KR910020139A - 열전도성 접착제 - Google Patents

열전도성 접착제 Download PDF

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Publication number
KR910020139A
KR910020139A KR1019910007335A KR910007335A KR910020139A KR 910020139 A KR910020139 A KR 910020139A KR 1019910007335 A KR1019910007335 A KR 1019910007335A KR 910007335 A KR910007335 A KR 910007335A KR 910020139 A KR910020139 A KR 910020139A
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KR
South Korea
Prior art keywords
conductive adhesive
thermally conductive
adhesive material
material according
pitch
Prior art date
Application number
KR1019910007335A
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English (en)
Inventor
토마스 아담스 제롬
알렌 요스트 브루스
Original Assignee
이.아이.듀퐁 드 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 이.아이.듀퐁 드 네모아 앤드 캄파니 filed Critical 이.아이.듀퐁 드 네모아 앤드 캄파니
Publication of KR910020139A publication Critical patent/KR910020139A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음

Description

열전도성 접착제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 열전도성 접착제가 사용되는 일반적인 전자 패키징 배열의 개략적인 단면도이다. 제2도는 본 발명에 따르는 접착층의 현미경사진이다. 제2a도는 제2도의 접착층 내의 대표적인 3차원적 섬유 배치에 관환 벡터 다이아그램이다.

Claims (10)

  1. 3차원적 구조의 피치계 탄소섬유 약 20 내지 약 60중량%로 충진된 접착성 수지를 포함하는 열 전도성 접착재료.
  2. 제1항에 있어서, 페이스트의 형태로 존재하는 열 전도성 접착재료.
  3. 제1항에 있어서, 필름의 형태로 존재하는 열 전도성 접착재료.
  4. 제1항에 있어서, 접착성 수지가 열가소성, 열경화성, 탄성중합체성 수지 및 이들의 조합물로 이루어진 그룹중에서 선택되는 열전도성 접착재료.
  5. 제1항에 있어서, 열전도도가 약 6 내지 12 (BTU) (in)/(ft2) (3f)의 범위 내인 열전도성 접착재료.
  6. 제1항에 있어서, 접착성 수지가 열경화성 수지인 열전도성 접착재료.
  7. 제6항에 있어서, 피치계 탄소 섬유가 메소페이지 피치(Mesophase pitch) 인 열전도성 접착재료.
  8. 3차원적 구조의 피치계 탄소섬우 약 20 내지 약 60중량%로 충진된 접착성 수지층에 의해 결합된 부품을 함유하는 전자 시스템.
  9. 제8 항에 있어서, 접착재료가 열가소성, 열경화성, 탄성중합체성 수지 및 이들의 조합물로 이루어진 그룹중에서 선택되는 시스템.
  10. 제9항에 있어서, 접착성 수지가 열경화성 수지인 시스템.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910007335A 1990-05-07 1991-05-07 열전도성 접착제 KR910020139A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/520,286 US5026748A (en) 1990-05-07 1990-05-07 Thermally conductive adhesive
US520,286 1990-05-07

Publications (1)

Publication Number Publication Date
KR910020139A true KR910020139A (ko) 1991-12-19

Family

ID=24071950

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910007335A KR910020139A (ko) 1990-05-07 1991-05-07 열전도성 접착제

Country Status (15)

Country Link
US (1) US5026748A (ko)
EP (1) EP0456428B1 (ko)
JP (1) JPH06212137A (ko)
KR (1) KR910020139A (ko)
CN (1) CN1041743C (ko)
AT (1) ATE128168T1 (ko)
AU (1) AU629157B2 (ko)
BR (1) BR9101849A (ko)
CA (1) CA2041807A1 (ko)
DE (1) DE69113108T2 (ko)
ES (1) ES2078443T3 (ko)
IL (1) IL97957A (ko)
MX (1) MX172824B (ko)
RU (1) RU2052483C1 (ko)
TR (1) TR25806A (ko)

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Also Published As

Publication number Publication date
EP0456428A3 (en) 1992-02-26
EP0456428B1 (en) 1995-09-20
IL97957A0 (en) 1992-06-21
DE69113108D1 (de) 1995-10-26
CA2041807A1 (en) 1991-11-08
AU629157B2 (en) 1992-09-24
JPH06212137A (ja) 1994-08-02
BR9101849A (pt) 1991-12-17
TR25806A (tr) 1993-09-01
RU2052483C1 (ru) 1996-01-20
ATE128168T1 (de) 1995-10-15
DE69113108T2 (de) 1996-05-09
ES2078443T3 (es) 1995-12-16
CN1041743C (zh) 1999-01-20
US5026748A (en) 1991-06-25
CN1057282A (zh) 1991-12-25
AU7613791A (en) 1991-11-07
MX172824B (es) 1994-01-14
EP0456428A2 (en) 1991-11-13
IL97957A (en) 1994-04-12

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