KR920701989A - 동합금계 조성물 - Google Patents

동합금계 조성물

Info

Publication number
KR920701989A
KR920701989A KR1019910701423A KR910701423A KR920701989A KR 920701989 A KR920701989 A KR 920701989A KR 1019910701423 A KR1019910701423 A KR 1019910701423A KR 910701423 A KR910701423 A KR 910701423A KR 920701989 A KR920701989 A KR 920701989A
Authority
KR
South Korea
Prior art keywords
copper alloy
substrate
alloy composition
resin substrate
composition according
Prior art date
Application number
KR1019910701423A
Other languages
English (en)
Other versions
KR950007084B1 (ko
Inventor
아끼노리 요꼬야마
쓰또무 가쓰마따
히또시 나까지마
Original Assignee
에리 마사요시
아사히가세이고오교가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에리 마사요시, 아사히가세이고오교가부시끼가이샤 filed Critical 에리 마사요시
Publication of KR920701989A publication Critical patent/KR920701989A/ko
Application granted granted Critical
Publication of KR950007084B1 publication Critical patent/KR950007084B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0466—Alloys based on noble metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Powder Metallurgy (AREA)
  • Non-Adjustable Resistors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

내용 없음

Description

동합금계 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (14)

  1. 일반식 Agu cuy(단, 0.001≤x≤0.999, 0.001≤y≤0.999, x+y=1, 원자비)로 나타나며, 동합금 분말 100 중량부, 유기 바인더 5∼200 중량부 및 동산화물을 제거할 수 있는 첨가제 0.01∼100 중량부로써된 동합금계 조성물.
  2. 제1항에 있어서, 상기 일반식 Arg Cuy로 나타내는 동합금 입자가 0.001≤x≤0.4, 0.6≤yx≤0.999(원자비)의 범위에서, 동합금 입자 표면의 은농도가 평균의 은농도 보다 높고, 표면근방에서, 내부로 부터 표면에 향하여 은농도가 증가하는 영역을 갖는 것을 특징으로 하는 동합금계 조성물.
  3. 제2항에 있어서, 상기 동합금 분말의 표면의 은농도가 평균의 은농도의 2.1배 이상임을 특징으로 하는 동합금계 조성물.
  4. 제1항 내지 제3항중 어느 한항에 있어서, 상기 동합금 분말의 평균 입경이 0.1-100㎛임을 특징으로 하는 동합금계 조성물.
  5. 제1항 내지 제3항중 어느 한항에 있어서, 상기 동합금계 분말이 아토마이즈법을 사용하여서 제조됨을 특징으로 하는 동합금계 조성물.
  6. 제1항 내지 제3항중 어느 한 항에 있어서, 상기 유기 바인더가 열경화성 수지, 열가소성 수지, 전자선 경화성 수지, 광경화성 수지, 전자선 분해형 수지, 광분해형 수지로부터 선택된 1종 이상임을 특징으로 하는 동합금계 조성물.
  7. 제1항 내지 제3항중 어느 한 항에 있어서, 동산화물을 제거할 수있는 첨가물이 지방산 및 그 금속염, 디카르복실산, 옥시카르복실산, 페놀류, 금속킬레이트 형성제, 고급 지방족아민, 유기티타네이트 화합물, 로진, 안트라센 및 그 유도체로부터 선택된 1종 이상을 함유함을 특징으로 하는 동합금계 조성물.
  8. 청구항 제1항 내지 7항중 어느 한 항 기재의 동합금계 조성물을 유리에폭시수지 기판, 종이페놀수지 기판, 종이에폭시수지 기판, 폴리에스테르수지 기판, 폴리술폰수지 기판, 폴리에테르이미드수지 기판, 폴리이미드수지 기판, BT 수지 기판, 폴리에테르술폰수지 기판, 유리폴리이미드수지 기판, 폴리부타디엔수지 기판, 폴리페닐렌에테르수지 기판, 폴리페닐렌술파이드수지 기판, 플루오로수지 기판, 알루미나기판, 질화알루미늄 기판, 알루미늄기판, 스테인레스강 기판의 경질 기판 또는 유연성 기판으로 부터 선택된 1종 이상의 기판상에 인쇄하여 얻어지는 성형물.
  9. 청구항 제1항 내지 7항중 어느 한 항 기재의 동합금 조성물로써 된 스크린 인쇄용 페이스트.
  10. 청구항 제1항 내지 7항중 어느 한 항 기재의 동합금 조성물로써 된 전자파 실드용 페이스트.
  11. 청구항 제1항 내지 7항중 어느 한 항 기재의 동합금 조성물로써 된 도전회로용 페이스트.
  12. 청구항 제1항 내지 7항중 어느 한 항 기재의 동합금 조성물로써 된 도전성 접착제.
  13. 청구항 제1항 내지 7항중 어느 한 항 기재의 동합금 조성물로써 된 전극용 페이스트.
  14. 청구항 제1항 내지 7항중 어느 한 항 기재의 동합금 조성물로써된 스루홀용 페이스트
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910701423A 1990-02-23 1991-02-22 동합금계 조성물 KR950007084B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2041091A JP2702796B2 (ja) 1990-02-23 1990-02-23 銀合金導電性ペースト
JP90-04091 1990-02-23
JP90-041091 1990-02-23
PCT/JP1991/000229 WO1991013445A1 (fr) 1990-02-23 1991-02-22 Composition d'alliage cuivreux
CN91102031A CN1042983C (zh) 1990-02-23 1991-03-28 铜合金系组合物

Publications (2)

Publication Number Publication Date
KR920701989A true KR920701989A (ko) 1992-08-12
KR950007084B1 KR950007084B1 (ko) 1995-06-30

Family

ID=36778100

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701423A KR950007084B1 (ko) 1990-02-23 1991-02-22 동합금계 조성물

Country Status (11)

Country Link
US (1) US5242511A (ko)
EP (1) EP0470262B1 (ko)
JP (1) JP2702796B2 (ko)
KR (1) KR950007084B1 (ko)
CN (1) CN1042983C (ko)
AT (1) ATE181452T1 (ko)
CA (1) CA2055473C (ko)
DE (1) DE69131337T2 (ko)
HK (1) HK1004870A1 (ko)
RU (1) RU2096847C1 (ko)
WO (1) WO1991013445A1 (ko)

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HK1004870A1 (en) 1998-12-11
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EP0470262A1 (en) 1992-02-12
JP2702796B2 (ja) 1998-01-26
JPH03245404A (ja) 1991-11-01
WO1991013445A1 (fr) 1991-09-05
DE69131337D1 (de) 1999-07-22
US5242511A (en) 1993-09-07
CN1065280A (zh) 1992-10-14
ATE181452T1 (de) 1999-07-15
CN1042983C (zh) 1999-04-14
EP0470262A4 (en) 1992-08-05
DE69131337T2 (de) 2000-02-03
RU2096847C1 (ru) 1997-11-20
EP0470262B1 (en) 1999-06-16

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