JPH0846091A - ボールグリッドアレイ半導体装置 - Google Patents

ボールグリッドアレイ半導体装置

Info

Publication number
JPH0846091A
JPH0846091A JP6175606A JP17560694A JPH0846091A JP H0846091 A JPH0846091 A JP H0846091A JP 6175606 A JP6175606 A JP 6175606A JP 17560694 A JP17560694 A JP 17560694A JP H0846091 A JPH0846091 A JP H0846091A
Authority
JP
Japan
Prior art keywords
wiring board
semiconductor device
package
semiconductor chip
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6175606A
Other languages
English (en)
Japanese (ja)
Inventor
Akiro Sumiya
彰朗 角谷
Ichiro Anjo
一郎 安生
Masachika Masuda
正親 増田
Hiromichi Suzuki
博通 鈴木
Akira Haruta
亮 春田
Junichi Arita
順一 有田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6175606A priority Critical patent/JPH0846091A/ja
Priority to TW084107217A priority patent/TW296473B/zh
Priority to KR1019950021276A priority patent/KR960005965A/ko
Publication of JPH0846091A publication Critical patent/JPH0846091A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP6175606A 1994-07-27 1994-07-27 ボールグリッドアレイ半導体装置 Pending JPH0846091A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP6175606A JPH0846091A (ja) 1994-07-27 1994-07-27 ボールグリッドアレイ半導体装置
TW084107217A TW296473B (https=) 1994-07-27 1995-07-12
KR1019950021276A KR960005965A (ko) 1994-07-27 1995-07-20 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6175606A JPH0846091A (ja) 1994-07-27 1994-07-27 ボールグリッドアレイ半導体装置

Publications (1)

Publication Number Publication Date
JPH0846091A true JPH0846091A (ja) 1996-02-16

Family

ID=15999040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6175606A Pending JPH0846091A (ja) 1994-07-27 1994-07-27 ボールグリッドアレイ半導体装置

Country Status (3)

Country Link
JP (1) JPH0846091A (https=)
KR (1) KR960005965A (https=)
TW (1) TW296473B (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237142A (ja) * 2000-02-22 2001-08-31 Shizuki Electric Co Inc フィルムコンデンサ及び樹脂成形部品
JP2010050488A (ja) * 2009-11-30 2010-03-04 Panasonic Corp 半導体装置およびその製造方法
JP2010177388A (ja) * 2009-01-29 2010-08-12 Panasonic Corp 半導体装置及びその製造方法
CN102668042A (zh) * 2009-12-24 2012-09-12 株式会社村田制作所 电子元器件的制造方法
CN115547944A (zh) * 2021-06-30 2022-12-30 铠侠股份有限公司 半导体器件及电子设备
JP2023156715A (ja) * 2022-04-13 2023-10-25 富士電機株式会社 半導体装置及び半導体装置の製造方法
JPWO2024177013A1 (https=) * 2023-02-20 2024-08-29

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237142A (ja) * 2000-02-22 2001-08-31 Shizuki Electric Co Inc フィルムコンデンサ及び樹脂成形部品
JP2010177388A (ja) * 2009-01-29 2010-08-12 Panasonic Corp 半導体装置及びその製造方法
JP2010050488A (ja) * 2009-11-30 2010-03-04 Panasonic Corp 半導体装置およびその製造方法
CN102668042A (zh) * 2009-12-24 2012-09-12 株式会社村田制作所 电子元器件的制造方法
US9005736B2 (en) 2009-12-24 2015-04-14 Murata Manufacturing Co., Ltd. Electronic component manufacturing method
CN115547944A (zh) * 2021-06-30 2022-12-30 铠侠股份有限公司 半导体器件及电子设备
JP2023006455A (ja) * 2021-06-30 2023-01-18 キオクシア株式会社 半導体デバイス及び電子デバイス
US12374594B2 (en) 2021-06-30 2025-07-29 Kioxia Corporation Semiconductor device and electronic device
JP2023156715A (ja) * 2022-04-13 2023-10-25 富士電機株式会社 半導体装置及び半導体装置の製造方法
JPWO2024177013A1 (https=) * 2023-02-20 2024-08-29

Also Published As

Publication number Publication date
KR960005965A (ko) 1996-02-23
TW296473B (https=) 1997-01-21

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