KR910020139A - 열전도성 접착제 - Google Patents
열전도성 접착제 Download PDFInfo
- Publication number
- KR910020139A KR910020139A KR1019910007335A KR910007335A KR910020139A KR 910020139 A KR910020139 A KR 910020139A KR 1019910007335 A KR1019910007335 A KR 1019910007335A KR 910007335 A KR910007335 A KR 910007335A KR 910020139 A KR910020139 A KR 910020139A
- Authority
- KR
- South Korea
- Prior art keywords
- conductive adhesive
- thermally conductive
- adhesive material
- material according
- pitch
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0281—Conductive fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 열전도성 접착제가 사용되는 일반적인 전자 패키징 배열의 개략적인 단면도이다. 제2도는 본 발명에 따르는 접착층의 현미경사진이다. 제2a도는 제2도의 접착층 내의 대표적인 3차원적 섬유 배치에 관환 벡터 다이아그램이다.
Claims (10)
- 3차원적 구조의 피치계 탄소섬유 약 20 내지 약 60중량%로 충진된 접착성 수지를 포함하는 열 전도성 접착재료.
- 제1항에 있어서, 페이스트의 형태로 존재하는 열 전도성 접착재료.
- 제1항에 있어서, 필름의 형태로 존재하는 열 전도성 접착재료.
- 제1항에 있어서, 접착성 수지가 열가소성, 열경화성, 탄성중합체성 수지 및 이들의 조합물로 이루어진 그룹중에서 선택되는 열전도성 접착재료.
- 제1항에 있어서, 열전도도가 약 6 내지 12 (BTU) (in)/(ft2) (3f)의 범위 내인 열전도성 접착재료.
- 제1항에 있어서, 접착성 수지가 열경화성 수지인 열전도성 접착재료.
- 제6항에 있어서, 피치계 탄소 섬유가 메소페이지 피치(Mesophase pitch) 인 열전도성 접착재료.
- 3차원적 구조의 피치계 탄소섬우 약 20 내지 약 60중량%로 충진된 접착성 수지층에 의해 결합된 부품을 함유하는 전자 시스템.
- 제8 항에 있어서, 접착재료가 열가소성, 열경화성, 탄성중합체성 수지 및 이들의 조합물로 이루어진 그룹중에서 선택되는 시스템.
- 제9항에 있어서, 접착성 수지가 열경화성 수지인 시스템.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/520,286 US5026748A (en) | 1990-05-07 | 1990-05-07 | Thermally conductive adhesive |
US520,286 | 1990-05-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR910020139A true KR910020139A (ko) | 1991-12-19 |
Family
ID=24071950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910007335A KR910020139A (ko) | 1990-05-07 | 1991-05-07 | 열전도성 접착제 |
Country Status (15)
Country | Link |
---|---|
US (1) | US5026748A (ko) |
EP (1) | EP0456428B1 (ko) |
JP (1) | JPH06212137A (ko) |
KR (1) | KR910020139A (ko) |
CN (1) | CN1041743C (ko) |
AT (1) | ATE128168T1 (ko) |
AU (1) | AU629157B2 (ko) |
BR (1) | BR9101849A (ko) |
CA (1) | CA2041807A1 (ko) |
DE (1) | DE69113108T2 (ko) |
ES (1) | ES2078443T3 (ko) |
IL (1) | IL97957A (ko) |
MX (1) | MX172824B (ko) |
RU (1) | RU2052483C1 (ko) |
TR (1) | TR25806A (ko) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USH1332H (en) | 1988-10-03 | 1994-07-05 | E. I. Du Pont De Nemours And Company | Thermal conductive material |
JP2880875B2 (ja) * | 1993-04-12 | 1999-04-12 | 日本電気株式会社 | 電子デバイス用接着剤 |
US5907273A (en) * | 1993-11-24 | 1999-05-25 | Rochester Gauges, Inc. | Linear positioning indicator |
JP3435925B2 (ja) * | 1995-08-25 | 2003-08-11 | ソニー株式会社 | 半導体装置 |
US6084299A (en) | 1995-11-09 | 2000-07-04 | International Business Machines Corporation | Integrated circuit package including a heat sink and an adhesive |
US5930117A (en) * | 1996-05-07 | 1999-07-27 | Sheldahl, Inc. | Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer |
US5695847A (en) * | 1996-07-10 | 1997-12-09 | Browne; James M. | Thermally conductive joining film |
WO1998040431A1 (en) * | 1997-03-11 | 1998-09-17 | Amoco Corporation | Thermally conductive film and method for the preparation thereof |
JP2000281995A (ja) * | 1999-03-30 | 2000-10-10 | Polymatech Co Ltd | 熱伝導性接着フィルムおよび半導体装置 |
