KR960013576A - 연마제입자의 회수방법 - Google Patents

연마제입자의 회수방법 Download PDF

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Publication number
KR960013576A
KR960013576A KR1019950034629A KR19950034629A KR960013576A KR 960013576 A KR960013576 A KR 960013576A KR 1019950034629 A KR1019950034629 A KR 1019950034629A KR 19950034629 A KR19950034629 A KR 19950034629A KR 960013576 A KR960013576 A KR 960013576A
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KR
South Korea
Prior art keywords
abrasive particles
abrasive
recovering
concentrate
colloidal silica
Prior art date
Application number
KR1019950034629A
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English (en)
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KR100354218B1 (ko
Inventor
요시히로 하야시
코이치 야베
테츠오 미즈니와
Original Assignee
타케토시 카즈오
쿠리타코교 가부시기가이샤
카네코 히사시
니혼덴키 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 타케토시 카즈오, 쿠리타코교 가부시기가이샤, 카네코 히사시, 니혼덴키 가부시기가이샤 filed Critical 타케토시 카즈오
Publication of KR960013576A publication Critical patent/KR960013576A/ko
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Publication of KR100354218B1 publication Critical patent/KR100354218B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
    • B01D61/14—Ultrafiltration; Microfiltration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
    • B01D61/14—Ultrafiltration; Microfiltration
    • B01D61/145—Ultrafiltration
    • B01D61/146—Ultrafiltration comprising multiple ultrafiltration steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
    • B01D61/14—Ultrafiltration; Microfiltration
    • B01D61/149—Multistep processes comprising different kinds of membrane processes selected from ultrafiltration or microfiltration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
    • C02F1/444—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis by ultrafiltration or microfiltration

Abstract

본 발명은, 간단한 방법에 의해, 사용한 연마제로부터 반도체기판에 상처를 발생시키는 물질, 연마력을 저하시키는 물질 및 불필요한 분산매를 제거하고, 사용가능한 콜로이드질실리카를 효율좋게 회수하는 방법에 있어서, 반도체의 연마에 사용한 콜로이드질실리카를 함유한 연마제(5)를 정밀여과장치(1)에 의해서 정밀여과함으로써, 농축액쪽에 조대불순물을 농축해서 제거하고, 그 투과액(6)을 한외여과장치(2)에 의해서 한외여과해서 농축해서, 그 농축액을 회수함으로써 콜로이드질실리카를 회수하는 것을 특징으로 한 것이다.

Description

연마제압자의 회수방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 실시예의 연마제입자의 회수방법의 계통도,
제2도는 제1도의 회수방법을 충간절연막의 평탄화폴리싱에 적용한 실시예를 표시한 계통도.

Claims (4)

  1. 반도체기판 혹은 그 위에 형성된 피막의 연마에 사용한 연마제의 현탁액으로부터 연마제 입자를 회수하는 방법에 있어서, 사용한 연마제의 현탄액을 정밀여과막을 사용해서 정밀여과함으로써 조대불순물을 농축액쪽에 농축해서 시스템밖으로 제거하고, 정밀여과의 투과액을 한외여과막을 사용해서 한외여과함으로써, 미세한 물질을 투과시켜서 제거하고, 연마제입자를 농축액쪽에 남겨서 농축하고, 그 농축액을 회수하는 것을 특징으로 하는 연마제압자의 회수방법.
  2. 제1항에 있어서, 한외여과의 농축액을 회수하고, 그것에 전해질염용액을 첨가하고, 다시 연마제로서 재이용하는 것을 특징으로 하는 연마제입자의 회수방법.
  3. 제1항에 있어서, 연마제입자의 입자직겨이 2nm~500nm인 것을 특징으로 하는 연마제입자의 회수방법.
  4. 제1항에 있어서, 연마제입자가 콜로이드질실리카인 것을 특징으로 하는 연마제입자의 회수방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950034629A 1994-10-14 1995-10-10 연마제입자의회수방법 KR100354218B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-249851 1994-10-14
JP6249851A JP2606156B2 (ja) 1994-10-14 1994-10-14 研磨剤粒子の回収方法

