KR940006232A - 프로우브 장치 - Google Patents

프로우브 장치 Download PDF

Info

Publication number
KR940006232A
KR940006232A KR1019930009674A KR930009674A KR940006232A KR 940006232 A KR940006232 A KR 940006232A KR 1019930009674 A KR1019930009674 A KR 1019930009674A KR 930009674 A KR930009674 A KR 930009674A KR 940006232 A KR940006232 A KR 940006232A
Authority
KR
South Korea
Prior art keywords
probe
test head
probe card
inclination
mounting plate
Prior art date
Application number
KR1019930009674A
Other languages
English (en)
Other versions
KR100260116B1 (ko
Inventor
히토시 후지하라
Original Assignee
이노우에 아키라
도오교오 에레구토론 가부시기가이샤
이노우에 쥰이치
도오교오 에레구토론 야마나시 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이노우에 아키라, 도오교오 에레구토론 가부시기가이샤, 이노우에 쥰이치, 도오교오 에레구토론 야마나시 가부시끼가이샤 filed Critical 이노우에 아키라
Publication of KR940006232A publication Critical patent/KR940006232A/ko
Application granted granted Critical
Publication of KR100260116B1 publication Critical patent/KR100260116B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

(목적)측정시에 테스트 헤드에 대한 피처리체의 위치맞춤이 가능하고, 고정밀도로 고주파 측정이 가능한 프로우브장치를 제공함.
(구성)테스트 헤드(1)에 직접 프로우브 침을 갖춘 프로우브 카드(9)를 부착함과 함께, 피검사체를 지지하는 얹어놓는판(41)에, 이 얹어놓는판에 대한 프로우브 카드(9)의 기울기를 검출하는 검출수단(14)을 착설함과 함께, 이 검출수단(14)으로부터의 정보에 기초한 얹어놓는판(41)의 기울기를 보정하는 보정수단을 형성한다. 보정수단은 얹어놓는 판(41)을 지지하는 길이가 변화가능한 3개의 지지부로 이루어지며, 각 지지부의 길이를 바꿈으로써 얹어놓는판(41)의 기울기를 보정한다.
(효과)테스트 헤드에 직접 프로우브 카드를 착설하는 것이 가능하므로, 테스트 헤드와 프로우브 카드의 사이의 측정케이블등 접속부를 없이 할 수 있으며, 임피던스의 증가를 없게하고, 정확한 고주파측정이 가능하다.

Description

프로우브 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 프로우브 장치의 일실시예를 나타내는 전체 구성도,
제2도는 본 발명에 관한 프로우브 카드의 일실시예를 나타내는 도면,
제3도는 제1도의 프로우브 장치의 요부를 나타내는 사시도,
제4도는 제1도의 프로우브 장치의 다른 요부를 나타내는 도면.

Claims (2)

  1. 테스트 헤드(1)와, 피검사체를 검사하기 위한 프로우드 침(9a)을 구비하고, 상기 테스트 헤드(1)에 전기적으로 접속되는 프로우브 카드(9)와, 상기 피검사체를 지지하는 지지수단(4)과, 상기 지지수단(4)을 상기 피검사체와 상기 프로우브 침(9a)이 접촉하도록 이동하기 위한 스테이지(5)를 구비한 프로우브장치에 있어서, 상기 지지수단(4)은 상기 피검사체의 상기 테스트 헤드(1)에 대한 기울기를 보정하는 보정수단(14),(43)을 갖춘 것을 특징으로 하는 프로우브 장치.
  2. 제1항에 있어서, 상기 프로우브 카드(9)는 상기 테스트 헤드(1)에 고정적으로 연결되어 있는 것을 특징으로 하는 프로우브 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930009674A 1992-06-01 1993-05-31 프로우브 장치 KR100260116B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-140563 1992-06-01
JP14056392A JP3219844B2 (ja) 1992-06-01 1992-06-01 プローブ装置

Publications (2)

Publication Number Publication Date
KR940006232A true KR940006232A (ko) 1994-03-23
KR100260116B1 KR100260116B1 (ko) 2000-07-01

Family

ID=15271596

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930009674A KR100260116B1 (ko) 1992-06-01 1993-05-31 프로우브 장치

