KR960002620A - 웨이퍼 및 기판 처리 장치 및 처리 방법, 웨이퍼 및 기판 이동 적재 장치 - Google Patents

웨이퍼 및 기판 처리 장치 및 처리 방법, 웨이퍼 및 기판 이동 적재 장치 Download PDF

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Publication number
KR960002620A
KR960002620A KR1019950019425A KR19950019425A KR960002620A KR 960002620 A KR960002620 A KR 960002620A KR 1019950019425 A KR1019950019425 A KR 1019950019425A KR 19950019425 A KR19950019425 A KR 19950019425A KR 960002620 A KR960002620 A KR 960002620A
Authority
KR
South Korea
Prior art keywords
wafer
substrate
conveying
gas
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019950019425A
Other languages
English (en)
Korean (ko)
Inventor
나오유끼 이와무라
요시아끼 모리
다께시 미야시따
다꾸야 미야까와
이찌오 유다사까
Original Assignee
야스가와 히데아끼
세이꼬 엡슨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야스가와 히데아끼, 세이꼬 엡슨 가부시끼가이샤 filed Critical 야스가와 히데아끼
Publication of KR960002620A publication Critical patent/KR960002620A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Plasma Technology (AREA)
  • Liquid Crystal (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Electroluminescent Light Sources (AREA)
KR1019950019425A 1994-06-30 1995-06-30 웨이퍼 및 기판 처리 장치 및 처리 방법, 웨이퍼 및 기판 이동 적재 장치 Ceased KR960002620A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP17046094 1994-06-30
JP94-170460 1994-06-30
JP95-72146 1995-03-29
JP7214695 1995-03-29
JP95-164526 1995-06-08
JP7164526A JPH08327959A (ja) 1994-06-30 1995-06-08 ウエハ及び基板の処理装置及び処理方法、ウエハ及び基板の移載装置

Publications (1)

Publication Number Publication Date
KR960002620A true KR960002620A (ko) 1996-01-26

Family

ID=27300875

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950019425A Ceased KR960002620A (ko) 1994-06-30 1995-06-30 웨이퍼 및 기판 처리 장치 및 처리 방법, 웨이퍼 및 기판 이동 적재 장치

Country Status (5)

