KR930021822A - 철손이 낮은 입자 방향성 규소강판 및 그 제조방법 - Google Patents

철손이 낮은 입자 방향성 규소강판 및 그 제조방법 Download PDF

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KR930021822A
KR930021822A KR1019930005766A KR930005766A KR930021822A KR 930021822 A KR930021822 A KR 930021822A KR 1019930005766 A KR1019930005766 A KR 1019930005766A KR 930005766 A KR930005766 A KR 930005766A KR 930021822 A KR930021822 A KR 930021822A
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steel sheet
grain
oriented silicon
silicon steel
forming
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슈이치 야마지키
히로야스 휴지이
다케오 나가시마
요시유키 우시가미
오사무 다나카
가쯔로 구로키
히로아끼 마스이
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나카가와 하지메
신니뽄 세이데쓰 가부시키가이샤
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Priority claimed from JP4226167A external-priority patent/JP2698003B2/ja
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    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
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    • C21D8/00Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/12Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties
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    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00Modifying the physical properties by deformation combined with, or followed by, heat treatment
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Abstract

본 발명은 강판에 마무리 소둔공정에서 형성된 무기 광물질 피막(유리피막)이 없고 장력 부여형의 절연피막이 2.5mm이상 형성된 입자방향성 규소강판과, 강판에 마무리 소둔공정에서 형서오딘 무기 광물질 피막(유리피막)이 없고 장력 부여형의 절연피막의 2.5mm이상 형성된 입자방향성 규소강판 및 마무리 소둔이 끝난 무기 광물질 피막(유리피막)이 없는 입자방향성 규소강판에 0.001mm이상의 SiO2층을 형성한 후 장력 부여형의 절연피막을 형성하는 입자방향성 규소강판의 절연피막 형성방법에 관한 것이다.

Description

철손이 낮은 입자 방향성 규소강판 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 철손치(鐵損値)에 미치는 유리 박막의 유무, 절연피막두께의 효과를 나타낸 도표.
제2도는 상이한 산소 화학 포텐셜 상태하에 있어서 규소강판을 소둔하여 얻어지는 산화물층의 구조적 차이를 나타낸 광학현미경 사진.
제3도는 약산화성 분위기에서 규소강판을 소둔하여 생성된 SiO2의 얇은 외부 산화층에 대한 적외선 반사흡수 스펙트로그램.

Claims (10)

  1. 강판에 마무리 소둔공정에서 형성된 무기 광물질 피막(유리피막)이 없고, 장력부여형의 절연피막이 2.5㎛이상 형성된 입자 방향성 구소강판.
  2. 제1항에 있어서, 강판 표면에 깊이가 5mm이상이고 폭이 300mm이하인 선형 또는 점형태의 흠을 압연방향에 대하여 45~90의 방향으로 형성한 입자방성 규소강판.
  3. 마무리 소둔이 끝나고 무기 광물질 피막(유리피막)이 없는 입자방향성 규소 강판에 0.001mm이상의 SiO2층을 형성한 후 장력 부여형의 절연피막을 형성하는 입자방향성 규소강판의 절연피막 형성방법.
  4. 제3항에 있어서, 마무리 소둔이 끝난 강판 표면에 무기 광물질 피막(유리피막)이 없는 입자 방향성 규소강판을 약산화성 분위기 중에 유지하고, 그때에 산소 포텐셜과 강판 온도를 제어하는 것에 의하여 외부 산화막만으로 이루어진 SiO2층을 형성하는 입자방향성 규소강판의 절연피막 형성방법.
  5. 제4항에 있어서, Si함유량 2~4.8%의 강판에 대하여 균열 온도 500~700℃의 경우는 약산화성 분위기를 PH2O/PH2≤0.5로, 균열온도 700~1000℃의 경우에는 PH2O/PH2≤0.15로 제어하여 외부산화층만으로 이루어진 SiO2층을 형성하는 입자방향성 규소강판의 절연피막 형성방법(PH2O는 분위기 중의 수증이 분압 PH2는 분위기 중의 수소 분압이다).
  6. 제3항에 있어서, CVD 또는 PVD법에 의하여 0.001mm이상의 SiO2층을 형성하는 입자방향성 규소강판의 절연피막 형성방법.
  7. 마무리 소둔이 끝난 강판 표면에 무기 광물질 피막(유리피막)이 없는 입자 방향성 규소가판이 황산농도를 2~30%로한 황산 또는 황산염수용액안에 10~180초동안 침지되고, 다음에 물로 세척되어 건조되, 그후에 장력부여형 절연피막을 형성하는 입자방향성 규소강판의 절연피막 형성방법.
  8. 마무리 소둔이 끝난 강판 표면에 무기 광물질 피막(유리피막)이 없는 입자 방향성 규소 강판에 수소를 함유하는 분위기 중에서 소부하여 장력부여형 절연피막을 형성하는 입자방향성 규소강판의 절연피막 형성방법.
  9. 제3항 내지 제8항중 어느 한 항에 있어서, 장력 부여형 절연피막의 도포 및 소부처리를 2회이상 반복하는 입자방향성 규소강판의 절연피막 형성방법.
  10. 제3항 내지 제9항중 어느 한 항에 있어서, 장력 부여형으로서 무수 크롬산, 콜로이드성 규화물, 인산염증의 어느 1종 또는 2종이상의 혼합물을 주성분으로 하는 도포액을 사용하는 입자 방향성 규소상판의 절연피막 형성방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930005766A 1992-04-07 1993-04-07 철손이 낮은 입자 방향성 규소강판 및 그 제조방법 KR960003737B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP92-85501 1992-04-07
JP4085501A JP2698501B2 (ja) 1992-04-07 1992-04-07 一方向性珪素鋼板の絶縁皮膜形成方法
JP4116451A JP2671076B2 (ja) 1992-05-08 1992-05-08 超低鉄損一方向性電磁鋼板の製造方法
JP92-116451 1992-05-08
JP92-226167 1992-08-25
JP4226167A JP2698003B2 (ja) 1992-08-25 1992-08-25 一方向性珪素鋼板の絶縁皮膜形成方法

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KR930021822A true KR930021822A (ko) 1993-11-23
KR960003737B1 KR960003737B1 (ko) 1996-03-21

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