KR870002442A - 프루브 검사방법 - Google Patents

프루브 검사방법 Download PDF

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Publication number
KR870002442A
KR870002442A KR1019860006704A KR860006704A KR870002442A KR 870002442 A KR870002442 A KR 870002442A KR 1019860006704 A KR1019860006704 A KR 1019860006704A KR 860006704 A KR860006704 A KR 860006704A KR 870002442 A KR870002442 A KR 870002442A
Authority
KR
South Korea
Prior art keywords
probe
metal film
height
contact
stage
Prior art date
Application number
KR1019860006704A
Other languages
English (en)
Other versions
KR900001040B1 (ko
Inventor
츠토무 미야자키
히사히토 에토오
신 토자와
Original Assignee
와타리 스기이찌로
가부시끼 가이샤 도오시바
야마모또 히로시
도오시바-마이크로 캄퓨터 엔지니어링 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60178721A external-priority patent/JPS6239021A/ja
Priority claimed from JP60178732A external-priority patent/JPS6239022A/ja
Application filed by 와타리 스기이찌로, 가부시끼 가이샤 도오시바, 야마모또 히로시, 도오시바-마이크로 캄퓨터 엔지니어링 코포레이션 filed Critical 와타리 스기이찌로
Publication of KR870002442A publication Critical patent/KR870002442A/ko
Application granted granted Critical
Publication of KR900001040B1 publication Critical patent/KR900001040B1/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

내용 없음

Description

프루브 검사방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 프루브 검사방법의 일실시예를 구현하기 위한 검사장치의 개략도.
제2도는 제1도에 따른 검사장치에 주컴퓨터를 연결시킨 개략도.
제5a 및 제5b도는 프루브 검사장치의 측면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 테스터 2 : 프루브장치
3 : 프루브카드 4 : 반도체웨이퍼
5 : 스테이지 6 : CPU
7 : 주컴퓨터 9-12 : IC칩
14 : 탐침 16 : 스테이지제어유니트
17 : 릴레이 18 : 계측기
19 : 전류계 20 : 가변전원공급기

Claims (2)

  1. 프루브카드를 이용하여 IC칩의 특성을 점검하는 프루브 검사방법에 있어서, 칩영역위에 금속필름이 형성된 반도체웨이퍼를 지지하는 스테이지를 주기적으로 상승시키고, 상기 스테이지위에 설치된 프루브카드에 설치된 다수개의 탐침중에서 상기 금속필름에 처음 접촉되는 탐침의 첨부 높이와 나머지 모든 탐침이 상기 금속필름과 접촉하는 높이 사이의 높이차를 산출하며, 나머지 모든 탐침이 상기 금속필름과 접촉되었을 때 상기 각 탐침과 금속필름 사이의 접촉저항을 구하고, 상기 높이차와 접촉저항이 각각 미리 정해진 수치와 비교되어 탐침의 높이차와 접촉저항이 허용치 이내로 되어 있는가를 검출하도록 되어 있음을 특징으로 하는 프루브 검사방법.
  2. 반도체 IC칩의 특성을 점검하기 위한 프루브 검사방법에 있어서, 칩영역위에 금속필름이 형성된 반도체 웨이퍼를 지지하는 스테이지를 주기적으로 상승시키고, 상기 스테이지위에 설치된 프루브카드에 설치된 다수의 탐침중에서 상기 금속필름에 처음 접촉되는 탐침첨부의 높이와 나머지 모든 탐침이 상기 금속필름과 접촉하는 높이 사이의 높이차를 산출하며, 상기 스테이지를 나머지 탐침이 상기 금속필름과 접촉된 위치로부터 예정된 구동영역만큼 상승시키고, 상기 스테이지가 예정된 구동영역만큼 상승되었을 때 각 탐침과 금속필픔 사이의 접촉저항을 구하며, 상기 높이차와 접촉저항이 각각 미리 정해진 수치와 비교되어 탐침의 높이차와 접촉저항이 허용치 이내로 되어 있는가를 검출하도록 되어 있음을 특징으로 하는 프루브 검사방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860006704A 1985-08-14 1986-08-14 프루브 검사방법 KR900001040B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP60-178732 1985-08-14
JP178732 1985-08-14
JP60178721A JPS6239021A (ja) 1985-08-14 1985-08-14 プロ−ブテスト方法
JP60178732A JPS6239022A (ja) 1985-08-14 1985-08-14 プロ−ブテスト方法
JP178721 1985-08-14
JP60-178721 1985-08-14

