KR900006995A - 밀봉체 - Google Patents
밀봉체 Download PDFInfo
- Publication number
- KR900006995A KR900006995A KR1019890014265A KR890014265A KR900006995A KR 900006995 A KR900006995 A KR 900006995A KR 1019890014265 A KR1019890014265 A KR 1019890014265A KR 890014265 A KR890014265 A KR 890014265A KR 900006995 A KR900006995 A KR 900006995A
- Authority
- KR
- South Korea
- Prior art keywords
- encapsulated
- component
- thermally conductive
- conductive material
- body according
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/421—Polyesters
- H01B3/422—Linear saturated polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 본 발명에 따른 변압기의 개략적인 횡단면도.
Claims (4)
- 개량된 밀봉체는 전기적으로 능동적인 콤포넌트를 갖고있는 전기 소자를 포함하며, 상기 컴포넌트는 전기적 절연 재료로 캡슐되어 있고, 상기 콤포넌트를 포함하는 상기 소자는 상기 아티클을 위한 외부면을 형성하는 열적 전도 재료로 캡슐되어 있는 것을 특징으로 하는 밀봉체.
- 제1항에 있어서, 상기 열적 전도 재료를 메조페이즈 피치 기저카본 파이버의 3차원 배열로 보강된 수지인 것을 특징으로 하는 밀봉체.
- 제2항에 있어서, 상기 카본 파이버는 거의 판자 모양이 구조로 되어 있는 것을 특징으로 하는 밀봉체.
- 제1,2 또는 3항에 있어서, 상기 전지 소자는 두-스텝 주입 모울딩 처리에 의해 캡슐되어 있으며, 상기 수지는 열가소성인 것을 특징으로 하는 밀봉체.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25177288A | 1988-10-03 | 1988-10-03 | |
US251,772 | 1988-10-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900006995A true KR900006995A (ko) | 1990-05-09 |
KR0132052B1 KR0132052B1 (ko) | 1998-04-24 |
Family
ID=22953347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890014265A KR0132052B1 (ko) | 1988-10-03 | 1989-10-04 | 봉입된 전기 및 전자 소자 |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP0375851B1 (ko) |
JP (1) | JPH02198114A (ko) |
KR (1) | KR0132052B1 (ko) |
AU (1) | AU637583B2 (ko) |
BR (1) | BR8905014A (ko) |
CA (1) | CA2000087A1 (ko) |
DE (1) | DE68923945T2 (ko) |
ES (1) | ES2077573T3 (ko) |
HK (1) | HK101896A (ko) |
IL (1) | IL91868A (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5026748A (en) * | 1990-05-07 | 1991-06-25 | E. I. Du Pont De Nemours And Company | Thermally conductive adhesive |
JPH06270175A (ja) * | 1991-05-15 | 1994-09-27 | E I Du Pont De Nemours & Co | 多段階圧縮成型により熱可塑性シート材料で封入したインサート |
IT1268492B1 (it) * | 1993-10-26 | 1997-03-04 | Hydor Srl | Metodo per realizzare apparecchiature elettromeccaniche funzionanti in immersione ed apparecchiatura ottenuta con il metodo |
US6198373B1 (en) * | 1997-08-19 | 2001-03-06 | Taiyo Yuden Co., Ltd. | Wire wound electronic component |
CA2309630A1 (en) * | 1997-11-13 | 1999-05-27 | James D. Miller | Heat pipe thermal management apparatus |
JPH11186003A (ja) * | 1997-12-25 | 1999-07-09 | Yazaki Corp | Ptc素子の放熱構造 |
DE10328373B4 (de) * | 2003-06-24 | 2015-10-08 | Continental Automotive Gmbh | Piezoelektrisches Bauteil mit Temperiervorrichtung und Verwendung des Bauteils |
WO2009138096A1 (de) * | 2008-05-13 | 2009-11-19 | Abb Technology Ag | Trockentransformator |
JP5534551B2 (ja) * | 2009-05-07 | 2014-07-02 | 住友電気工業株式会社 | リアクトル |
EP2355116A1 (en) | 2010-01-29 | 2011-08-10 | ABB Research Ltd. | An electric device and a method for manufacturing the device |
WO2020003484A1 (ja) * | 2018-06-29 | 2020-01-02 | 新電元工業株式会社 | 磁性部品 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3030597A (en) * | 1958-02-28 | 1962-04-17 | Westinghouse Electric Corp | Insulated electrical apparatus |
FR2003774A1 (ko) * | 1968-03-13 | 1969-11-14 | Licentia Gmbh | |
CH576206A5 (ko) * | 1974-08-06 | 1976-05-31 | Braun Franz | |
JPS51111862A (en) * | 1975-03-27 | 1976-10-02 | Denki Onkyo Co Ltd | Synthetic resin mold |
JPS51134869A (en) * | 1975-05-19 | 1976-11-22 | Hitachi Ltd | Mould coil |
US4138525A (en) * | 1976-02-11 | 1979-02-06 | Union Carbide Corporation | Highly-handleable pitch-based fibers |
JPS5450865A (en) * | 1977-09-30 | 1979-04-21 | Hitachi Ltd | Coil for electrical apparatus |
US4632798A (en) * | 1983-07-27 | 1986-12-30 | Celanese Corporation | Encapsulation of electronic components with anisotropic thermoplastic polymers |
LU85462A1 (fr) * | 1984-07-11 | 1986-02-12 | Univ Louvain | Nouvelles compositions polymeres,procedes pour leur production et leurs applications |
JPS6169813U (ko) * | 1984-10-12 | 1986-05-13 | ||
JPS61296068A (ja) * | 1985-06-20 | 1986-12-26 | シ−メンス、アクチエンゲゼルシヤフト | プラスチツクコンパウンド |
US4888247A (en) * | 1986-08-27 | 1989-12-19 | General Electric Company | Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite |
-
1989
- 1989-10-03 ES ES89118314T patent/ES2077573T3/es not_active Expired - Lifetime
- 1989-10-03 EP EP89118314A patent/EP0375851B1/en not_active Expired - Lifetime
- 1989-10-03 BR BR898905014A patent/BR8905014A/pt not_active IP Right Cessation
- 1989-10-03 IL IL9186889A patent/IL91868A/en not_active IP Right Cessation
- 1989-10-03 CA CA002000087A patent/CA2000087A1/en not_active Abandoned
- 1989-10-03 AU AU42449/89A patent/AU637583B2/en not_active Ceased
- 1989-10-03 DE DE68923945T patent/DE68923945T2/de not_active Expired - Fee Related
- 1989-10-03 JP JP1258641A patent/JPH02198114A/ja active Pending
- 1989-10-04 KR KR1019890014265A patent/KR0132052B1/ko not_active IP Right Cessation
-
1996
- 1996-06-13 HK HK101896A patent/HK101896A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU637583B2 (en) | 1993-06-03 |
ES2077573T3 (es) | 1995-12-01 |
KR0132052B1 (ko) | 1998-04-24 |
EP0375851A3 (en) | 1990-11-28 |
EP0375851A2 (en) | 1990-07-04 |
DE68923945D1 (de) | 1995-09-28 |
AU4244989A (en) | 1990-04-05 |
BR8905014A (pt) | 1990-05-08 |
HK101896A (en) | 1996-06-21 |
JPH02198114A (ja) | 1990-08-06 |
IL91868A (en) | 1994-06-24 |
CA2000087A1 (en) | 1990-04-03 |
DE68923945T2 (de) | 1996-04-25 |
IL91868A0 (en) | 1990-06-10 |
EP0375851B1 (en) | 1995-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |