ES555279A0 - Procedimiento para la preparacion de una unidad de material sintetico con vias de corriente electrica - Google Patents

Procedimiento para la preparacion de una unidad de material sintetico con vias de corriente electrica

Info

Publication number
ES555279A0
ES555279A0 ES555279A ES555279A ES555279A0 ES 555279 A0 ES555279 A0 ES 555279A0 ES 555279 A ES555279 A ES 555279A ES 555279 A ES555279 A ES 555279A ES 555279 A0 ES555279 A0 ES 555279A0
Authority
ES
Spain
Prior art keywords
procedure
preparation
unit
electrical current
synthetic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES555279A
Other languages
English (en)
Other versions
ES8704305A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Publication of ES555279A0 publication Critical patent/ES555279A0/es
Publication of ES8704305A1 publication Critical patent/ES8704305A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B29K2083/005—LSR, i.e. liquid silicone rubbers, or derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
ES555279A 1985-05-25 1986-05-23 Procedimiento para la preparacion de una unidad de material sintetico con vias de corriente electrica Expired ES8704305A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853518975 DE3518975A1 (de) 1985-05-25 1985-05-25 Kunststoffteil

Publications (2)

Publication Number Publication Date
ES555279A0 true ES555279A0 (es) 1987-03-16
ES8704305A1 ES8704305A1 (es) 1987-03-16

Family

ID=6271723

Family Applications (1)

Application Number Title Priority Date Filing Date
ES555279A Expired ES8704305A1 (es) 1985-05-25 1986-05-23 Procedimiento para la preparacion de una unidad de material sintetico con vias de corriente electrica

Country Status (6)

Country Link
US (1) US4748068A (es)
EP (1) EP0208087B1 (es)
JP (1) JPS61276288A (es)
KR (1) KR930011601B1 (es)
DE (2) DE3518975A1 (es)
ES (1) ES8704305A1 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0226904A3 (de) * 1985-12-27 1989-05-24 Hans Widmaier Fabrik für Apparate der Fernmelde- und Feinwerktechnik Schaltungsplatte, insbesondere für Tastenwahlblöcke, sowie Verfahren zur Herstellung einer solchen Schaltungsplatte
US5156772A (en) * 1988-05-11 1992-10-20 Ariel Electronics, Inc. Circuit writer materials
JPH0817269B2 (ja) * 1988-05-11 1996-02-21 株式会社ソフィアシステムズ 回路ライター
US5099090A (en) * 1988-05-11 1992-03-24 Ariel Electronics, Inc. Circuit writer
US4898759A (en) * 1988-07-27 1990-02-06 Nidec Corporation Molded printed circuit board for use with a brushless electric motor
DE4104853A1 (de) * 1991-02-16 1992-08-20 Standard Elektrik Lorenz Ag Vorrichtung zur herstellung von loesbaren elektrischen verbindungen
US5414224A (en) * 1991-04-01 1995-05-09 Filial Vsesojuznogo Nauchno Issledovatelskogo Instituta Multilayer printed circuit board and method of manufacturing same
US5185654A (en) * 1991-11-27 1993-02-09 Motorola, Inc. Electrostatic RF absorbant circuit carrier assembly and method for making the same
DE19704921C2 (de) * 1997-02-10 1999-06-02 Inotech Kunststofftechnik Gmbh Elektronisches Bauteil
DE19707177A1 (de) * 1997-02-22 1998-09-03 Inotech Kunststofftechnik Gmbh Induktivität
DE19836968C2 (de) * 1998-08-14 2002-05-08 Huf Huelsbeck & Fuerst Gmbh Elektrischer Zündanlaßschalter für Motorfahrzeuge
DE19955538B4 (de) * 1999-11-18 2014-06-05 Morpho Cards Gmbh Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Verfahren zur Herstellung einer Leiterbahnträgerschicht Spritzgusswerkzeug zur Durchführung des Verfahrens zur Herstellung einer Leiterbahnträgerschicht
EP1245361A1 (de) * 2001-03-26 2002-10-02 Abb Research Ltd. Verfahren zum Spritzgiessen von Formteilen mit elektrischer Leitungsfunktion und elektrisches Bauelement mit einem solchen Formteil
DE102005050407A1 (de) * 2005-10-19 2007-04-26 Wilo Ag Wickelkopfkappe mit Motorverschaltung
US20080191001A1 (en) * 2007-02-08 2008-08-14 Kapoor Chandaria Packaging having protective materials incorporated therein
DE102010045199A1 (de) 2010-09-13 2012-03-15 Trw Automotive Electronics & Components Gmbh Schaltergehäuse für kapazitive Schalter
US9065213B2 (en) * 2013-07-03 2015-06-23 Tyco Electronics Corporation Electrical connector for transmitting data signals

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3561110A (en) * 1967-08-31 1971-02-09 Ibm Method of making connections and conductive paths
GB1565207A (en) * 1975-09-05 1980-04-16 Sinclair Radionics Printed circuits
FR2402379A1 (fr) * 1977-08-31 1979-03-30 Cayrol Pierre Henri Perfectionnements apportes aux circuits imprimes
GB2033667A (en) * 1978-11-06 1980-05-21 Powers C D Improvements in circuit boards
US4295183A (en) * 1979-06-29 1981-10-13 International Business Machines Corporation Thin film metal package for LSI chips
DE3014041C2 (de) * 1980-04-11 1982-04-08 Braun Ag, 6000 Frankfurt Verfahren zur Aufbringung von elektrisch leitenden Bahnen auf einen Träger aus Isolierstoff
DE3021896A1 (de) * 1980-06-06 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur herstellung von gedruckten schaltungen
US4403107A (en) * 1980-12-15 1983-09-06 Amp Incorporated Stamped circuit board
US4604799A (en) * 1982-09-03 1986-08-12 John Fluke Mfg. Co., Inc. Method of making molded circuit board
US4614837A (en) * 1985-04-03 1986-09-30 Allied Corporation Method for placing electrically conductive paths on a substrate

Also Published As

Publication number Publication date
DE3672351D1 (de) 1990-08-02
DE3518975A1 (de) 1986-11-27
ES8704305A1 (es) 1987-03-16
KR870008495A (ko) 1987-09-26
US4748068A (en) 1988-05-31
EP0208087A2 (de) 1987-01-14
JPS61276288A (ja) 1986-12-06
KR930011601B1 (ko) 1993-12-13
EP0208087A3 (en) 1987-05-27
EP0208087B1 (de) 1990-06-27

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