KR910019746A - 인서트 전극 몰드체의 제조방법 - Google Patents

인서트 전극 몰드체의 제조방법 Download PDF

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Publication number
KR910019746A
KR910019746A KR1019910006718A KR910006718A KR910019746A KR 910019746 A KR910019746 A KR 910019746A KR 1019910006718 A KR1019910006718 A KR 1019910006718A KR 910006718 A KR910006718 A KR 910006718A KR 910019746 A KR910019746 A KR 910019746A
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KR
South Korea
Prior art keywords
insert
insert electrode
mold body
manufacturing
electrode mold
Prior art date
Application number
KR1019910006718A
Other languages
English (en)
Other versions
KR940003172B1 (ko
Inventor
다가유키 오오니시
도시아키 하다
Original Assignee
시키모리야
미쓰비시덴키가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시키모리야, 미쓰비시덴키가부시키가이샤 filed Critical 시키모리야
Publication of KR910019746A publication Critical patent/KR910019746A/ko
Application granted granted Critical
Publication of KR940003172B1 publication Critical patent/KR940003172B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70—Completely encapsulating inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/84—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks by moulding material on preformed parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/0056—Apparatus or processes specially adapted for the manufacture of electric switches comprising a successive blank-stamping, insert-moulding and severing operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacture Of Switches (AREA)

Abstract

내용 없음

Description

인서트 전극 몰드체의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 이 발명의 한실시예의 이면도, 제2도는 제1도의 인서트 전극 몰드체애 내장된 1차 성형품의 평면도, 제3도는 1차 성형품이 가공되기전의 인서트 전극체의 평면도.

Claims (1)

  1. 복수개의 인서트전극자를 인서트 성형하여서된 인서트 전극 몰드체의 제조방법에 있어서, 복수개의 상기 인서트전극자가 일체화된 인서트전극체를 프리몰드하고 그후 상기 인서트 전극체를 절단하여 전기적으로 독립된 복수개의 상기 인서트전극자로된 1차성형품으로하며, 다음에 이 1차 성형품을 인서트 성형하여 된 것을 특징으로 하는 인서트전극 몰드체의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910006718A 1990-05-15 1991-04-26 인서트전극몰드체의 제조방법 KR940003172B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP122996 1990-05-15
JP2122996A JPH0419114A (ja) 1990-05-15 1990-05-15 インサート電極モールド体の製造方法
JP2-122996 1990-05-15

Publications (2)

Publication Number Publication Date
KR910019746A true KR910019746A (ko) 1991-12-19
KR940003172B1 KR940003172B1 (ko) 1994-04-15

Family

ID=14849699

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910006718A KR940003172B1 (ko) 1990-05-15 1991-04-26 인서트전극몰드체의 제조방법

Country Status (4)

Country Link
US (1) US6162381A (ko)
JP (1) JPH0419114A (ko)
KR (1) KR940003172B1 (ko)
DE (1) DE4115883C2 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4239188C2 (de) * 1992-11-21 1995-08-03 Tele Plast Bleyer Und Gaertner Fassung für einen metallischen Kontaktstift
DE19614879C1 (de) * 1996-04-16 1997-07-31 Preh Elektro Feinmechanik Verfahren zum lötfreien Befestigen von Bauelementen auf Leiterbahnen und ein nach dem Verfahren hergestelltes elektrisches Bauteil
DE19628379A1 (de) * 1996-07-13 1998-01-15 Pierburg Ag Kunststoff-Drosselklappenstutzen
JP3347033B2 (ja) * 1997-09-30 2002-11-20 三菱電機株式会社 インサート導体及びブラシホルダの製造方法
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
US7038337B2 (en) * 2003-05-20 2006-05-02 Siemens Vdo Automotive Corporation EMI suppression in permanent magnet DC motors having PCB outside motor in connector and overmolded
DE112007001950T5 (de) 2006-08-21 2009-07-02 Innotec Corporation, Zeeland Elektrische Vorrichtung mit platinenloser Montageanordnung für elektrische Komponenten
DE102006046984A1 (de) * 2006-10-04 2008-04-10 Siemens Ag Verfahren zur Herstellung eines Trägerelements mit einem Winkelsensor
US8408773B2 (en) 2007-03-19 2013-04-02 Innotec Corporation Light for vehicles
US7712933B2 (en) 2007-03-19 2010-05-11 Interlum, Llc Light for vehicles
GB0714034D0 (en) * 2007-07-18 2007-08-29 Deepstream Technologies Ltd Improvements in and relating to manufacture of electrical circuits for electrical components
US8230575B2 (en) 2007-12-12 2012-07-31 Innotec Corporation Overmolded circuit board and method
US7815339B2 (en) 2008-01-09 2010-10-19 Innotec Corporation Light module
US9022631B2 (en) 2012-06-13 2015-05-05 Innotec Corp. Flexible light pipe
FR3072322B1 (fr) * 2017-10-13 2023-03-24 Psa Automobiles Sa Piece en materiau composite avec insert metallique

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3216089A (en) * 1961-10-23 1965-11-09 Lockheed Aircraft Corp Method of connecting electrical components to spaced frame containing circuits and removing the frames
DE1590728C3 (de) * 1966-05-28 1975-02-20 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zur Herstellung mehrerer nebeneinander angeordneter Kontaktelemente, insbesondere für Schiebeschalter
US4158254A (en) * 1976-06-18 1979-06-19 Hoshidenki-Seizo Kabushiki Kaisha Method of making a spark gap device for a cathode ray tube socket
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
US4470786A (en) * 1981-07-28 1984-09-11 Omron Tateisi Electronics Co. Molding apparatus with retractable preform support pins
US4895536A (en) * 1984-05-11 1990-01-23 Amp Incorporated Lead frame assembly having severable electrical circuit sections
JPS61121213A (ja) * 1984-11-17 1986-06-09 アルプス電気株式会社 スイツチ装置の製造方法
DE3515911A1 (de) * 1985-05-03 1986-11-06 SWF Auto-Electric GmbH, 7120 Bietigheim-Bissingen Elektrischer schalter, insbesondere lenkstockschalter fuer kraftfahrzeuge
US4859632A (en) * 1987-12-28 1989-08-22 Siemens Corporate Research And Support, Inc. Method for manufacturing the same
US5049055A (en) * 1987-12-31 1991-09-17 Sanken Electric Co., Ltd. Mold assembly
US4965933A (en) * 1989-05-22 1990-10-30 The Cherry Corporation Process for making insert molded circuit
US5016337A (en) * 1990-02-26 1991-05-21 Kimie Ejima Production method for net structures

Also Published As

Publication number Publication date
DE4115883A1 (de) 1991-11-21
KR940003172B1 (ko) 1994-04-15
US6162381A (en) 2000-12-19
JPH0419114A (ja) 1992-01-23
DE4115883C2 (de) 1995-01-19

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