KR960005965A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

Info

Publication number
KR960005965A
KR960005965A KR1019950021276A KR19950021276A KR960005965A KR 960005965 A KR960005965 A KR 960005965A KR 1019950021276 A KR1019950021276 A KR 1019950021276A KR 19950021276 A KR19950021276 A KR 19950021276A KR 960005965 A KR960005965 A KR 960005965A
Authority
KR
South Korea
Prior art keywords
wiring board
semiconductor chip
resin
electrode
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019950021276A
Other languages
English (en)
Korean (ko)
Inventor
아끼오 스미야
이찌로 안죠
마사찌까 마스다
히로미찌 스즈끼
료 하루따
쥰이찌 아리따
Original Assignee
가나이 쯔또무
가부시끼가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나이 쯔또무, 가부시끼가이샤 히다찌세이사꾸쇼 filed Critical 가나이 쯔또무
Publication of KR960005965A publication Critical patent/KR960005965A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1019950021276A 1994-07-27 1995-07-20 반도체 장치 Withdrawn KR960005965A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6175606A JPH0846091A (ja) 1994-07-27 1994-07-27 ボールグリッドアレイ半導体装置
JP94-175606 1994-07-27

Publications (1)

Publication Number Publication Date
KR960005965A true KR960005965A (ko) 1996-02-23

Family

ID=15999040

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950021276A Withdrawn KR960005965A (ko) 1994-07-27 1995-07-20 반도체 장치

Country Status (3)

Country Link
JP (1) JPH0846091A (https=)
KR (1) KR960005965A (https=)
TW (1) TW296473B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237142A (ja) * 2000-02-22 2001-08-31 Shizuki Electric Co Inc フィルムコンデンサ及び樹脂成形部品
JP5213736B2 (ja) * 2009-01-29 2013-06-19 パナソニック株式会社 半導体装置
JP2010050488A (ja) * 2009-11-30 2010-03-04 Panasonic Corp 半導体装置およびその製造方法
CN102668042B (zh) * 2009-12-24 2015-06-24 株式会社村田制作所 电子元器件的制造方法
JP7682720B2 (ja) 2021-06-30 2025-05-26 キオクシア株式会社 半導体デバイス及び電子デバイス
JP2023156715A (ja) * 2022-04-13 2023-10-25 富士電機株式会社 半導体装置及び半導体装置の製造方法
WO2024177013A1 (ja) * 2023-02-20 2024-08-29 旭化成エレクトロニクス株式会社 半導体パッケージ、及びモジュール

Also Published As

Publication number Publication date
TW296473B (https=) 1997-01-21
JPH0846091A (ja) 1996-02-16

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000