TW200501201A - Substrate processing method and apparatus - Google Patents

Substrate processing method and apparatus

Info

Publication number
TW200501201A
TW200501201A TW093100922A TW93100922A TW200501201A TW 200501201 A TW200501201 A TW 200501201A TW 093100922 A TW093100922 A TW 093100922A TW 93100922 A TW93100922 A TW 93100922A TW 200501201 A TW200501201 A TW 200501201A
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
processing method
substrate processing
steps
Prior art date
Application number
TW093100922A
Other languages
Chinese (zh)
Other versions
TWI307523B (en
Inventor
Hiroshi Tsukida
Original Assignee
Hirata Spinning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Spinning filed Critical Hirata Spinning
Publication of TW200501201A publication Critical patent/TW200501201A/en
Application granted granted Critical
Publication of TWI307523B publication Critical patent/TWI307523B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/006—Other surface treatment of glass not in the form of fibres or filaments by irradiation by plasma or corona discharge
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075—Cleaning of glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/31—Pre-treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

A substrate processing technique of the present invention, wherein a liquid is discharged onto a surface of a substrate, brings a more preferable result. The substrate processing method comprising liquid discharge steps (S2, S5, S9) wherein liquids such as a cleaning liquid, a resist liquid and a developing liquid are discharged onto a surface of a substrate and surface processing steps (S1, S4, S8) wherein the surface of the substrate is processed as preparation for the liquid discharge steps is characterized in that the surface of the substrate is irradiated with an atmospheric pressure plasma in the surface processing steps (S1, S4, S8).
TW093100922A 2003-01-15 2004-01-14 Substrate processing method and apparatus TW200501201A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003007640 2003-01-15

Publications (2)

Publication Number Publication Date
TW200501201A true TW200501201A (en) 2005-01-01
TWI307523B TWI307523B (en) 2009-03-11

Family

ID=32709126

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093100922A TW200501201A (en) 2003-01-15 2004-01-14 Substrate processing method and apparatus

Country Status (3)

Country Link
JP (1) JPWO2004064129A1 (en)
TW (1) TW200501201A (en)
WO (1) WO2004064129A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060172081A1 (en) * 2005-02-02 2006-08-03 Patrick Flinn Apparatus and method for plasma treating and dispensing an adhesive/sealant onto a part
JP4629068B2 (en) * 2007-05-25 2011-02-09 株式会社サイアン Work processing device
JP5578675B2 (en) * 2010-09-09 2014-08-27 東京エレクトロン株式会社 Resist pattern forming device
TWI458568B (en) * 2011-07-19 2014-11-01 Innolux Corp Modification method of appearance property by using ultraviolet
US10199202B2 (en) 2015-04-09 2019-02-05 Oral 28 Inc. Plasma irradiation apparatus and plasma irradiation method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08327959A (en) * 1994-06-30 1996-12-13 Seiko Epson Corp Treating device for wafer and substrate and treatment method therefor and transfer device for wafer and substrate
JP3180092B2 (en) * 1997-12-03 2001-06-25 松下電工株式会社 Plasma processing system and plasma processing method
JP2001213063A (en) * 2000-02-04 2001-08-07 Konica Corp Lithographic printing plate material and producing method for lithographic printing plate made thereof
JP2002237480A (en) * 2000-07-28 2002-08-23 Sekisui Chem Co Ltd Method of treating base material with discharge plasma
JP2002170815A (en) * 2000-12-01 2002-06-14 Matsushita Electric Works Ltd Surface treatment device and surface treatment method
WO2003071839A1 (en) * 2002-02-20 2003-08-28 Matsushita Electric Works, Ltd. Plasma processing device and plasma processing method

Also Published As

Publication number Publication date
WO2004064129A1 (en) 2004-07-29
JPWO2004064129A1 (en) 2006-05-18
TWI307523B (en) 2009-03-11

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Legal Events

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MK4A Expiration of patent term of an invention patent