부가적인 금속층을 증착시키고, 상기 적어도 하나의 부가적인 금속층은 적어도 하나의 힌지와, 상기 지지 필러로부터 상기 힌지에 의해 매달린 적어도 하나의 미러를 형성하는 단계와; 상기 힌지 및 상기 미러 아래에 공기갭을 형성하기 위하여 상기 스페이서층 부분을 제거하는 단계를 포함하는 마이크로미러 장치를 제조하는 방법.
  11. 제10항에 있어서, 상기 필러 물질은 포토레지스트이고, 상기 방법은 상기 포토레지스트 필러 물질을 딥 UV 경화시키는 단계를 더 포함하는 마이크로미러 장치를 제조하는 방법.
  12. 마이크로기계 장치를 위한 지지 필러에 있어서; 기판과; 상기 기판에 의해 지지되며, 딥 UV 경화된 포토레지스트로부터 원하는 지지필러의 형태로 형성되는 필러 물질과; 상기 기판에 의해 적어도 부분적으로 지지되며, 상기 필러 물질위에 형성되는 금속층을 포함하는 지지 필러.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950039178A 1994-11-02 1995-11-01 지지 필러, 금속화 지지 필러 및 마이크로미러 장치의 제조 방법 KR960020464A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/333,186 1994-11-02
US08/333,186 US5650881A (en) 1994-11-02 1994-11-02 Support post architecture for micromechanical devices

Publications (1)

Publication Number Publication Date
KR960020464A true KR960020464A (ko) 1996-06-17

Family

ID=23301703

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950039178A KR960020464A (ko) 1994-11-02 1995-11-01 지지 필러, 금속화 지지 필러 및 마이크로미러 장치의 제조 방법

Country Status (3)

Country Link
US (3) US5650881A (ko)
JP (1) JPH08227043A (ko)
KR (1) KR960020464A (ko)

Families Citing this family (209)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6674562B1 (en) 1994-05-05 2004-01-06 Iridigm Display Corporation Interferometric modulation of radiation
US7808694B2 (en) * 1994-05-05 2010-10-05 Qualcomm Mems Technologies, Inc. Method and device for modulating light
US7776631B2 (en) * 1994-05-05 2010-08-17 Qualcomm Mems Technologies, Inc. MEMS device and method of forming a MEMS device
US7550794B2 (en) 2002-09-20 2009-06-23 Idc, Llc Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer
US7297471B1 (en) * 2003-04-15 2007-11-20 Idc, Llc Method for manufacturing an array of interferometric modulators
US7852545B2 (en) 1994-05-05 2010-12-14 Qualcomm Mems Technologies, Inc. Method and device for modulating light
US8014059B2 (en) 1994-05-05 2011-09-06 Qualcomm Mems Technologies, Inc. System and method for charge control in a MEMS device
US7898722B2 (en) 1995-05-01 2011-03-01 Qualcomm Mems Technologies, Inc. Microelectromechanical device with restoring electrode
US6969635B2 (en) * 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
DE19536250A1 (de) * 1995-09-28 1997-04-03 Siemens Ag Mikroelektronischer, integrierter Sensor und Verfahren zur Herstellung des Sensors
US7907319B2 (en) 1995-11-06 2011-03-15 Qualcomm Mems Technologies, Inc. Method and device for modulating light with optical compensation
US7929197B2 (en) * 1996-11-05 2011-04-19 Qualcomm Mems Technologies, Inc. System and method for a MEMS device
US7830588B2 (en) * 1996-12-19 2010-11-09 Qualcomm Mems Technologies, Inc. Method of making a light modulating display device and associated transistor circuitry and structures thereof
US6034810A (en) * 1997-04-18 2000-03-07 Memsolutions, Inc. Field emission charge controlled mirror (FEA-CCM)
WO1999052006A2 (en) 1998-04-08 1999-10-14 Etalon, Inc. Interferometric modulation of radiation
US8928967B2 (en) 1998-04-08 2015-01-06 Qualcomm Mems Technologies, Inc. Method and device for modulating light
US6556318B1 (en) * 1998-07-20 2003-04-29 At&T Corp. Method and apparatus for signal and switch monitoring in an optical cross connect
US6028696A (en) * 1998-10-15 2000-02-22 Memsolutions, Inc. Charge controlled mirror with improved frame time utilization and method of addressing the same
US6031657A (en) * 1998-10-15 2000-02-29 Memsolutions, Inc. Membrane-actuated charge controlled mirror (CCM) projection display
US5991066A (en) * 1998-10-15 1999-11-23 Memsolutions, Inc. Membrane-actuated charge controlled mirror
US6038058A (en) * 1998-10-15 2000-03-14 Memsolutions, Inc. Grid-actuated charge controlled mirror and method of addressing the same
