DE69113108T2 - Elektronisches System enthaltend Komponente, die durch einen thermisch leitfähigen Klebstoff verbunden sind. - Google Patents

Elektronisches System enthaltend Komponente, die durch einen thermisch leitfähigen Klebstoff verbunden sind.

Info

Publication number
DE69113108T2
DE69113108T2 DE69113108T DE69113108T DE69113108T2 DE 69113108 T2 DE69113108 T2 DE 69113108T2 DE 69113108 T DE69113108 T DE 69113108T DE 69113108 T DE69113108 T DE 69113108T DE 69113108 T2 DE69113108 T2 DE 69113108T2
Authority
DE
Germany
Prior art keywords
thermally conductive
conductive adhesive
electronic system
system containing
containing components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69113108T
Other languages
English (en)
Other versions
DE69113108D1 (de
Inventor
Jerome Thomas Adams
Bruce Allen Yost
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69113108D1 publication Critical patent/DE69113108D1/de
Publication of DE69113108T2 publication Critical patent/DE69113108T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69113108T 1990-05-07 1991-05-03 Elektronisches System enthaltend Komponente, die durch einen thermisch leitfähigen Klebstoff verbunden sind. Expired - Fee Related DE69113108T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/520,286 US5026748A (en) 1990-05-07 1990-05-07 Thermally conductive adhesive

Publications (2)

Publication Number Publication Date
DE69113108D1 DE69113108D1 (de) 1995-10-26
DE69113108T2 true DE69113108T2 (de) 1996-05-09

Family

ID=24071950

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69113108T Expired - Fee Related DE69113108T2 (de) 1990-05-07 1991-05-03 Elektronisches System enthaltend Komponente, die durch einen thermisch leitfähigen Klebstoff verbunden sind.

Country Status (15)

Country Link
US (1) US5026748A (de)
EP (1) EP0456428B1 (de)
JP (1) JPH06212137A (de)
KR (1) KR910020139A (de)
CN (1) CN1041743C (de)
AT (1) ATE128168T1 (de)
AU (1) AU629157B2 (de)
BR (1) BR9101849A (de)
CA (1) CA2041807A1 (de)
DE (1) DE69113108T2 (de)
ES (1) ES2078443T3 (de)
IL (1) IL97957A (de)
MX (1) MX172824B (de)
RU (1) RU2052483C1 (de)
TR (1) TR25806A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10335155A1 (de) * 2003-07-31 2005-03-03 Siemens Ag Anordnung eines elektrischen Bauelements auf einem Substrat und Verfahren zur Herstellung der Anordnung
US10736222B2 (en) 2016-06-29 2020-08-04 AT&S Austria Technologies & Systemtechnik Aktiengesellschaft Cooling component carrier material by carbon structure within dielectric shell

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USH1332H (en) 1988-10-03 1994-07-05 E. I. Du Pont De Nemours And Company Thermal conductive material
JP2880875B2 (ja) * 1993-04-12 1999-04-12 日本電気株式会社 電子デバイス用接着剤
US5907273A (en) * 1993-11-24 1999-05-25 Rochester Gauges, Inc. Linear positioning indicator
JP3435925B2 (ja) * 1995-08-25 2003-08-11 ソニー株式会社 半導体装置
US6084299A (en) * 1995-11-09 2000-07-04 International Business Machines Corporation Integrated circuit package including a heat sink and an adhesive
US5930117A (en) * 1996-05-07 1999-07-27 Sheldahl, Inc. Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer
US5695847A (en) * 1996-07-10 1997-12-09 Browne; James M. Thermally conductive joining film
WO1998040431A1 (en) * 1997-03-11 1998-09-17 Amoco Corporation Thermally conductive film and method for the preparation thereof
JP2000281995A (ja) * 1999-03-30 2000-10-10 Polymatech Co Ltd 熱伝導性接着フィルムおよび半導体装置
US6644849B1 (en) * 1999-09-20 2003-11-11 Honeywell International, Inc. Low precision temperature sensor for aircraft applications
US6402866B1 (en) 1999-09-30 2002-06-11 International Business Machines Corporation Powdered metallic sheet method for deposition of substrate conductors
US6651736B2 (en) * 2001-06-28 2003-11-25 Intel Corporation Short carbon fiber enhanced thermal grease
US6804118B2 (en) * 2002-03-15 2004-10-12 Delphi Technologies, Inc. Thermal dissipation assembly for electronic components
US7550097B2 (en) * 2003-09-03 2009-06-23 Momentive Performance Materials, Inc. Thermal conductive material utilizing electrically conductive nanoparticles
US20110236699A1 (en) * 2003-11-14 2011-09-29 Tundra Composites, LLC Work piece comprising metal polymer composite with metal insert
US8841358B2 (en) 2009-04-29 2014-09-23 Tundra Composites, LLC Ceramic composite
ES2718928T3 (es) * 2003-11-14 2019-07-05 Wild River Consulting Group Llc Material compuesto de polímero metálico, un método para su extrusión y artículos conformados a partir del mismo
US20090127801A1 (en) * 2003-11-14 2009-05-21 Wild River Consulting Group, Llc Enhanced property metal polymer composite
US9105382B2 (en) 2003-11-14 2015-08-11 Tundra Composites, LLC Magnetic composite
TWI253467B (en) * 2003-12-23 2006-04-21 Hon Hai Prec Ind Co Ltd Thermal interface material and method for making same
JP3720044B1 (ja) * 2005-03-22 2005-11-24 株式会社物産ナノテク研究所 複合材料
US20090298976A1 (en) * 2005-10-26 2009-12-03 Hiroyuki Yano Fiber-Reinforced Composition Resin Composition, Adhesive and Sealant
CA2641946C (en) * 2006-02-09 2016-01-12 Wild River Consulting Group, Llc Metal polymer composite with enhanced viscoelastic and thermal properties
JP4868547B2 (ja) * 2006-06-08 2012-02-01 インターナショナル・ビジネス・マシーンズ・コーポレーション 熱伝導モジュールとその製造方法、並びに、高熱伝導で柔軟なシートの製造方法
EP2050804A1 (de) * 2006-07-28 2009-04-22 Teijin Limited Wärmeleitfähiger klebstoff
JP2008227279A (ja) * 2007-03-14 2008-09-25 Sumitomo Electric Ind Ltd プラガブル光トランシーバ
JP2009036843A (ja) * 2007-07-31 2009-02-19 Sumitomo Electric Ind Ltd 光トランシーバ
WO2009091987A2 (en) 2008-01-18 2009-07-23 Wild River Consulting Group, Llc Melt molding polymer composite and method of making and using the same
JP2010267954A (ja) * 2009-04-15 2010-11-25 Panasonic Corp 電子機器
DE102009055099A1 (de) 2009-12-21 2011-06-22 tesa SE, 20253 Hitzeaktiviert verklebbare Flächenelemente
CN102130078B (zh) * 2010-01-20 2013-03-13 财团法人工业技术研究院 导热绝缘复合膜层及芯片堆叠结构
DE102011009428A1 (de) * 2011-01-26 2012-07-26 Emitec Gesellschaft Für Emissionstechnologie Mbh Thermoelektrisches Modul mit einer Wärmeleitschicht
US8729398B2 (en) * 2012-03-28 2014-05-20 Deere & Company Electrical assembly with compliant pins for heat dissipation
EP3790044B1 (de) 2012-07-07 2023-10-11 Dexerials Corporation Wärmeleitfolie
DE102015100863B4 (de) 2015-01-21 2022-03-03 Infineon Technologies Ag Verfahren zur Handhabung eines Produktsubstrats und ein verklebtes Substratsystem
CN109788635B (zh) * 2019-03-15 2020-04-21 深圳市满坤电子有限公司 一种印制电路板的加工方法