US6644849B1 (en) * | 1999-09-20 | 2003-11-11 | Honeywell International, Inc. | Low precision temperature sensor for aircraft applications |
US6402866B1 (en) | 1999-09-30 | 2002-06-11 | International Business Machines Corporation | Powdered metallic sheet method for deposition of substrate conductors |
US6651736B2 (en) * | 2001-06-28 | 2003-11-25 | Intel Corporation | Short carbon fiber enhanced thermal grease |
US6804118B2 (en) * | 2002-03-15 | 2004-10-12 | Delphi Technologies, Inc. | Thermal dissipation assembly for electronic components |
DE10335155B4 (de) * | 2003-07-31 | 2006-11-30 | Infineon Technologies Ag | Verfahren zum Herstellen einer Anordnung eines elektrischen Bauelements auf einem Substrat |
US7550097B2 (en) * | 2003-09-03 | 2009-06-23 | Momentive Performance Materials, Inc. | Thermal conductive material utilizing electrically conductive nanoparticles |
US20090127801A1 (en) * | 2003-11-14 | 2009-05-21 | Wild River Consulting Group, Llc | Enhanced property metal polymer composite |
US20110236699A1 (en) * | 2003-11-14 | 2011-09-29 | Tundra Composites, LLC | Work piece comprising metal polymer composite with metal insert |
BR122014029746B1 (pt) * | 2003-11-14 | 2019-09-17 | Wild River Consulting Group, Llc | Método de fabricação de um compósito polimérico metálico |
US9105382B2 (en) | 2003-11-14 | 2015-08-11 | Tundra Composites, LLC | Magnetic composite |
TWI253467B (en) * | 2003-12-23 | 2006-04-21 | Hon Hai Prec Ind Co Ltd | Thermal interface material and method for making same |
JP3720044B1 (ja) * | 2005-03-22 | 2005-11-24 | 株式会社物産ナノテク研究所 | 複合材料 |
US20090298976A1 (en) * | 2005-10-26 | 2009-12-03 | Hiroyuki Yano | Fiber-Reinforced Composition Resin Composition, Adhesive and Sealant |
KR101597068B1 (ko) * | 2006-02-09 | 2016-02-24 | 와일드 리버 컨설팅 그룹 엘엘씨 | 증강된 점탄성 및 열적 특성을 갖는 금속 중합체 복합물 |
CN101449374B (zh) * | 2006-06-08 | 2011-11-09 | 国际商业机器公司 | 高热传导性柔软片及其制造方法 |
US8017674B2 (en) * | 2006-07-28 | 2011-09-13 | Teijin Limited | Heat-conductive adhesive |
JP2008227279A (ja) * | 2007-03-14 | 2008-09-25 | Sumitomo Electric Ind Ltd | プラガブル光トランシーバ |
JP2009036843A (ja) * | 2007-07-31 | 2009-02-19 | Sumitomo Electric Ind Ltd | 光トランシーバ |
CA2712124C (en) | 2008-01-18 | 2016-08-16 | Wild River Consulting Group, Llc | Melt molding polymer composite and method of making and using the same |
JP2010267954A (ja) * | 2009-04-15 | 2010-11-25 | Panasonic Corp | 電子機器 |
US9249283B2 (en) | 2009-04-29 | 2016-02-02 | Tundra Composites, LLC | Reduced density glass bubble polymer composite |
DE102009055099A1 (de) | 2009-12-21 | 2011-06-22 | tesa SE, 20253 | Hitzeaktiviert verklebbare Flächenelemente |
CN102130078B (zh) * | 2010-01-20 | 2013-03-13 | 财团法人工业技术研究院 | 导热绝缘复合膜层及芯片堆叠结构 |
DE102011009428A1 (de) * | 2011-01-26 | 2012-07-26 | Emitec Gesellschaft Für Emissionstechnologie Mbh | Thermoelektrisches Modul mit einer Wärmeleitschicht |
US8729398B2 (en) * | 2012-03-28 | 2014-05-20 | Deere & Company | Electrical assembly with compliant pins for heat dissipation |
CN107043538B (zh) * | 2012-07-07 | 2022-05-27 | 迪睿合电子材料有限公司 | 导热性片材 |
DE102015100863B4 (de) * | 2015-01-21 | 2022-03-03 | Infineon Technologies Ag | Verfahren zur Handhabung eines Produktsubstrats und ein verklebtes Substratsystem |