Publications (2)

Publication Number Publication Date
KR870002442A true KR870002442A (ko) 1987-03-31
KR900001040B1 KR900001040B1 (ko) 1990-02-26

Family

ID=26498811

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860006704A KR900001040B1 (ko) 1985-08-14 1986-08-14 프루브 검사방법

Country Status (2)

Country Link
US (1) US4780836A (ko)
KR (1) KR900001040B1 (ko)

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US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US4842973A (en) * 1988-04-08 1989-06-27 Xerox Corporation Vacuum deposition of selenium alloy
GB8820042D0 (en) * 1988-08-24 1988-09-28 Bath Scient Ltd Circuit testing
US4918374A (en) * 1988-10-05 1990-04-17 Applied Precision, Inc. Method and apparatus for inspecting integrated circuit probe cards
US5060371A (en) * 1988-10-05 1991-10-29 Applied Precision, Inc. Method of making probe cards
JPH02237047A (ja) * 1989-03-09 1990-09-19 Mitsubishi Electric Corp 半導体試験装置
US5019771A (en) * 1990-05-09 1991-05-28 Knights Technology, Inc. Contact sensing for integrated circuit testing
US5057772A (en) * 1990-05-29 1991-10-15 Electro Scientific Industries, Inc. Method and system for concurrent electronic component testing and lead verification
JP3208734B2 (ja) * 1990-08-20 2001-09-17 東京エレクトロン株式会社 プローブ装置
EP0547251A1 (en) * 1991-12-14 1993-06-23 International Business Machines Corporation A method for testing a micro circuit
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US7200930B2 (en) 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US5550480A (en) * 1994-07-05 1996-08-27 Motorola, Inc. Method and means for controlling movement of a chuck in a test apparatus
US5777485A (en) * 1995-03-20 1998-07-07 Tokyo Electron Limited Probe method and apparatus with improved probe contact
US5834956A (en) 1995-12-29 1998-11-10 Intel Corporation Core clock correction in a 2/N mode clocking scheme
US5821784A (en) * 1995-12-29 1998-10-13 Intel Corporation Method and apparatus for generating 2/N mode bus clock signals
US5802132A (en) * 1995-12-29 1998-09-01 Intel Corporation Apparatus for generating bus clock signals with a 1/N characteristic in a 2/N mode clocking scheme
AU6406696A (en) * 1996-01-24 1997-08-20 Intel Corporation Improved method and apparatus for scrubbing the bond pads of an integrated circuit during wafer sort
US5773987A (en) * 1996-02-26 1998-06-30 Motorola, Inc. Method for probing a semiconductor wafer using a motor controlled scrub process
US5826067A (en) * 1996-09-06 1998-10-20 Intel Corporation Method and apparatus for preventing logic glitches in a 2/n clocking scheme
US5862373A (en) * 1996-09-06 1999-01-19 Intel Corporation Pad cells for a 2/N mode clocking scheme
JPH10335395A (ja) * 1997-05-28 1998-12-18 Advantest Corp プローブカードの接触位置検出方法
US6298312B1 (en) * 1998-07-22 2001-10-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method of determining the tip angle of a probe card needle
US7071714B2 (en) * 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
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US7218127B2 (en) * 2004-02-18 2007-05-15 Formfactor, Inc. Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
KR100790817B1 (ko) * 2006-12-06 2008-01-03 삼성전자주식회사 반도체 제조관리 시스템
US20120256651A1 (en) * 2011-04-08 2012-10-11 International Business Machines Corporation Test structure for parallel test implemented with one metal layer
JP5947647B2 (ja) * 2012-07-25 2016-07-06 株式会社日本マイクロニクス プローブカード、及び検査装置
IT202000012556A1 (it) * 2020-05-27 2021-11-27 Crea Collaudi Elettr Automatizzati Srl Sistema di sicurezza per scheda sonda ad aghi per test ad alta tensione ed alta corrente su dispositivi a semiconduttore di potenza e relativa macchina di test.

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Also Published As

Publication number Publication date
KR900001040B1 (ko) 1990-02-26
US4780836A (en) 1988-10-25

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