Publications (2)

Publication Number Publication Date
KR960013576A true KR960013576A (ko) 1996-05-22
KR100354218B1 KR100354218B1 (ko) 2002-11-08

Family

ID=17199137

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950034629A KR100354218B1 (ko) 1994-10-14 1995-10-10 연마제입자의회수방법

Country Status (3)

Country Link
US (1) US5647989A (ko)
JP (1) JP2606156B2 (ko)
KR (1) KR100354218B1 (ko)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6159858A (en) * 1995-07-04 2000-12-12 Fujitsu Limited Slurry containing manganese oxide and a fabrication process of a semiconductor device using such a slurry
JP3199159B2 (ja) * 1996-01-26 2001-08-13 信越半導体株式会社 油性スラリー廃液の再利用システム
JP3249373B2 (ja) * 1996-02-21 2002-01-21 信越半導体株式会社 水溶性スラリー廃液の再利用システム
TW407315B (en) * 1996-06-27 2000-10-01 Fujitsu Ltd Slurry using Mn oxide abrasives and a fabrication process of a semiconductor device using such a slurry
JP3341601B2 (ja) * 1996-10-18 2002-11-05 日本電気株式会社 研磨剤の回収再利用方法および装置
EP0849040A3 (en) * 1996-12-19 2000-03-01 Texas Instruments Incorporated Method of polishing
US6322600B1 (en) 1997-04-23 2001-11-27 Advanced Technology Materials, Inc. Planarization compositions and methods for removing interlayer dielectric films
DE59807250D1 (de) 1997-04-28 2003-03-27 Infineon Technologies Ag Verfahren zur behandlung von abwasser aus einem chemisch-mechanischen polierprozess in der chipfertigung
DE19743721A1 (de) * 1997-10-02 1999-04-08 Kempten Elektroschmelz Gmbh Verfahren zum Wiederaufarbeiten einer Schleifsuspension
EP1075675A1 (en) * 1998-04-30 2001-02-14 The Boc Group, Inc. Conductivity feedback control system for slurry blending
JP2002518150A (ja) * 1998-06-18 2002-06-25 ルーシッド トリートメント システムズ インコーポレイテッド ケミカルメカニカルプラナリゼーション用の研磨材の液体及びスラリー粒子の回収方法及び装置
JP2000006009A (ja) * 1998-06-25 2000-01-11 Speedfam Co Ltd 研磨装置
KR100308641B1 (ko) * 1998-09-07 2001-11-30 한신혁 슬러리순환공급장치
US6156659A (en) * 1998-11-19 2000-12-05 Chartered Semiconductor Manufacturing Ltd. Linear CMP tool design with closed loop slurry distribution
JP3426149B2 (ja) * 1998-12-25 2003-07-14 富士通株式会社 半導体製造における研磨廃液再利用方法及び再利用装置
FR2789998B1 (fr) * 1999-02-18 2005-10-07 Clariant France Sa Nouvelle composition de polissage mecano-chimique d'une couche en un materiau conducteur d'aluminium ou d'alliage d'aluminium
US6599836B1 (en) * 1999-04-09 2003-07-29 Micron Technology, Inc. Planarizing solutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6407000B1 (en) * 1999-04-09 2002-06-18 Micron Technology, Inc. Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
JP3708748B2 (ja) 1999-04-23 2005-10-19 松下電器産業株式会社 研磨剤の再生装置および研磨剤の再生方法
KR100347317B1 (ko) * 1999-06-04 2002-08-07 제일모직주식회사 반도체 소자 ｃｍｐ용 금속산화물 슬러리의 분산방법
US6866784B2 (en) * 2000-06-27 2005-03-15 Nymtech, Co., Ltd. Slurry recycling system and method for CMP apparatus
KR20020003704A (ko) * 2000-06-27 2002-01-15 장정훈 씨엠피 장치의 슬러리 재생모듈