Country Status (3)

Country Link
US (1) US5410259A (ko)
JP (1) JP3219844B2 (ko)
KR (1) KR100260116B1 (ko)

Families Citing this family (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5621313A (en) * 1993-09-09 1997-04-15 Tokyo Seimitsu Co., Ltd. Wafer probing system and method that stores reference pattern and movement value data for different kinds of wafers
US20030199179A1 (en) * 1993-11-16 2003-10-23 Formfactor, Inc. Contact tip structure for microelectronic interconnection elements and method of making same
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
KR100248569B1 (ko) * 1993-12-22 2000-03-15 히가시 데쓰로 프로우브장치
US5561386A (en) * 1994-02-23 1996-10-01 Fujitsu Limited Chip tester with improvements in handling efficiency and measurement precision
US6200389B1 (en) * 1994-07-18 2001-03-13 Silicon Valley Group Thermal Systems Llc Single body injector and deposition chamber
SG55211A1 (en) * 1995-07-05 1998-12-21 Tokyo Electron Ltd Testing apparatus
FR2743194B1 (fr) * 1995-12-29 1998-03-20 Sgs Thomson Microelectronics Identification de carte a pointes pour une fabrication assistee par ordinateur
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5773987A (en) * 1996-02-26 1998-06-30 Motorola, Inc. Method for probing a semiconductor wafer using a motor controlled scrub process
US5773951A (en) * 1996-03-25 1998-06-30 Digital Test Corporation Wafer prober having sub-micron alignment accuracy
JPH09321102A (ja) * 1996-05-31 1997-12-12 Tokyo Electron Ltd 検査装置
US5861759A (en) * 1997-01-29 1999-01-19 Tokyo Electron Limited Automatic probe card planarization system
JP3639887B2 (ja) * 1997-01-30 2005-04-20 東京エレクトロン株式会社 検査方法及び検査装置
JP3172760B2 (ja) * 1997-03-07 2001-06-04 東京エレクトロン株式会社 バキュームコンタクタ
TW399279B (en) * 1997-05-08 2000-07-21 Tokyo Electron Limtied Prober and probe method
JP3423979B2 (ja) * 1997-07-11 2003-07-07 東京エレクトロン株式会社 プローブ方法及びプローブ装置
JP3206509B2 (ja) * 1997-08-22 2001-09-10 日本電気株式会社 表示パネル用プローブ装置
US6048750A (en) 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
US6072898A (en) 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
JP3553791B2 (ja) * 1998-04-03 2004-08-11 株式会社ルネサステクノロジ 接続装置およびその製造方法、検査装置並びに半導体素子の製造方法
US6731327B1 (en) 1999-02-12 2004-05-04 Hypervision, Inc. Dynamic structural coupling mechanism for reducing optical degradation in vibrating environments
JP2000260852A (ja) 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
US6373268B1 (en) * 1999-05-10 2002-04-16 Intel Corporation Test handling method and equipment for conjoined integrated circuit dice
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6320372B1 (en) * 1999-07-09 2001-11-20 Electroglas, Inc. Apparatus and method for testing a substrate having a plurality of terminals
JP4376370B2 (ja) * 1999-09-29 2009-12-02 東京エレクトロン株式会社 高速測定対応プローブ装置
JP2001110857A (ja) 1999-10-06 2001-04-20 Tokyo Electron Ltd プローブ方法及びプローブ装置
US7009415B2 (en) * 1999-10-06 2006-03-07 Tokyo Electron Limited Probing method and probing apparatus
DE19952943C2 (de) * 1999-11-03 2003-07-03 Infineon Technologies Ag Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte
US6392428B1 (en) * 1999-11-16 2002-05-21 Eaglestone Partners I, Llc Wafer level interposer
JP4218816B2 (ja) 2000-02-15 2009-02-04 東京エレクトロン株式会社 針荷重測定方法、検査方法及び検査装置
US6424167B1 (en) * 2000-03-22 2002-07-23 National Semiconductor Corporation Vibration resistant test module for use with semiconductor device test apparatus
US6650135B1 (en) * 2000-06-29 2003-11-18 Motorola, Inc. Measurement chuck having piezoelectric elements and method
US6774621B2 (en) * 2000-06-15 2004-08-10 Tokyo Electron Limited Inspection stage having a plurality of Z axes