US6123985A (en) * 1998-10-28 2000-09-26 Solus Micro Technologies, Inc. Method of fabricating a membrane-actuated charge controlled mirror (CCM)
WO2003007049A1 (en) 1999-10-05 2003-01-23 Iridigm Display Corporation Photonic mems and structures
KR100708077B1 (ko) * 2000-05-01 2007-04-16 삼성전자주식회사 화상표시장치용 마이크로미러 디바이스
US6346776B1 (en) 2000-07-10 2002-02-12 Memsolutions, Inc. Field emission array (FEA) addressed deformable light valve modulator
WO2002010836A2 (en) 2000-07-27 2002-02-07 Holl Technologies, Inc. Flexureless magnetic micromirror assembly
US7012731B2 (en) * 2000-08-30 2006-03-14 Reflectivity, Inc Packaged micromirror array for a projection display
US6962771B1 (en) * 2000-10-13 2005-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Dual damascene process
US6433917B1 (en) * 2000-11-22 2002-08-13 Ball Semiconductor, Inc. Light modulation device and system
KR100716958B1 (ko) * 2000-11-30 2007-05-10 삼성전자주식회사 마이크로미러 액추에이터 제조방법
SE0100336L (sv) * 2001-02-05 2002-08-06 Micronic Laser Systems Ab Adresseringsmetod och apparat som använder densamma tekniskt område
US6944032B1 (en) * 2001-04-12 2005-09-13 Rockwell Collins Interconnect for flat panel displays
US20030025979A1 (en) * 2001-07-31 2003-02-06 Ball Semiconductor, Inc. Surface distortion compensated photolithography
US7023606B2 (en) * 2001-08-03 2006-04-04 Reflectivity, Inc Micromirror array for projection TV
KR100394020B1 (ko) * 2001-10-18 2003-08-09 엘지전자 주식회사 Ｄｍｄ 패널의 제조 방법
US7106491B2 (en) * 2001-12-28 2006-09-12 Texas Instruments Incorporated Split beam micromirror
US6437903B1 (en) * 2002-02-20 2002-08-20 Intel Corporation Light modulator with two mirror sets
US6574033B1 (en) 2002-02-27 2003-06-03 Iridigm Display Corporation Microelectromechanical systems device and method for fabricating same
US7468826B2 (en) * 2002-05-03 2008-12-23 Texas Instruments Incorporated Silicon mirrors having reduced hinge stress from temperature variations
US7781850B2 (en) 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
AU2003264977B2 (en) 2002-09-26 2009-03-26 Lg Electronics Inc. Optical disc, method and apparatus for managing a defective area on an optical disc of write once type
US7532551B2 (en) 2002-09-26 2009-05-12 Lg Electronics Inc. Method for managing defective area on write-once optical recording medium, and optical recording medium using the same
KR20040027259A (ko) 2002-09-26 2004-04-01 엘지전자 주식회사 1 회 기록 가능한 광디스크의 디펙트 영역 관리방법
KR20040028469A (ko) 2002-09-30 2004-04-03 엘지전자 주식회사 1 회 기록 가능한 광디스크의 디펙트 영역 관리방법
US7233550B2 (en) 2002-09-30 2007-06-19 Lg Electronics Inc. Write-once optical disc, and method and apparatus for recording management information on write-once optical disc
ATE462184T1 (de) 2002-12-11 2010-04-15 Lg Electronics Inc Überschreibverfahren und informationsaufzeichnungsverfahren für eine einmalig beschreibbare optische diskette
KR101008641B1 (ko) 2002-12-11 2011-01-17 엘지전자 주식회사 1회 기록가능한 광디스크에 있어서의 중첩기록 관리방법 및장치
US7355934B2 (en) 2003-01-27 2008-04-08 Lg Electronics Inc. Optical disc of write once type, method, and apparatus for managing defect information on the optical disc
US7372788B2 (en) 2003-01-14 2008-05-13 Lg Electronics Inc. Method for managing defective area on write-once optical recording medium, and optical recording medium using the same
TWI334595B (en) 2003-01-27 2010-12-11 Lg Electronics Inc Optical disc, method and apparatus for managing a defective area on an optical disc
US7042622B2 (en) * 2003-10-30 2006-05-09 Reflectivity, Inc Micromirror and post arrangements on substrates
US6903487B2 (en) * 2003-02-14 2005-06-07 Hewlett-Packard Development Company, L.P. Micro-mirror device with increased mirror tilt
US20040160799A1 (en) 2003-02-17 2004-08-19 Park Yong Cheol Write-once optical disc, and method and apparatus for allocating spare area on write-once optical disc