JP4534241B2 (ja) * 2000-06-28 2010-09-01 栗田工業株式会社 研磨材の回収方法
JP4585100B2 (ja) * 2000-08-24 2010-11-24 日本化学工業株式会社 研磨使用済み液の再生方法
SG115439A1 (en) * 2001-12-28 2005-10-28 Jetsis Int Pte Ltd Method and apparatus for abrasive recycling and waste separation system
US6622745B1 (en) 2002-01-07 2003-09-23 Projex Ims, Inc. Fluid waster diversion system
TWI365491B (en) * 2003-12-24 2012-06-01 Kao Corp Composition for cleaning semiconductor device
ITRM20050329A1 (it) * 2005-06-24 2006-12-25 Guido Fragiacomo Procedimento per il trattamento di sospensioni abrasive esauste per il recupero delle loro componenti riciclabili e relativo impianto.
JP4796807B2 (ja) * 2005-09-06 2011-10-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの研磨方法
JP2007127544A (ja) * 2005-11-04 2007-05-24 Nomura Micro Sci Co Ltd 半導体用研磨スラリー中の異物検査方法
WO2007097046A1 (ja) * 2006-02-24 2007-08-30 Ihi Compressor And Machinery Co., Ltd. シリコン粒子の処理方法及び装置
KR100806975B1 (ko) * 2006-04-13 2008-02-25 조선대학교산학협력단 Ｃｍｐ후 폐슬러리를 이용한 슬러리 연마재의 제조방법 및이로 제조된 슬러리 연마재
JP5563765B2 (ja) * 2006-12-25 2014-07-30 日本碍子株式会社 排水処理システム及び排水処理方法
JP5163078B2 (ja) * 2007-11-29 2013-03-13 株式会社Ｓｕｍｃｏ 研磨装置とその方法
KR100985861B1 (ko) * 2008-09-24 2010-10-08 씨앤지하이테크 주식회사 반도체용 슬러리 공급장치 및 슬러리 공급방법
JP2010167551A (ja) * 2008-12-26 2010-08-05 Nomura Micro Sci Co Ltd 使用済みスラリーの再生方法
KR101070232B1 (ko) 2009-02-19 2011-10-06 노정호 실리콘 폐수 처리 장치 및 방법
DE102009044204A1 (de) * 2009-10-08 2011-04-28 Fab Service Gmbh Wiederaufbereitungsverfahren und Wiederaufbereitungsvorrichtung zur Wiederaufbereitung von Slurry-Abwasser aus einem Halbleiterbearbeitungs-prozess, insbesondere aus einem chemisch-mechanischen Polierprozess
US20120042575A1 (en) 2010-08-18 2012-02-23 Cabot Microelectronics Corporation Cmp slurry recycling system and methods
JP2012178418A (ja) * 2011-02-25 2012-09-13 Nomura Micro Sci Co Ltd 研磨剤の回収方法および研磨剤の回収装置
MY165019A (en) * 2011-03-31 2018-02-28 Hoya Corp Method of manufacturing a glass substrate for a magnetic disk and method of manufacturing a magnetic disk
WO2012151482A2 (en) 2011-05-04 2012-11-08 Cornell University Multiblock copolymer films, methods of making same, and uses thereof
CN102423871A (zh) * 2011-07-01 2012-04-25 上海华力微电子有限公司 一种抛光液的循环再利用方法
US8696404B2 (en) * 2011-12-21 2014-04-15 WD Media, LLC Systems for recycling slurry materials during polishing processes
WO2013099666A1 (ja) * 2011-12-27 2013-07-04 コニカミノルタ株式会社 研磨材分離方法及び再生研磨材
US9259668B2 (en) * 2012-02-17 2016-02-16 Jsr Corporation Cleaning method of immersion liquid, immersion liquid cleaning composition, and substrate
US9586306B2 (en) 2012-08-13 2017-03-07 Omax Corporation Method and apparatus for monitoring particle laden pneumatic abrasive flow in an abrasive fluid jet cutting system
US9649744B2 (en) 2013-07-30 2017-05-16 Omax Corporation Reducing small colloidal particle concentrations in feed and/or byproduct fluids in the context of waterjet processing
