KR960005987A - 신호 전파 손실을 저감하기 위한 마이크로파 집적회로 수동소자 구조체 및 방법 - Google Patents

신호 전파 손실을 저감하기 위한 마이크로파 집적회로 수동소자 구조체 및 방법 Download PDF

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KR960005987A
KR960005987A KR1019950022666A KR19950022666A KR960005987A KR 960005987 A KR960005987 A KR 960005987A KR 1019950022666 A KR1019950022666 A KR 1019950022666A KR 19950022666 A KR19950022666 A KR 19950022666A KR 960005987 A KR960005987 A KR 960005987A
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passive element
substrate
metal layer
signal
microwave integrated
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KR100420893B1 (ko
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씨. 레이즈 아돌포
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빈센트 비. 인그라시아
모토로라 인코포레이티드
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Waveguides (AREA)

Abstract

마이크로파 집적회로의 수동소자 구조체 및 방법에 의해서 신호 전파 손실이 줄어든다. 하나의 방법에 있어서, 수동소자(1)는 실리콘 기판(14)위에 있는 절연층(12)을 가지고 있다. 금속층(16)은 신호선(18)을 포함하고 있고 접지면(20)은 절연층(12)위에 놓여지며, 금속층(16)의 적어도 일부분은 절연층(12)에 있는 적어도 하나의 개구(22,24)를 통해 기판과 접촉한다. 실리콘 기판(14)은 2,000Ω㎝이상의 저항을 가지며 수동소자는 500㎒이상의 주파수를 가진 신호를 양호하게 전달한다. 수동소자(10)에서의 신호손실은 최소화되는데 그 이유는 금속층(16)아래에 있는 기판(14)의 표면에 있는 전하 밀도가 현저히 감소되기 때문이다. 일예로서, 수동소자(10)는 동일 평면의 도파관 전송선이다.

Description

신호 전파 손실을 저감하기 위한 마이크로파 집적회로 수동소자 구조체 및 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예에 따른 마이크로파 집적회로의 수동소자의 단면도이다.

Claims (4)

  1. 실리콘 기판(14)위에 형성되며 신호를 전달하는 수동소자(10)을 가진 마이크로파 집적회로에 있어서, 상기 수동소자는 상기 위에 놓이며 제1개구(22)를 가진 절연층(12)과, 상기 절연층 위에 놓인 금속층(16)을 포함하고 있으며, 상기 금속층의 적어도 일부는 상기 제1개구를 통해 상기 기판과 접촉하는 것을 특징으로 하는 마이크로파 집적회로
  2. 제1항에 있어서, 상기 기판은 약 2,000Ω㎝이상의 저항을 가지는 것을 특징으로 하느는 마이크로파 집적회로
  3. 2,000Ω·㎝이상의 저항을 가진 실리콘 기판(14)위에 형성되며 신호를 전달하는 수동소자(10)를 포함하고 있는 마이크로파 집적회로에 있어서, 상기 신호는 500㎒상의 주파수이며, 상기 수동소자는 상기 기판 위에 놓이며 개구(22)를 갖고 있는 절연층(12)과, 상기 절연층 위에 놓인 금속층(16)을 포함하고 있으며, 상기금속층의 적어도 일부는 상기 개구를 통해 상기 기판과 접촉하는 것을 특징으로 하는 마이크로파 접적회로.
  4. 표면(72)를 가지 기판(64)위에 형성된 마이크로파 집적회로에서 전달된 신호의 전파손실을 저감하기 위한 방법에 있어서, 상기 신호는 500㎒이상의 주파수를 가지며, 상기 방법은 상기 신호를 전달하는 수동소자를 설치하는 단계에서, 상기 수동소자는 상기 기판의 상기 표면위에 놓여진 절연층(62)과 상기 절연층 위에 놓여진 금속층(66)을 포함하고 있는 상기 수동소자의 설치단계와, 상기 기판, 상기 절연층 및 상기 금속층에 대응하는 플랫 밴드 전압과 동일한 크기를 가진 상기 기판의 상기 표면과 상기 금속층 양단에 전압을 인가하는 단계를 포함하고 있는 것을 특징으로 하는 전파손실의 저감 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950022666A 1994-07-29 1995-07-28 신호전파손실을저감하기위한마이크로파집적회로수동소자구조체및방법 KR100420893B1 (ko)

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Application Number Priority Date Filing Date Title
US28244494A 1994-07-29 1994-07-29
US282,444 1994-07-29
US282444 1995-01-03
US367664 1995-01-03
US367,664 1995-01-03
US08/367,664 US5559359A (en) 1994-07-29 1995-01-03 Microwave integrated circuit passive element structure and method for reducing signal propagation losses

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KR960005987A true KR960005987A (ko) 1996-02-23
KR100420893B1 KR100420893B1 (ko) 2004-05-31

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