KR910018487A - 도전성 폴리술폰수지 조성물 및 이것으로 부터 얻어지는 고내열 도전성 반도체용 성형품 - Google Patents
도전성 폴리술폰수지 조성물 및 이것으로 부터 얻어지는 고내열 도전성 반도체용 성형품 Download PDFInfo
- Publication number
- KR910018487A KR910018487A KR1019910005905A KR910005905A KR910018487A KR 910018487 A KR910018487 A KR 910018487A KR 1019910005905 A KR1019910005905 A KR 1019910005905A KR 910005905 A KR910005905 A KR 910005905A KR 910018487 A KR910018487 A KR 910018487A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- resin composition
- conductive
- parts
- resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/04—Polysulfides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Packaging Frangible Articles (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (4)
- (A) 방향족 폴리술폰 수지 5내지 95 중량%, 폴리페닐렌 술피드 수지 95 내지 5중량%로 이루어진 수지 조성물 100 중량부에 대해서, (B) 도전성 카아본 3 내지 40 중량부를 첨가하여 이루어진 도전성 폴리술폰 수지 조성물.
- 제1항에 있어서 (A) 방향족 폴리술폰수지 60 내지 95 중량%, 폴리페닐렌 술피드수지 40 내지 5 중량%로 이루어진 수지 조성물 100 중량부에 대해서, (B) 도전성 카아본 3 내지 25 중량부를 첨가하여 이루어진 도전성 폴리숲론 수지 조성물.
- 제1항에 있어서 (A) 방향족 폴리술폰수지 5 내지 60 중량%, 폴리페닐렌 술피드수지 95 내지 40 중량%로 이루어진 수지 조성물 100 중량부에 대해서, (B) 도전성 카아본 3 내지 25 중량부를 첨가하여 이루어진 도전성 폴리술폰 수지 조성물.
- (A) 방향족 폴리술폰 수지 5내지 95 중량%, 폴리페닐렌 술피드 수지 95 내지 5중량%로 이루어진 수지 조성물 100중량부에 대해서, (B) 도전성 카아본 3 내지 40중량부를 첨가하여 이루어진 도전성 폴리술폰 수지 조성물을 성형하여 얻어지는 성형품.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9649890 | 1990-04-13 | ||
JP2-096498/90 | 1990-04-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910018487A true KR910018487A (ko) | 1991-11-30 |
KR950001321B1 KR950001321B1 (ko) | 1995-02-17 |
Family
ID=14166761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910005905A KR950001321B1 (ko) | 1990-04-13 | 1991-04-12 | 도전성 폴리술폰수지 조성물 및 이것으로부터 얻어지는 고내열 도전성 반도체용 성형품 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5173524A (ko) |
EP (1) | EP0451803B1 (ko) |
JP (1) | JP3110787B2 (ko) |
KR (1) | KR950001321B1 (ko) |
DE (1) | DE69113094T2 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19702588A1 (de) * | 1997-01-24 | 1998-07-30 | Basf Ag | Thermoplastische Formmassen mit reduzierter Wasseraufnahme |
JP4789312B2 (ja) * | 2000-09-08 | 2011-10-12 | 株式会社クレハ | 基板用カセット |
FR2843975B1 (fr) * | 2002-09-04 | 2008-11-14 | Kermel | Fibres et fibrides, leur procede d'obtention, articles obtenus a partir de ces fibres et/ou fibrides. |
US7108899B2 (en) * | 2002-09-11 | 2006-09-19 | Entegris, Inc. | Chip tray with tacky surface |
US6926937B2 (en) * | 2002-09-11 | 2005-08-09 | Entegris, Inc. | Matrix tray with tacky surfaces |
EP1630201B1 (en) * | 2003-06-05 | 2014-12-10 | Toray Industries, Inc. | Polyphenylene sulfide resin compositions |
WO2007090166A2 (en) * | 2006-02-01 | 2007-08-09 | Polyone Corporation | Exothermic polyphenylene sulfide compounds |
JP6019752B2 (ja) * | 2012-05-25 | 2016-11-02 | Dic株式会社 | 導電性樹脂組成物、電子写真用転写ベルトおよび画像形成装置 |
JP2014024947A (ja) * | 2012-07-26 | 2014-02-06 | Dic Corp | ポリアリーレンスルフィド樹脂組成物および成形体 |
JP6973867B2 (ja) | 2017-10-30 | 2021-12-01 | エルジー・ケム・リミテッド | 導電性ポリアリーレンスルフィド樹脂組成物 |
US20230093987A1 (en) * | 2020-02-28 | 2023-03-30 | Dic Corporation | Method for optimizing manufacturing condition for polyarylene sulfide resin composite, and method for manufacturing resin composite |
WO2023174811A1 (en) * | 2022-03-18 | 2023-09-21 | Basf Se | Compositions comprising poly(arylene ether sulfones) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5898362A (ja) * | 1981-12-08 | 1983-06-11 | Mitsui Toatsu Chem Inc | 成形用樹脂組成物 |
JPS60249392A (ja) * | 1984-05-24 | 1985-12-10 | ティーディーケイ株式会社 | 電磁シ−ルド材料 |
US4703081A (en) * | 1986-04-08 | 1987-10-27 | Phillips Petroleum Company | Poly(arylene sulfide) resin ternary blends |
-
1991
- 1991-03-30 JP JP03091018A patent/JP3110787B2/ja not_active Expired - Lifetime
- 1991-04-05 US US07/680,735 patent/US5173524A/en not_active Expired - Lifetime
- 1991-04-10 DE DE69113094T patent/DE69113094T2/de not_active Expired - Fee Related
- 1991-04-10 EP EP91105654A patent/EP0451803B1/en not_active Expired - Lifetime
- 1991-04-12 KR KR1019910005905A patent/KR950001321B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0451803A1 (en) | 1991-10-16 |
JPH04218566A (ja) | 1992-08-10 |
DE69113094T2 (de) | 1996-05-09 |
KR950001321B1 (ko) | 1995-02-17 |
JP3110787B2 (ja) | 2000-11-20 |
EP0451803B1 (en) | 1995-09-20 |
US5173524A (en) | 1992-12-22 |
DE69113094D1 (de) | 1995-10-26 |
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