US7499383B2 (en) 2003-02-21 2009-03-03 Lg Electronics Inc. Write-once optical disc and method for managing spare area thereof
US7643390B2 (en) 2003-02-21 2010-01-05 Lg Electronics Inc. Write-once optical recording medium and defect management information management method thereof
US7188271B2 (en) 2003-02-25 2007-03-06 Lg Electronics Inc. Write-once optical disc, and method and apparatus for recording management information on write-once optical disc
TWI278851B (en) 2003-02-25 2007-04-11 Lg Electronics Inc Recording medium having data structure for managing at least a data area of the recording medium and recording and reproducing methods and apparatuses
TWI291168B (en) 2003-02-25 2007-12-11 Lg Electronics Inc Defect management method for optical recording medium and optical recording medium using the same
BRPI0318160B1 (pt) 2003-03-04 2016-05-31 Lg Electronics Inc método para gravação em meio de gravação óptica, aparelho para gravação em e reprodução de um meio de gravação óptica e meio de gravação óptica
TWI405196B (zh) 2003-03-13 2013-08-11 Lg Electronics Inc 光學記錄媒體及其缺陷區域管理方法及其裝置
EP1467057A2 (de) * 2003-04-11 2004-10-13 DaimlerChrysler AG Türraumüberwachungsvorrichtung zur Überwachung eines Türschwenkbereiches einer Kraftfahrzeugtüre
WO2004100155A1 (en) 2003-05-09 2004-11-18 Lg Electronics Inc. Recording medium having data structure for managing at least a data area of the recording medium and recording and reproducing methods and apparatuses
EP2068322A3 (en) 2003-05-09 2009-09-23 LG Electronics Inc. Write once optical disc, and method and apparatus for recovering disc management information from the write once optical disc
MXPA05012044A (es) 2003-05-09 2006-02-03 Lg Electronics Inc Disco optico de una sola escritura, metodo y aparato par recuperacion de informacion de administracion de disco del disco optico de una sola escritura.
KR20050119703A (ko) 2003-05-09 2005-12-21 엘지전자 주식회사 데이터영역을 관리하기 위한 데이터구조를 구비한기록매체와 기록재생 방법 및 장치
TW570896B (en) 2003-05-26 2004-01-11 Prime View Int Co Ltd A method for fabricating an interference display cell
JP2007524828A (ja) * 2003-06-20 2007-08-30 アイギス セミコンダクター インコーポレイテッド 熱光学フィルタ及びそれを用いた赤外線センサ
JP4533892B2 (ja) 2003-07-04 2010-09-01 エルジー エレクトロニクス インコーポレイティド 追記型光ディスクの上書きを管理する方法及び装置
BRPI0412556A (pt) 2003-07-14 2006-09-19 Lg Electronics Inc meio fìsico de gravação, método e aparelho para gravar informação de gerenciamento no mesmo
KR20050009031A (ko) 2003-07-15 2005-01-24 엘지전자 주식회사 1회 기록 가능한 광디스크 및 광디스크의 관리정보 기록방법
KR101014703B1 (ko) 2003-07-15 2011-02-21 엘지전자 주식회사 광디스크의 결함영역 관리방법 및 광디스크의 기록방법과기록재생장치
AU2004262242B2 (en) 2003-08-05 2008-07-17 Lg Electronics Inc. Write-once optical disc, and method and apparatus for recording/reproducing management information on/from optical disc
US7313065B2 (en) 2003-08-05 2007-12-25 Lg Electronics Inc. Write-once optical disc, and method and apparatus for recording/reproducing management information on/from optical disc
TWI251712B (en) * 2003-08-15 2006-03-21 Prime View Int Corp Ltd Interference display plate
TW593127B (en) * 2003-08-18 2004-06-21 Prime View Int Co Ltd Interference display plate and manufacturing method thereof
US20050082480A1 (en) * 2003-08-26 2005-04-21 Aegis Semiconductor, Inc. Infrared camera system
US7221827B2 (en) * 2003-09-08 2007-05-22 Aegis Semiconductor, Inc. Tunable dispersion compensator
EP1665261B1 (en) 2003-09-08 2013-11-27 LG Electronics Inc. Write-once optical disc, and method and apparatus for recording management information on the write-once optical disc
KR101049137B1 (ko) 2003-09-08 2011-07-15 엘지전자 주식회사 1회 기록가능한 광디스크, 및 1회 기록가능한광디스크상에서 관리 정보를 기록하는 방법 및 장치
JP4373441B2 (ja) 2003-09-08 2009-11-25 エルジー エレクトロニクス インコーポレイティド 追記型光ディスク及びその上に管理情報を記録するための方法
TW593126B (en) * 2003-09-30 2004-06-21 Prime View Int Co Ltd A structure of a micro electro mechanical system and manufacturing the same
US6914709B2 (en) * 2003-10-02 2005-07-05 Hewlett-Packard Development Company, L.P. MEMS device and method of forming MEMS device
US6861277B1 (en) 2003-10-02 2005-03-01 Hewlett-Packard Development Company, L.P. Method of forming MEMS device
WO2005036240A1 (en) * 2003-10-07 2005-04-21 Aegis Semiconductor, Inc. Tunable optical filter with heater on a cte-matched transparent substrate
KR100964685B1 (ko) 2003-10-20 2010-06-21 엘지전자 주식회사 1회 기록가능한 광디스크 및 광디스크의 기록재생방법과기록재생장치
US7307777B2 (en) * 2003-10-23 2007-12-11 Spatial Photonics, Inc. High-resolution spatial light modulation
JP2007510174A (ja) * 2003-10-27 2007-04-19 スペイシャル フォトニックス， インコーポレイテッド 高コントラストの空間光変調器および方法
US7471440B2 (en) * 2003-10-27 2008-12-30 Spatial Photonics, Inc. Fabricating micro devices using sacrificial materials
US7183618B2 (en) * 2004-08-14 2007-02-27 Fusao Ishii Hinge for micro-mirror devices
US7706050B2 (en) 2004-03-05 2010-04-27 Qualcomm Mems Technologies, Inc. Integrated modulator illumination
US7855824B2 (en) 2004-03-06 2010-12-21 Qualcomm Mems Technologies, Inc. Method and system for color optimization in a display
KR101024916B1 (ko) 2004-03-19 2011-03-31 엘지전자 주식회사 1회 기록 가능한 고밀도 광디스크의 데이터 기록 방법 및장치
KR101113866B1 (ko) 2004-03-19 2012-03-02 엘지전자 주식회사 기록매체내에 기록되는 데이터 구조 및 데이터 기록방법과기록장치
US7720148B2 (en) * 2004-03-26 2010-05-18 The Hong Kong University Of Science And Technology Efficient multi-frame motion estimation for video compression
US7164520B2 (en) 2004-05-12 2007-01-16 Idc, Llc Packaging for an interferometric modulator
KR101049117B1 (ko) 2004-06-08 2011-07-14 엘지전자 주식회사 1회 기록 가능한 광디스크 및 광디스크의 관리정보 기록방법, 디스크 클로징 방법 및 기록재생 장치
EP1810067B1 (en) * 2004-06-22 2016-11-02 BAE Systems PLC Improvements relating to deformable mirrors
KR101014727B1 (ko) * 2004-06-23 2011-02-16 엘지전자 주식회사 1회 기록 가능한 광디스크의 중첩 기록 방법 및 장치
KR101354520B1 (ko) 2004-07-29 2014-01-21 퀄컴 엠이엠에스 테크놀로지스, 인크. 간섭 변조기의 미소기전 동작을 위한 시스템 및 방법
KR101041811B1 (ko) 2004-08-02 2011-06-17 엘지전자 주식회사 광 저장매체의 기록 재생 방법 및 장치
KR101012378B1 (ko) 2004-08-16 2011-02-09 엘지전자 주식회사 광 저장매체의 기록 재생 방법 및 장치
US7889163B2 (en) 2004-08-27 2011-02-15 Qualcomm Mems Technologies, Inc. Drive method for MEMS devices
EP1789968A4 (en) 2004-09-14 2012-05-16 Lg Electronics Inc RECORDING MEDIUM, METHOD AND APPARATUS FOR RECORDING AND REPRODUCING DATA ON THIS MEDIUM
US7679627B2 (en) 2004-09-27 2010-03-16 Qualcomm Mems Technologies, Inc. Controller and driver features for bi-stable display
US7424198B2 (en) 2004-09-27 2008-09-09 Idc, Llc Method and device for packaging a substrate
US7372613B2 (en) 2004-09-27 2008-05-13 Idc, Llc Method and device for multistate interferometric light modulation
US7417783B2 (en) 2004-09-27 2008-08-26 Idc, Llc Mirror and mirror layer for optical modulator and method
US8008736B2 (en) 2004-09-27 2011-08-30 Qualcomm Mems Technologies, Inc. Analog interferometric modulator device
US7692839B2 (en) 2004-09-27 2010-04-06 Qualcomm Mems Technologies, Inc. System and method of providing MEMS device with anti-stiction coating
US8004504B2 (en) * 2004-09-27 2011-08-23 Qualcomm Mems Technologies, Inc. Reduced capacitance display element
US7583429B2 (en) 2004-09-27 2009-09-01 Idc, Llc Ornamental display device
US7944599B2 (en) 2004-09-27 2011-05-17 Qualcomm Mems Technologies, Inc. Electromechanical device with optical function separated from mechanical and electrical function
US7813026B2 (en) 2004-09-27 2010-10-12 Qualcomm Mems Technologies, Inc. System and method of reducing color shift in a display
US8878825B2 (en) 2004-09-27 2014-11-04 Qualcomm Mems Technologies, Inc. System and method for providing a variable refresh rate of an interferometric modulator display