EP3479662B1 (en) | 2016-06-29 | 2023-03-01 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Cooling component carrier material by carbon structure within dielectric shell |
CN109788635B (zh) * | 2019-03-15 | 2020-04-21 | 深圳市满坤电子有限公司 | 一种印制电路板的加工方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4522771A (en) * | 1982-10-21 | 1985-06-11 | General Electric Company | Method of fabricating layer insulation for use in high-voltage electrical equipment |
US4689110A (en) * | 1983-12-22 | 1987-08-25 | Trw Inc. | Method of fabricating multilayer printed circuit board structure |
US4609586A (en) * | 1984-08-02 | 1986-09-02 | The Boeing Company | Thermally conductive printed wiring board laminate |
US4791076A (en) * | 1984-08-02 | 1988-12-13 | Hughes Aircraft Company | Graphite fiber reinforced silica matrix composite |
JPH0240274B2 (ja) * | 1984-12-14 | 1990-09-11 | Yokohama Rubber Co Ltd | Dodenseinetsukokagatasetsuchakusoseibutsu |
US4861653A (en) * | 1987-09-02 | 1989-08-29 | E. I. Du Pont De Nemours And Company | Pitch carbon fibers and batts |
JPH0623350B2 (ja) * | 1988-01-20 | 1994-03-30 | 信越ポリマー株式会社 | 異方導電性接着剤 |
IL91868A (en) * | 1988-10-03 | 1994-06-24 | Du Pont | Electric or electronic device charged |
CA2000086A1 (en) * | 1988-10-03 | 1990-04-03 | Clifford Karl Deakyne | Thermal conductive material |
JPH0375851A (ja) * | 1989-08-17 | 1991-03-29 | Nec Corp | 情報処理装置 |
-
1990
- 1990-05-07 US US07/520,286 patent/US5026748A/en not_active Expired - Fee Related
-
1991
- 1991-04-25 IL IL9795791A patent/IL97957A/en not_active IP Right Cessation
- 1991-04-29 AU AU76137/91A patent/AU629157B2/en not_active Ceased
- 1991-05-02 JP JP3128213A patent/JPH06212137A/ja active Pending
- 1991-05-03 EP EP91304030A patent/EP0456428B1/en not_active Expired - Lifetime
- 1991-05-03 AT AT91304030T patent/ATE128168T1/de not_active IP Right Cessation
- 1991-05-03 DE DE69113108T patent/DE69113108T2/de not_active Expired - Fee Related
- 1991-05-03 CA CA002041807A patent/CA2041807A1/en not_active Abandoned
- 1991-05-03 ES ES91304030T patent/ES2078443T3/es not_active Expired - Lifetime
- 1991-05-06 MX MX025667A patent/MX172824B/es unknown
- 1991-05-06 RU SU914895345A patent/RU2052483C1/ru active
- 1991-05-06 TR TR91/0473A patent/TR25806A/xx unknown
- 1991-05-07 BR BR919101849A patent/BR9101849A/pt unknown
- 1991-05-07 CN CN91103592A patent/CN1041743C/zh not_active Expired - Fee Related
- 1991-05-07 KR KR1019910007335A patent/KR910020139A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0456428A3 (en) | 1992-02-26 |
EP0456428B1 (en) | 1995-09-20 |
IL97957A0 (en) | 1992-06-21 |
DE69113108D1 (de) | 1995-10-26 |
CA2041807A1 (en) | 1991-11-08 |
AU629157B2 (en) | 1992-09-24 |
JPH06212137A (ja) | 1994-08-02 |
BR9101849A (pt) | 1991-12-17 |
TR25806A (tr) | 1993-09-01 |
RU2052483C1 (ru) | 1996-01-20 |
ATE128168T1 (de) | 1995-10-15 |
DE69113108T2 (de) | 1996-05-09 |
ES2078443T3 (es) | 1995-12-16 |
CN1041743C (zh) | 1999-01-20 |
US5026748A (en) | 1991-06-25 |
CN1057282A (zh) | 1991-12-25 |
AU7613791A (en) | 1991-11-07 |
MX172824B (es) | 1994-01-14 |
EP0456428A2 (en) | 1991-11-13 |
IL97957A (en) | 1994-04-12 |
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