KR870008495A - 합성수지 유니트 - Google Patents

합성수지 유니트 Download PDF

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Publication number
KR870008495A
KR870008495A KR1019860004079A KR860004079A KR870008495A KR 870008495 A KR870008495 A KR 870008495A KR 1019860004079 A KR1019860004079 A KR 1019860004079A KR 860004079 A KR860004079 A KR 860004079A KR 870008495 A KR870008495 A KR 870008495A
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KR
South Korea
Prior art keywords
synthetic resin
conductive
unit according
resin unit
conductive synthetic
Prior art date
Application number
KR1019860004079A
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English (en)
Other versions
KR930011601B1 (ko
Inventor
화너 카르스텐
베르네 데프치크 한스
Original Assignee
바이엘 아크티엔게젤샤프트
루디 마이어
요아함 그램
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 바이엘 아크티엔게젤샤프트, 루디 마이어, 요아함 그램 filed Critical 바이엘 아크티엔게젤샤프트
Publication of KR870008495A publication Critical patent/KR870008495A/ko
Application granted granted Critical
Publication of KR930011601B1 publication Critical patent/KR930011601B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B29K2083/005—LSR, i.e. liquid silicone rubbers, or derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

내용 없음

Description

합성수지 유니트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 프린트배선판 배기통의 횡단면도. 제 2 도는 프린트배선판의 평면도. 제 3 도는 프린트배선판의 종단면도.

Claims (8)

  1. 전류로를 갖는 합성수지 유니트(unit), 특히 절연재 및 전도재로 이루어진 프린트배선판에 있어서 절연성 합성수지 성형유니트가, 적어도 일부에 전도성 합성수지가 전류로(4)로서 배열된 감입소(recess)(3)및/또는 천공(6)을 가짐을 특징으로 하는 합성수지유니트.
  2. 제 1 항에 있어서, 전도성 합성수지의 전도도가 0.1S/cm보다 큼을 특징으로 하는 합성수지유니트.
  3. 제 1 항 또는 제 2 항에 있어서, 합성수지중의 적어도 하나가 사출성형 열가소성수지임을 특징으로 하는 합성수지유니트.
  4. 제 1 항 내지 제 3 항중 어느 하나에 있어서, 신장된 감입소(3)의 깊이가 0.2 내지 4mm, 특히 0.8 내지 2mm임을 특징으로 하는 합성수지유니트.
  5. 제 1 항 내지 제 4 항중 어느 하나에 있어서, 천공(6)이 전도성 합성수지로 부분적으로만 채워진 구멍임을 특징으로 하는 합성수지유니트.
  6. 제 1 항 내지 제 5 항중 어느 하나에 있어서, 전도성 합성수지가 적어도 보호층(5)에 의해 피복됨을 특징으로하는 합성수지유니트.
  7. 여러 부품(component)들을 사출 성형시켜 제 1 항 내지 제 6 항중 어느 하나에 따른 합성수지유니트를 제조하는 방법에 있어서, 부품중의 하나를 전도성 합성수지로부터 적어도 하나의 전류로(4) 형태로 사출성형시킴을 특징으로 하는 방법.
  8. 제 7 항에 있어서, 전류로(4)로서 작용하는 전도성 합성수지를, 사출 성형에 의해 절연성 합성 수지로부터 제조한 성형유니트(2)의 감입소(3) 또는 천공(6)으로 적어도 부분적으로 사출시킴을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860004079A 1985-05-25 1986-05-24 합성수지 유니트 KR930011601B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853518975 DE3518975A1 (de) 1985-05-25 1985-05-25 Kunststoffteil
DEP3518975.4 1985-05-25

Publications (2)

Publication Number Publication Date
KR870008495A true KR870008495A (ko) 1987-09-26
KR930011601B1 KR930011601B1 (ko) 1993-12-13

Family

ID=6271723

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860004079A KR930011601B1 (ko) 1985-05-25 1986-05-24 합성수지 유니트

Country Status (6)

Country Link
US (1) US4748068A (ko)
EP (1) EP0208087B1 (ko)
JP (1) JPS61276288A (ko)
KR (1) KR930011601B1 (ko)
DE (2) DE3518975A1 (ko)
ES (1) ES8704305A1 (ko)

Families Citing this family (17)

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Publication number Priority date Publication date Assignee Title
EP0226904A3 (de) * 1985-12-27 1989-05-24 Hans Widmaier Fabrik für Apparate der Fernmelde- und Feinwerktechnik Schaltungsplatte, insbesondere für Tastenwahlblöcke, sowie Verfahren zur Herstellung einer solchen Schaltungsplatte
US5156772A (en) * 1988-05-11 1992-10-20 Ariel Electronics, Inc. Circuit writer materials
JPH0817269B2 (ja) * 1988-05-11 1996-02-21 株式会社ソフィアシステムズ 回路ライター
US5099090A (en) * 1988-05-11 1992-03-24 Ariel Electronics, Inc. Circuit writer
US4898759A (en) * 1988-07-27 1990-02-06 Nidec Corporation Molded printed circuit board for use with a brushless electric motor
DE4104853A1 (de) * 1991-02-16 1992-08-20 Standard Elektrik Lorenz Ag Vorrichtung zur herstellung von loesbaren elektrischen verbindungen
US5414224A (en) * 1991-04-01 1995-05-09 Filial Vsesojuznogo Nauchno Issledovatelskogo Instituta Multilayer printed circuit board and method of manufacturing same
US5185654A (en) * 1991-11-27 1993-02-09 Motorola, Inc. Electrostatic RF absorbant circuit carrier assembly and method for making the same
DE19704921C2 (de) * 1997-02-10 1999-06-02 Inotech Kunststofftechnik Gmbh Elektronisches Bauteil
DE19707177A1 (de) * 1997-02-22 1998-09-03 Inotech Kunststofftechnik Gmbh Induktivität
DE19836968C2 (de) * 1998-08-14 2002-05-08 Huf Huelsbeck & Fuerst Gmbh Elektrischer Zündanlaßschalter für Motorfahrzeuge
DE19955538B4 (de) * 1999-11-18 2014-06-05 Morpho Cards Gmbh Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Verfahren zur Herstellung einer Leiterbahnträgerschicht Spritzgusswerkzeug zur Durchführung des Verfahrens zur Herstellung einer Leiterbahnträgerschicht
EP1245361A1 (de) * 2001-03-26 2002-10-02 Abb Research Ltd. Verfahren zum Spritzgiessen von Formteilen mit elektrischer Leitungsfunktion und elektrisches Bauelement mit einem solchen Formteil
DE102005050407A1 (de) * 2005-10-19 2007-04-26 Wilo Ag Wickelkopfkappe mit Motorverschaltung
US20080191001A1 (en) * 2007-02-08 2008-08-14 Kapoor Chandaria Packaging having protective materials incorporated therein
DE102010045199A1 (de) 2010-09-13 2012-03-15 Trw Automotive Electronics & Components Gmbh Schaltergehäuse für kapazitive Schalter
US9065213B2 (en) * 2013-07-03 2015-06-23 Tyco Electronics Corporation Electrical connector for transmitting data signals

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US3561110A (en) * 1967-08-31 1971-02-09 Ibm Method of making connections and conductive paths
GB1565207A (en) * 1975-09-05 1980-04-16 Sinclair Radionics Printed circuits
FR2402379A1 (fr) * 1977-08-31 1979-03-30 Cayrol Pierre Henri Perfectionnements apportes aux circuits imprimes
GB2033667A (en) * 1978-11-06 1980-05-21 Powers C D Improvements in circuit boards
US4295183A (en) * 1979-06-29 1981-10-13 International Business Machines Corporation Thin film metal package for LSI chips
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US4614837A (en) * 1985-04-03 1986-09-30 Allied Corporation Method for placing electrically conductive paths on a substrate

Also Published As

Publication number Publication date
DE3672351D1 (de) 1990-08-02
ES555279A0 (es) 1987-03-16
DE3518975A1 (de) 1986-11-27
ES8704305A1 (es) 1987-03-16
US4748068A (en) 1988-05-31
EP0208087A2 (de) 1987-01-14
JPS61276288A (ja) 1986-12-06
KR930011601B1 (ko) 1993-12-13
EP0208087A3 (en) 1987-05-27
EP0208087B1 (de) 1990-06-27

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