US7701631B2 (en) 2004-09-27 2010-04-20 Qualcomm Mems Technologies, Inc. Device having patterned spacers for backplates and method of making the same
US7136213B2 (en) 2004-09-27 2006-11-14 Idc, Llc Interferometric modulators having charge persistence
US7710636B2 (en) * 2004-09-27 2010-05-04 Qualcomm Mems Technologies, Inc. Systems and methods using interferometric optical modulators and diffusers
US7355780B2 (en) 2004-09-27 2008-04-08 Idc, Llc System and method of illuminating interferometric modulators using backlighting
US7916103B2 (en) * 2004-09-27 2011-03-29 Qualcomm Mems Technologies, Inc. System and method for display device with end-of-life phenomena
US8310441B2 (en) 2004-09-27 2012-11-13 Qualcomm Mems Technologies, Inc. Method and system for writing data to MEMS display elements
US7420725B2 (en) 2004-09-27 2008-09-02 Idc, Llc Device having a conductive light absorbing mask and method for fabricating same
US7684104B2 (en) 2004-09-27 2010-03-23 Idc, Llc MEMS using filler material and method
US7843410B2 (en) 2004-09-27 2010-11-30 Qualcomm Mems Technologies, Inc. Method and device for electrically programmable display
US7936497B2 (en) 2004-09-27 2011-05-03 Qualcomm Mems Technologies, Inc. MEMS device having deformable membrane characterized by mechanical persistence
US7724993B2 (en) 2004-09-27 2010-05-25 Qualcomm Mems Technologies, Inc. MEMS switches with deforming membranes
US7675669B2 (en) 2004-09-27 2010-03-09 Qualcomm Mems Technologies, Inc. Method and system for driving interferometric modulators
US7653371B2 (en) 2004-09-27 2010-01-26 Qualcomm Mems Technologies, Inc. Selectable capacitance circuit
US7668415B2 (en) 2004-09-27 2010-02-23 Qualcomm Mems Technologies, Inc. Method and device for providing electronic circuitry on a backplate
US7446926B2 (en) * 2004-09-27 2008-11-04 Idc, Llc System and method of providing a regenerating protective coating in a MEMS device
US7719500B2 (en) 2004-09-27 2010-05-18 Qualcomm Mems Technologies, Inc. Reflective display pixels arranged in non-rectangular arrays
US7573547B2 (en) * 2004-09-27 2009-08-11 Idc, Llc System and method for protecting micro-structure of display array using spacers in gap within display device
US7369296B2 (en) 2004-09-27 2008-05-06 Idc, Llc Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator
US7920135B2 (en) 2004-09-27 2011-04-05 Qualcomm Mems Technologies, Inc. Method and system for driving a bi-stable display
US7289259B2 (en) 2004-09-27 2007-10-30 Idc, Llc Conductive bus structure for interferometric modulator array
US7532195B2 (en) 2004-09-27 2009-05-12 Idc, Llc Method and system for reducing power consumption in a display
US7893919B2 (en) 2004-09-27 2011-02-22 Qualcomm Mems Technologies, Inc. Display region architectures
US7808703B2 (en) 2004-09-27 2010-10-05 Qualcomm Mems Technologies, Inc. System and method for implementation of interferometric modulator displays
US8124434B2 (en) 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US7710629B2 (en) 2004-09-27 2010-05-04 Qualcomm Mems Technologies, Inc. System and method for display device with reinforcing substance
US20060076634A1 (en) 2004-09-27 2006-04-13 Lauren Palmateer Method and system for packaging MEMS devices with incorporated getter
US7184202B2 (en) * 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
US7038831B2 (en) * 2004-09-30 2006-05-02 Lucent Technologies, Inc. Micromirror apparatus with improved in-plane rotation tolerance
US7613874B2 (en) 2004-10-14 2009-11-03 Lg Electronics, Inc. Recording medium, and a method and apparatus for overwriting data in the same
US7920136B2 (en) 2005-05-05 2011-04-05 Qualcomm Mems Technologies, Inc. System and method of driving a MEMS display device