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US4522771A (en) * 1982-10-21 1985-06-11 General Electric Company Method of fabricating layer insulation for use in high-voltage electrical equipment
US4689110A (en) * 1983-12-22 1987-08-25 Trw Inc. Method of fabricating multilayer printed circuit board structure
US4609586A (en) * 1984-08-02 1986-09-02 The Boeing Company Thermally conductive printed wiring board laminate
US4791076A (en) * 1984-08-02 1988-12-13 Hughes Aircraft Company Graphite fiber reinforced silica matrix composite
JPH0240274B2 (ja) * 1984-12-14 1990-09-11 Yokohama Rubber Co Ltd Dodenseinetsukokagatasetsuchakusoseibutsu
US4861653A (en) * 1987-09-02 1989-08-29 E. I. Du Pont De Nemours And Company Pitch carbon fibers and batts
JPH0623350B2 (ja) * 1988-01-20 1994-03-30 信越ポリマー株式会社 異方導電性接着剤
CA2000087A1 (en) * 1988-10-03 1990-04-03 M. Lana Sheer Article of manufacture
IL91869A0 (en) * 1988-10-03 1990-06-10 Du Pont Thermal conductive material
JPH0375851A (ja) * 1989-08-17 1991-03-29 Nec Corp 情報処理装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10335155A1 (de) * 2003-07-31 2005-03-03 Siemens Ag Anordnung eines elektrischen Bauelements auf einem Substrat und Verfahren zur Herstellung der Anordnung
DE10335155B4 (de) * 2003-07-31 2006-11-30 Infineon Technologies Ag Verfahren zum Herstellen einer Anordnung eines elektrischen Bauelements auf einem Substrat
US7649272B2 (en) 2003-07-31 2010-01-19 Siemens Aktiengesellschaft Arrangement of an electrical component placed on a substrate, and method for producing the same
US10736222B2 (en) 2016-06-29 2020-08-04 AT&S Austria Technologies & Systemtechnik Aktiengesellschaft Cooling component carrier material by carbon structure within dielectric shell

Also Published As

Publication number Publication date
EP0456428A2 (de) 1991-11-13
EP0456428B1 (de) 1995-09-20
EP0456428A3 (en) 1992-02-26
US5026748A (en) 1991-06-25
CN1041743C (zh) 1999-01-20
RU2052483C1 (ru) 1996-01-20
CN1057282A (zh) 1991-12-25
IL97957A (en) 1994-04-12
IL97957A0 (en) 1992-06-21
AU629157B2 (en) 1992-09-24
KR910020139A (ko) 1991-12-19
TR25806A (tr) 1993-09-01
ES2078443T3 (es) 1995-12-16
AU7613791A (en) 1991-11-07
ATE128168T1 (de) 1995-10-15
CA2041807A1 (en) 1991-11-08
MX172824B (es) 1994-01-14
JPH06212137A (ja) 1994-08-02
BR9101849A (pt) 1991-12-17
DE69113108D1 (de) 1995-10-26

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee