TW296473B - - Google Patents

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Publication number
TW296473B
TW296473B TW084107217A TW84107217A TW296473B TW 296473 B TW296473 B TW 296473B TW 084107217 A TW084107217 A TW 084107217A TW 84107217 A TW84107217 A TW 84107217A TW 296473 B TW296473 B TW 296473B
Authority
TW
Taiwan
Prior art keywords
circuit board
electrode
sealing body
semiconductor wafer
resin
Prior art date
Application number
TW084107217A
Other languages
English (en)
Chinese (zh)
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW296473B publication Critical patent/TW296473B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW084107217A 1994-07-27 1995-07-12 TW296473B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6175606A JPH0846091A (ja) 1994-07-27 1994-07-27 ボールグリッドアレイ半導体装置

Publications (1)

Publication Number Publication Date
TW296473B true TW296473B (https=) 1997-01-21

Family

ID=15999040

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084107217A TW296473B (https=) 1994-07-27 1995-07-12

Country Status (3)

Country Link
JP (1) JPH0846091A (https=)
KR (1) KR960005965A (https=)
TW (1) TW296473B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237142A (ja) * 2000-02-22 2001-08-31 Shizuki Electric Co Inc フィルムコンデンサ及び樹脂成形部品
JP5213736B2 (ja) * 2009-01-29 2013-06-19 パナソニック株式会社 半導体装置
JP2010050488A (ja) * 2009-11-30 2010-03-04 Panasonic Corp 半導体装置およびその製造方法
CN102668042B (zh) * 2009-12-24 2015-06-24 株式会社村田制作所 电子元器件的制造方法
JP7682720B2 (ja) 2021-06-30 2025-05-26 キオクシア株式会社 半導体デバイス及び電子デバイス
JP2023156715A (ja) * 2022-04-13 2023-10-25 富士電機株式会社 半導体装置及び半導体装置の製造方法
WO2024177013A1 (ja) * 2023-02-20 2024-08-29 旭化成エレクトロニクス株式会社 半導体パッケージ、及びモジュール

Also Published As

Publication number Publication date
KR960005965A (ko) 1996-02-23
JPH0846091A (ja) 1996-02-16

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