US7948457B2 (en) 2005-05-05 2011-05-24 Qualcomm Mems Technologies, Inc. Systems and methods of actuating MEMS display elements
KR20080027236A (ko) 2005-05-05 2008-03-26 콸콤 인코포레이티드 다이나믹 드라이버 ｉｃ 및 디스플레이 패널 구성
US8331010B2 (en) * 2005-05-23 2012-12-11 Silicon Quest Kabushiki-Kaisha Mirror device with flat and smooth mirror surface without protrusion or dip
EP2495212A3 (en) 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
KR101375337B1 (ko) * 2005-07-22 2014-03-18 퀄컴 엠이엠에스 테크놀로지스, 인크. 지지 구조물들을 가지는 전자기계 장치들 및 그 제조방법들
JP2009503565A (ja) * 2005-07-22 2009-01-29 クアルコム，インコーポレイテッド Ｍｅｍｓデバイスのための支持構造、およびその方法
US7139113B1 (en) * 2005-07-29 2006-11-21 Texas Instruments Incorporated Digital micro-mirror device with free standing spring tips and distributed address electrodes
US7374962B2 (en) * 2005-09-29 2008-05-20 Miradia Inc. Method of fabricating reflective spatial light modulator having high contrast ratio
US7630114B2 (en) * 2005-10-28 2009-12-08 Idc, Llc Diffusion barrier layer for MEMS devices
KR101227485B1 (ko) 2005-11-25 2013-01-29 엘지전자 주식회사 기록매체 및 기록매체의 결함관리 정보 기록방법과기록장치
KR20070058291A (ko) 2005-12-02 2007-06-08 엘지전자 주식회사 기록매체, 기록매체의 관리정보 기록방법 및 기록장치
US8391630B2 (en) 2005-12-22 2013-03-05 Qualcomm Mems Technologies, Inc. System and method for power reduction when decompressing video streams for interferometric modulator displays
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7916980B2 (en) 2006-01-13 2011-03-29 Qualcomm Mems Technologies, Inc. Interconnect structure for MEMS device
US7382515B2 (en) 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US8194056B2 (en) 2006-02-09 2012-06-05 Qualcomm Mems Technologies Inc. Method and system for writing data to MEMS display elements
US7450295B2 (en) 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
WO2007120887A2 (en) 2006-04-13 2007-10-25 Qualcomm Mems Technologies, Inc Packaging a mems device using a frame
US7903047B2 (en) 2006-04-17 2011-03-08 Qualcomm Mems Technologies, Inc. Mode indicator for interferometric modulator displays
US7711239B2 (en) 2006-04-19 2010-05-04 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing nanoparticles
US8049713B2 (en) 2006-04-24 2011-11-01 Qualcomm Mems Technologies, Inc. Power consumption optimized display update
US7321457B2 (en) 2006-06-01 2008-01-22 Qualcomm Incorporated Process and structure for fabrication of MEMS device having isolated edge posts
US7649671B2 (en) 2006-06-01 2010-01-19 Qualcomm Mems Technologies, Inc. Analog interferometric modulator device with electrostatic actuation and release
US7702192B2 (en) 2006-06-21 2010-04-20 Qualcomm Mems Technologies, Inc. Systems and methods for driving MEMS display
US7835061B2 (en) 2006-06-28 2010-11-16 Qualcomm Mems Technologies, Inc. Support structures for free-standing electromechanical devices
US7777715B2 (en) 2006-06-29 2010-08-17 Qualcomm Mems Technologies, Inc. Passive circuits for de-multiplexing display inputs
US7529015B2 (en) * 2006-06-29 2009-05-05 Texas Instruments Incorporated Hidden micromirror support structure
US7527998B2 (en) 2006-06-30 2009-05-05 Qualcomm Mems Technologies, Inc. Method of manufacturing MEMS devices providing air gap control
JP4327183B2 (ja) * 2006-07-31 2009-09-09 株式会社日立製作所 内燃機関の高圧燃料ポンプ制御装置
US7763546B2 (en) 2006-08-02 2010-07-27 Qualcomm Mems Technologies, Inc. Methods for reducing surface charges during the manufacture of microelectromechanical systems devices
US7391554B2 (en) * 2006-08-25 2008-06-24 Spatial Photonics, Inc. High fill-ratio mirror-based spatial light modulator
US7545552B2 (en) 2006-10-19 2009-06-09 Qualcomm Mems Technologies, Inc. Sacrificial spacer process and resultant structure for MEMS support structure
US20080123206A1 (en) * 2006-11-28 2008-05-29 Spatial Photonics, Inc. Simplified manufacturing process for micro mirrors