JP2001358204A (ja) * 2000-06-15 2001-12-26 Tokyo Electron Ltd 検査ステージ
US6537831B1 (en) * 2000-07-31 2003-03-25 Eaglestone Partners I, Llc Method for selecting components for a matched set using a multi wafer interposer
US6812048B1 (en) * 2000-07-31 2004-11-02 Eaglestone Partners I, Llc Method for manufacturing a wafer-interposer assembly
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6813817B2 (en) * 2000-09-15 2004-11-09 James Orsillo Method of using a replacement headplate to adapt a probe station
US6408500B1 (en) * 2000-09-15 2002-06-25 James Orsillo Method of retrofitting a probe station
US7053646B2 (en) * 2000-09-15 2006-05-30 Orsillo James F Apparatus and method for use in testing a semiconductor wafer
US20040020514A1 (en) * 2002-07-18 2004-02-05 Orsillo James E. Probe device cleaner and method
US6815712B1 (en) 2000-10-02 2004-11-09 Eaglestone Partners I, Llc Method for selecting components for a matched set from a wafer-interposer assembly
US6686657B1 (en) 2000-11-07 2004-02-03 Eaglestone Partners I, Llc Interposer for improved handling of semiconductor wafers and method of use of same
US20020078401A1 (en) * 2000-12-15 2002-06-20 Fry Michael Andrew Test coverage analysis system
US20020076854A1 (en) * 2000-12-15 2002-06-20 Pierce John L. System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates
US6524885B2 (en) * 2000-12-15 2003-02-25 Eaglestone Partners I, Llc Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques
US6529022B2 (en) * 2000-12-15 2003-03-04 Eaglestone Pareners I, Llc Wafer testing interposer for a conventional package
EP1220596A1 (en) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. A method and an apparatus for measuring positions of contact elements of an electronic component
US6673653B2 (en) * 2001-02-23 2004-01-06 Eaglestone Partners I, Llc Wafer-interposer using a ceramic substrate
JP2002350461A (ja) * 2001-05-29 2002-12-04 Hioki Ee Corp プローブ装置および回路基板検査装置
TW558629B (en) * 2001-09-19 2003-10-21 Siemens Ag Device and method to plain-parallel alignment of an inspectable even object-surface to a focus-plain of an objective
US6771060B1 (en) 2001-10-22 2004-08-03 Electroglas, Inc. Testing circuits on substrates
US6861859B1 (en) 2001-10-22 2005-03-01 Electroglas, Inc. Testing circuits on substrates
US7071714B2 (en) 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
US6777964B2 (en) * 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
US6674296B1 (en) * 2002-02-28 2004-01-06 Advanced Micro Devices, Inc. Probe card measurement tool
US6876211B2 (en) * 2002-03-13 2005-04-05 Seagate Technology Llc Printed circuit board test fixture that supports a PCB to be tested
US7046025B2 (en) * 2002-10-02 2006-05-16 Suss Microtec Testsystems Gmbh Test apparatus for testing substrates at low temperatures
US7026832B2 (en) * 2002-10-28 2006-04-11 Dainippon Screen Mfg. Co., Ltd. Probe mark reading device and probe mark reading method
JP2004152916A (ja) * 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
KR100621627B1 (ko) * 2004-05-28 2006-09-19 삼성전자주식회사 웨이퍼 테스트 설비 및 그 설비의 정렬 방법
US7157923B2 (en) * 2004-11-18 2007-01-02 Infineon Technologies Ag Method for full wafer contact probing, wafer design and probe card device with reduced probe contacts
JP4413130B2 (ja) * 2004-11-29 2010-02-10 Okiセミコンダクタ株式会社 プローブカードを用いた半導体素子の検査方法およびその検査方法により検査した半導体装置
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7352198B2 (en) * 2006-01-18 2008-04-01 Electroglas, Inc. Methods and apparatuses for improved stabilization in a probing system
EP1739440A3 (de) * 2005-06-30 2009-05-13 Feinmetall GmbH Elektrisches Prüfverfahren und -vorrichtung sowie Verfahren zur Herstellung einer Kontaktiervorrichtung