Country Link
EP (1) EP0690479A1 (https=)
JP (1) JPH08327959A (https=)
KR (1) KR960002620A (https=)
CN (1) CN1149636C (https=)
TW (1) TW289128B (https=)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10160794A (ja) * 1996-12-02 1998-06-19 Mitsubishi Electric Corp Ｉｃ着脱装置及びその着脱ヘッド
EP1162646A3 (en) 2000-06-06 2004-10-13 Matsushita Electric Works, Ltd. Plasma treatment apparatus and method
KR100816329B1 (ko) * 2001-05-30 2008-03-24 삼성전자주식회사 액정 표시 장치용 인라인 제조 시스템
KR100620165B1 (ko) * 2001-06-25 2006-09-04 동부일렉트로닉스 주식회사 반도체웨이퍼 보관장치
US7157659B2 (en) * 2002-08-26 2007-01-02 Matsushita Electric Industrial Co., Ltd. Plasma processing method and apparatus
TW200501201A (en) * 2003-01-15 2005-01-01 Hirata Spinning Substrate processing method and apparatus
JP4860295B2 (ja) * 2005-03-02 2012-01-25 エア・ウォーター株式会社 プラズマ処理方法
JP2007026781A (ja) * 2005-07-13 2007-02-01 Sharp Corp プラズマ処理装置
JP4578383B2 (ja) * 2005-10-25 2010-11-10 株式会社堀場製作所 パネル部材検査装置及びそれに適用されるパネル部材検査用プログラム
JP2007158023A (ja) * 2005-12-05 2007-06-21 Nec Electronics Corp 半導体ウェハの研磨装置及び半導体ウェハの研磨方法
JP4855142B2 (ja) * 2006-05-22 2012-01-18 東京エレクトロン株式会社 処理システム，搬送アームのクリーニング方法及び記録媒体
KR100849366B1 (ko) * 2006-08-24 2008-07-31 세메스 주식회사 기판을 처리하는 장치 및 방법
JP2008244318A (ja) * 2007-03-28 2008-10-09 Tokyo Electron Ltd 基板搬送部材の洗浄方法、基板搬送装置及び基板処理システム
JP4516089B2 (ja) * 2007-03-30 2010-08-04 アプライド マテリアルズ インコーポレイテッド ウェハ搬送用ブレード
JP4602390B2 (ja) * 2007-11-01 2010-12-22 Ｓｄフューチャーテクノロジー株式会社 塗布乾燥装置
JP4450081B2 (ja) * 2008-02-13 2010-04-14 セイコーエプソン株式会社 部品試験装置
JP4564078B2 (ja) * 2008-04-28 2010-10-20 東京エレクトロン株式会社 基板処理装置
DE102009045008A1 (de) * 2008-10-15 2010-04-29 Carl Zeiss Smt Ag EUV-Lithographievorrichtung und Verfahren zum Bearbeiten einer Maske
JP5006898B2 (ja) * 2009-03-26 2012-08-22 積水化学工業株式会社 ドライエッチング処理装置および処理方法
JP2010283095A (ja) * 2009-06-04 2010-12-16 Hitachi Ltd 半導体装置の製造方法
KR101033776B1 (ko) * 2009-08-03 2011-05-13 주식회사 탑 엔지니어링 클리너를 구비한 어레이 테스트 장치
JP6012597B2 (ja) 2010-05-11 2016-10-25 ウルトラ ハイ バキューム ソリューションズ リミテッド ティー／エー ナインズ エンジニアリング 光起電力電池素子のためのシリコンウエハの表面テクスチャ修飾を制御する方法および装置
GB2486883A (en) * 2010-12-22 2012-07-04 Ultra High Vacuum Solutions Ltd Method and apparatus for surface texture modification of silicon wafers for photovoltaic cell devices
US9561586B2 (en) 2012-03-29 2017-02-07 Ulvac, Inc. Articulated robot, and conveying device
CN104176466B (zh) * 2013-05-28 2017-06-09 北京中电科电子装备有限公司 具有清洗功能的工件传输装置
JP6601257B2 (ja) * 2016-02-19 2019-11-06 東京エレクトロン株式会社 基板処理方法
JP6731805B2 (ja) * 2016-07-12 2020-07-29 東京エレクトロン株式会社 接合システム
KR102628919B1 (ko) * 2019-05-29 2024-01-24 주식회사 원익아이피에스 기판처리장치 및 이를 이용한 기판처리방법
CN110344106A (zh) * 2019-07-15 2019-10-18 长兴云腾新能源科技有限公司 一种不锈钢半导体级洁净处理装置
KR102392489B1 (ko) * 2019-12-27 2022-05-02 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN115532551B (zh) * 2022-10-11 2025-10-10 隆基绿能科技股份有限公司 一种基板涂胶输送装置及其控制方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378170A (en) * 1976-12-22 1978-07-11 Toshiba Corp Continuous processor for gas plasma etching
JP3014111B2 (ja) * 1990-02-01 2000-02-28 科学技術振興事業団 大気圧グロープラズマエッチング方法
JPH0817171B2 (ja) * 1990-12-31 1996-02-21 株式会社半導体エネルギー研究所 プラズマ発生装置およびそれを用いたエッチング方法
JP2840699B2 (ja) * 1990-12-12 1998-12-24 株式会社 半導体エネルギー研究所 被膜形成装置及び被膜形成方法

Also Published As

Publication number Publication date
CN1118934A (zh) 1996-03-20
JPH08327959A (ja) 1996-12-13
TW289128B (https=) 1996-10-21
EP0690479A1 (en) 1996-01-03
CN1149636C (zh) 2004-05-12

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