US7706042B2 (en) 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US7535621B2 (en) 2006-12-27 2009-05-19 Qualcomm Mems Technologies, Inc. Aluminum fluoride films for microelectromechanical system applications
US7733552B2 (en) * 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7625825B2 (en) 2007-06-14 2009-12-01 Qualcomm Mems Technologies, Inc. Method of patterning mechanical layer for MEMS structures
US7569488B2 (en) 2007-06-22 2009-08-04 Qualcomm Mems Technologies, Inc. Methods of making a MEMS device by monitoring a process parameter
US8068268B2 (en) 2007-07-03 2011-11-29 Qualcomm Mems Technologies, Inc. MEMS devices having improved uniformity and methods for making them
US20090040516A1 (en) * 2007-08-10 2009-02-12 Honeywell International Inc. Spectroscopic system
US8072402B2 (en) 2007-08-29 2011-12-06 Qualcomm Mems Technologies, Inc. Interferometric optical modulator with broadband reflection characteristics
US20090109515A1 (en) * 2007-10-30 2009-04-30 Spatial Photonics, Inc. Encapsulated spatial light modulator having large active area
US7863079B2 (en) 2008-02-05 2011-01-04 Qualcomm Mems Technologies, Inc. Methods of reducing CD loss in a microelectromechanical device
US7999257B2 (en) 2008-06-02 2011-08-16 Taiwan Semiconductor Manufacturing Company, Ltd. Process for eliminating delamination between amorphous silicon layers
US7851239B2 (en) 2008-06-05 2010-12-14 Qualcomm Mems Technologies, Inc. Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
JP2011528449A (ja) * 2008-07-15 2011-11-17 フサオ イシイ 凹凸のない平面ミラーを有するミラー素子
US8218286B2 (en) * 2008-11-12 2012-07-10 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS microphone with single polysilicon film
US8053336B2 (en) * 2008-11-12 2011-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method for reducing chip warpage
US8367516B2 (en) * 2009-01-14 2013-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. Laser bonding for stacking semiconductor substrates
US8736590B2 (en) 2009-03-27 2014-05-27 Qualcomm Mems Technologies, Inc. Low voltage driver scheme for interferometric modulators
US7864403B2 (en) 2009-03-27 2011-01-04 Qualcomm Mems Technologies, Inc. Post-release adjustment of interferometric modulator reflectivity
US8379392B2 (en) 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
US8547626B2 (en) * 2010-03-25 2013-10-01 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of shaping the same
JP2013524287A (ja) 2010-04-09 2013-06-17 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド 電気機械デバイスの機械層及びその形成方法
US9134527B2 (en) 2011-04-04 2015-09-15 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US8963159B2 (en) 2011-04-04 2015-02-24 Qualcomm Mems Technologies, Inc. Pixel via and methods of forming the same
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
JP6106970B2 (ja) * 2012-07-02 2017-04-05 株式会社ニコン 空間光変調器および露光装置
JP6446895B2 (ja) 2014-08-01 2019-01-09 セイコーエプソン株式会社 デジタル・マイクロミラー・デバイス、デジタル・マイクロミラー・デバイスの製造方法、及び電子機器
JP2016139015A (ja) * 2015-01-28 2016-08-04 セイコーエプソン株式会社 ミラーデバイス、ミラーデバイスの製造方法、及び画像表示装置
JP6613593B2 (ja) * 2015-04-01 2019-12-04 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
JP6492893B2 (ja) * 2015-04-01 2019-04-03 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
JP6519284B2 (ja) * 2015-04-01 2019-05-29 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、および電子機器
CN104966709B (zh) 2015-07-29 2017-11-03 恒劲科技股份有限公司 封装基板及其制作方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4441791A (en) * 1980-09-02 1984-04-10 Texas Instruments Incorporated Deformable mirror light modulator
US4710732A (en) * 1984-07-31 1987-12-01 Texas Instruments Incorporated Spatial light modulator and method
US5061049A (en) * 1984-08-31 1991-10-29 Texas Instruments Incorporated Spatial light modulator and method