US9011204B2 (en) * 2013-07-30 2015-04-21 Omax Corporation Reducing small colloidal particle concentrations in feed and/or byproduct fluids in the context of waterjet processing
JP6172030B2 (ja) * 2014-04-03 2017-08-02 信越半導体株式会社 ワークの切断方法及び加工液
SG11201702400TA (en) * 2014-10-14 2017-04-27 Hoya Corp Method for manufacturing magnetic-disk substrate
JP6389449B2 (ja) * 2015-08-21 2018-09-12 信越半導体株式会社 研磨装置
CN109310955B (zh) 2016-04-28 2022-08-30 特拉波尔技术公司 用于静电分离的带电均孔材料
TWI641038B (zh) * 2016-08-02 2018-11-11 兆遠科技股份有限公司 拋光液供給系統
EP3541500B1 (en) 2016-11-17 2021-12-08 Shethji, Jayraj K. Isoporous self-assembled block copolymer films containing high molecular weight hydrophilic additives and methods of making the same
US11577366B2 (en) 2016-12-12 2023-02-14 Omax Corporation Recirculation of wet abrasive material in abrasive waterjet systems and related technology
SG11201907674WA (en) 2017-02-22 2019-09-27 Terapore Tech Inc Ligand bound mbp membranes, uses and method of manufacturing
MX2019013534A (es) 2017-05-12 2020-02-10 Terapore Tech Inc Estructuras de polimeros multibloque fluorados resistentes a productos quimicos, metodos de fabricacion y uso.
US11224987B1 (en) 2018-03-09 2022-01-18 Omax Corporation Abrasive-collecting container of a waterjet system and related technology
KR20200130387A (ko) 2018-03-12 2020-11-18 테라포어 테크놀로지스, 인코포레이티드 마크로보이드들을 갖는 이소포러스 메조포러스 비대칭 블록 코폴리머 재료들 및 이의 제조 방법
US11642754B2 (en) * 2018-08-30 2023-05-09 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry recycling for chemical mechanical polishing system
KR20210062702A (ko) * 2018-10-05 2021-05-31 테라포어 테크놀로지스, 인코포레이티드 전자 장치 생산을 위한 액체 또는 가스 여과 방법
CN110509173A (zh) * 2019-09-04 2019-11-29 天津中环领先材料技术有限公司 一种抛光液回收装置及其控制方法
CN112919477B (zh) * 2021-03-12 2023-11-03 成信实业股份有限公司 半导体废硅泥的二氧化硅再生方法
CN113289409A (zh) * 2021-07-05 2021-08-24 东莞市柯林奥环保科技有限公司 一种抛光液回收的过滤系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189987A (ja) * 1983-04-11 1984-10-27 Nec Corp シリコンウエ−ハ−研摩排水の循環利用方法
US4787980A (en) * 1986-10-01 1988-11-29 Monsanto Company Ultra pure water system monitoring
DE3884435T2 (de) * 1987-03-25 1994-02-17 Hitachi Ltd Verfahren zur Erzeugung hochreinen Wassers und Verfahren zur Verwendung dieses Wassers.
JP2647104B2 (ja) * 1987-11-24 1997-08-27 オルガノ株式会社 半導体ウエハーの製造工程より排出される排水の処理方法
US5061374A (en) * 1989-12-18 1991-10-29 Micron Technology, Inc. Reverse osmosis as final filter in ultrapure deionized water system
US5204001A (en) * 1991-10-09 1993-04-20 Zenon Environmental Inc. Membrane bioreactor system for treating synthetic metal-working fluids and oil-based products

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Publication number Publication date
JPH08115892A (ja) 1996-05-07
US5647989A (en) 1997-07-15
KR100354218B1 (ko) 2002-11-08
JP2606156B2 (ja) 1997-04-30

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