US7068056B1 (en) * 2005-07-18 2006-06-27 Texas Instruments Incorporated System and method for the probing of a wafer
JP2007035747A (ja) * 2005-07-25 2007-02-08 Sumitomo Electric Ind Ltd ウェハ保持体およびそれを搭載したウェハプローバ
JP4936707B2 (ja) * 2005-11-08 2012-05-23 株式会社東京精密 プローバ
JP2007183193A (ja) * 2006-01-10 2007-07-19 Micronics Japan Co Ltd プロービング装置
US7583098B2 (en) * 2006-02-08 2009-09-01 Sv Probe Pte. Ltd. Automated probe card planarization and alignment methods and tools
JP2007256117A (ja) * 2006-03-23 2007-10-04 Fujitsu Ltd プリント回路基板試験装置、プリント回路基板試験方法、プリント回路基板試験プログラム、プリント回路基板製造方法
KR100790817B1 (ko) * 2006-12-06 2008-01-03 삼성전자주식회사 반도체 제조관리 시스템
TWI439709B (zh) * 2006-12-29 2014-06-01 Intest Corp 用於使負載沿平移軸線平移之操縱器與負載定位系統
US8350584B2 (en) * 2006-12-29 2013-01-08 Intest Corporation Test head positioning system and method
US7764076B2 (en) * 2007-02-20 2010-07-27 Centipede Systems, Inc. Method and apparatus for aligning and/or leveling a test head
DE102008021242A1 (de) * 2007-04-30 2008-11-13 Suss Microtec Test Systems Gmbh Vorrichtung und Verfahren zur Steuerung einer Bewegungseinrichtung
US7573283B2 (en) * 2007-06-19 2009-08-11 Suss Micro Tec Test Systems Gmbh Method for measurement of a device under test
JP4950779B2 (ja) * 2007-06-22 2012-06-13 東京エレクトロン株式会社 プローブカードの登録方法及びこのプログラムを記録したプログラム記録媒体
JP2009021397A (ja) * 2007-07-12 2009-01-29 Seiko Epson Corp マルチカードの位置ズレ補正方法及び、回路素子の検査方法
US7847568B2 (en) * 2007-08-17 2010-12-07 Advanced Micro Devices, Inc. Multi-site probe
WO2009064285A1 (en) * 2007-11-13 2009-05-22 Testmetrix, Inc. Apparatus and method for testing semiconductor devices
KR100936631B1 (ko) * 2007-11-22 2010-01-14 주식회사 쎄믹스 웨이퍼 프로버의 z축 위치 제어 장치 및 방법
KR101028433B1 (ko) 2008-11-20 2011-04-15 주식회사 쎄믹스 웨이퍼 프로브 스테이션 및 그의 제어방법
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US8519728B2 (en) * 2008-12-12 2013-08-27 Formfactor, Inc. Compliance control methods and apparatuses
US8120304B2 (en) 2008-12-12 2012-02-21 Formfactor, Inc. Method for improving motion times of a stage
JP5086983B2 (ja) * 2008-12-15 2012-11-28 株式会社東芝 プローブ装置、処理装置及びウェハプローブテストの処理方法
KR101583000B1 (ko) * 2009-03-09 2016-01-19 삼성전자주식회사 반도체 디바이스 테스트 장치 및 방법
KR101090333B1 (ko) * 2009-06-03 2011-12-07 주식회사 쎄믹스 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법
JP2011002239A (ja) * 2009-06-16 2011-01-06 Fujikura Ltd 磁界プローバ
EP2378341A1 (de) 2010-04-15 2011-10-19 Mmi Ag Verfahren zur kollisionsfreien Positionierung eines Mikromanipulationswerkzeugs
EP2418503B1 (en) * 2010-07-14 2013-07-03 Sensirion AG Needle head
CN103545236A (zh) * 2013-11-12 2014-01-29 江苏艾科瑞思封装自动化设备有限公司 装片机的自动对位机构、包括它的装片机及方法
CN105277757A (zh) * 2014-07-24 2016-01-27 京元电子股份有限公司 降低镜头模块环境温度的装置及其方法
JP6515007B2 (ja) * 2015-09-30 2019-05-15 東京エレクトロン株式会社 ウエハ検査方法及びウエハ検査装置
GB2545496B (en) 2015-12-18 2020-06-03 Teraview Ltd A Test System
CN105929202A (zh) * 2016-04-25 2016-09-07 昆山瑞鸿诚自动化设备科技有限公司 一种home键与前屏幕二合一测试治具
CN106814222B (zh) * 2016-06-28 2019-05-07 昆山欧博精密机械电子有限公司 电路板植针治具底座
JP6783185B2 (ja) * 2017-05-15 2020-11-11 東京エレクトロン株式会社 検査装置
TWI641836B (zh) * 2017-08-21 2018-11-21 漢民科技股份有限公司 平面校正裝置及包含其之半導體測試設備
CN110238547B (zh) * 2019-05-09 2020-12-18 西安理工大学 一种用于测量大功率激光焦点位置的系统及测量方法
CN110187259A (zh) * 2019-06-10 2019-08-30 德淮半导体有限公司 一种防止晶圆测试中针痕偏移的调整系统以及调整方法
US11940482B2 (en) * 2019-12-20 2024-03-26 Nidec Read Corporation Inspection device
CN113019994A (zh) * 2019-12-24 2021-06-25 苏州瀚川智能科技股份有限公司 一种电池测试机构
CN112763193B (zh) * 2021-01-07 2023-05-30 上海浩创亘永科技有限公司 Ccd模组检测装置及ccd模组检测方法
US20240125817A1 (en) * 2022-10-17 2024-04-18 The Boeing Company Tilt calibration for probe systems

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5830128A (ja) * 1981-08-17 1983-02-22 Hitachi Ltd ウエハのチヤツク装置
JPS6362245A (ja) * 1986-09-02 1988-03-18 Canon Inc ウエハプロ−バ
US4864227A (en) * 1987-02-27 1989-09-05 Canon Kabushiki Kaisha Wafer prober
JP2802825B2 (ja) * 1990-09-22 1998-09-24 大日本スクリーン製造 株式会社 半導体ウエハの電気測定装置

Also Published As

Publication number Publication date
JPH05335385A (ja) 1993-12-17
JP3219844B2 (ja) 2001-10-15
US5410259A (en) 1995-04-25
KR100260116B1 (ko) 2000-07-01

Similar Documents

Publication Publication Date Title
KR940006232A (ko) 프로우브 장치
KR890015660A (ko) 잠재적으로 뒤틀린 프린트 회로판을 검사하는 보상 시스템
US5895858A (en) Integrated accelerometer test system
DE50209202D1 (de) Fingertester
DE60037884D1 (de) Mehrfachsonden-Messgerät und zugehöriges Anwendungsverfahren
KR880004325A (ko) 집적회로 프로브의 접촉설정장치 및 그 방법
KR900000683A (ko) 패턴형상측정장치
KR870002442A (ko) 프루브 검사방법
ES2083379T3 (es) Sistema de comprobacion de dispositivos electronicos.
US4690001A (en) Optical displacement transducer usable as an extensometer
ATE142774T1 (de) Rastertastmikroskop
JPH02502480A (ja) 容量式伸び計
KR900002081A (ko) 마찰대전압 측정장치(摩擦大電壓 測定裝置)
KR100428782B1 (ko) 포고 핀 탄성 측정장치
SE9602564L (sv) Kretskortstest
KR920018458A (ko) 물체의 물리적상태 감시장치
KR890001109A (ko) 연료 조립체 격자 검사장치 및 방법
SU1709176A1 (ru) Устройство дл контрол расположени и формы оси отверсти в детал х
KR960010444A (ko) 차체조립치구 조정지원장치
KR200156348Y1 (ko) 레이져 변위 측정기 거치용 지그
WO2001004653A8 (en) Method and apparatus for sub-micron imaging and probing on probe station
DE3872962D1 (de) Probeneinspannvorrichtung fuer pruefmaschinen.
JP2003279379A (ja) 光学式変位測長器
SU567939A1 (ru) Устройство дл измерени малых пермещений
JPH051127Y2 (ko)

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20120322

Year of fee payment: 13

EXPY Expiration of term