US5025303A (en) * 1988-02-26 1991-06-18 Texas Instruments Incorporated Product of pillar alignment and formation process
US4954789A (en) * 1989-09-28 1990-09-04 Texas Instruments Incorporated Spatial light modulator
US5011580A (en) * 1989-10-24 1991-04-30 Microelectronics And Computer Technology Corporation Method of reworking an electrical multilayer interconnect
US5216537A (en) * 1990-06-29 1993-06-01 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5083857A (en) * 1990-06-29 1992-01-28 Texas Instruments Incorporated Multi-level deformable mirror device
US5514449A (en) * 1990-07-27 1996-05-07 Minnesota Mining And Manufacturing Company Multi-chip substrate
US5290396A (en) * 1991-06-06 1994-03-01 Lsi Logic Corporation Trench planarization techniques
US5288649A (en) * 1991-09-30 1994-02-22 Texas Instruments Incorporated Method for forming uncooled infrared detector
US5202785A (en) * 1991-12-20 1993-04-13 Texas Instruments Incorporated Method and device for steering light
US5233456A (en) * 1991-12-20 1993-08-03 Texas Instruments Incorporated Resonant mirror and method of manufacture
US5348619A (en) * 1992-09-03 1994-09-20 Texas Instruments Incorporated Metal selective polymer removal
JPH06301069A (ja) * 1993-03-23 1994-10-28 Daewoo Electron Co Ltd アクチュエーチドミラーアレーで用いるためのエレクトロディスプレーシブアクチュエータ
KR970003007B1 (ko) * 1993-05-21 1997-03-13 대우전자 주식회사 투사형 화상표시장치용 광로조절장치 및 그 구동방법
US5585956A (en) * 1993-07-31 1996-12-17 Daewoo Electronics Co, Ltd. Electrostrictive actuated mirror array
KR970003466B1 (ko) * 1993-09-28 1997-03-18 대우전자 주식회사 투사형 화상 표시 장치의 광로 조절 장치 제조 방법
US5436411A (en) * 1993-12-20 1995-07-25 Lsi Logic Corporation Fabrication of substrates for multi-chip modules
US5444566A (en) * 1994-03-07 1995-08-22 Texas Instruments Incorporated Optimized electronic operation of digital micromirror devices
US5485304A (en) * 1994-07-29 1996-01-16 Texas Instruments, Inc. Support posts for micro-mechanical devices
US5535047A (en) * 1995-04-18 1996-07-09 Texas Instruments Incorporated Active yoke hidden hinge digital micromirror device

Also Published As

Publication number Publication date
US5650881A (en) 1997-07-22
US6447126B1 (en) 2002-09-10
US5784212A (en) 1998-07-21
JPH08227043A (ja) 1996-09-03

Similar Documents

Publication Publication Date Title
KR960020464A (ko) 지지 필러, 금속화 지지 필러 및 마이크로미러 장치의 제조 방법
KR960020465A (ko) 지지 필러와 금속화 지지 필러, 마이크로미러 장치 및 변형가능한 미러 장치의 제조 방법
WO2001033621A3 (en) Methods for forming openings in a substrate and methods for creating assemblies
US6746819B1 (en) Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material
KR960002496A (ko) 마이크로-메카니컬 장치에 희생 스페이서를 제공하는 방법
KR920020776A (ko) 변형가능한 미러 셔터 디바이스 및 이의 제조 방법
WO2000033089A3 (en) Lithographic contact elements
KR960005747A (ko) 개선된 지지 포스트를 구비한 미소-기계 장치 및 그 제조 방법과, 디지탈 미소-미러 장치
KR960002599A (ko) 서브미크론 상호연결의 선택적 간극 충진을 위한 2단계 마스킹 방법
WO2004037711A3 (en) Processes for hermetically packaging wafer level microscopic structures
WO2006033852A3 (en) Structured surface using ablatable radiation sensitive material
DE10056716A1 (de) Mikrostrukturbauelement
KR970008372A (ko) 반도체장치의 미세 패턴 형성방법
JPS6242545A (ja) 半導体装置の製造方法
KR980005764A (ko) 2층 이상의 금속층을 패터닝하는 식각방법
KR970052268A (ko) 금속배선 형성 방법
JPH05243233A (ja) バンプの形成方法
KR970018413A (ko) 반도체장치의 다층배선 형성방법
KR970060606A (ko) 반도체소자의 미러면 코팅방법
KR970013214A (ko) 반도체 소자의 금속 배선 형성 방법
KR940016688A (ko) 반도체 장치의 금속배선 형성방법
KR970054538A (ko) T-형 게이트 형성방법
KR960002668A (ko) 다층구조 금속막 형성방법
KR960024681A (ko) 감광막 노광 방법
KR940016598A (ko) 폴리이미드를 이용한 비아콘택 형성방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
J201 Request for trial against refusal decision
J801 Dismissal of trial

Free format text: REJECTION OF TRIAL FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20040429

Effective date: 20041213