KR890011502A - 성형된 인쇄회로기판 및 그 용도 - Google Patents

성형된 인쇄회로기판 및 그 용도 Download PDF

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Publication number
KR890011502A
KR890011502A KR1019880017893A KR880017893A KR890011502A KR 890011502 A KR890011502 A KR 890011502A KR 1019880017893 A KR1019880017893 A KR 1019880017893A KR 880017893 A KR880017893 A KR 880017893A KR 890011502 A KR890011502 A KR 890011502A
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KR
South Korea
Prior art keywords
printed circuit
circuit board
molded
molded printed
circuit boards
Prior art date
Application number
KR1019880017893A
Other languages
English (en)
Other versions
KR920000967B1 (ko
Inventor
리즈켈레 피리를캄프 에릭
Original Assignee
마리너스 알페나르
스태미 카본 베. 뷔.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마리너스 알페나르, 스태미 카본 베. 뷔. filed Critical 마리너스 알페나르
Publication of KR890011502A publication Critical patent/KR890011502A/ko
Application granted granted Critical
Publication of KR920000967B1 publication Critical patent/KR920000967B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide

Abstract

내용 없음

Description

성형된 인쇄 회로기판 및 그 용도
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 인쇄 회로기판의 온도테스트시의 온도 사이클중 여러 다른 지점에서의 수분함량을 나타내는 그래프.

Claims (7)

  1. 폴리머가 거의 테트라 메틸렌 아디프 아미드 유니트로 구성된 것을 특징으로 하는 열가소성 폴리머로 성형된 인쇄 회로기판.
  2. 제1항에 있어서, 인쇄 회로기판이 보강물질로 충전된 하나 이상의 층을 포함하는 것을 특징으로 하는 성형된 인쇄 회로기판.
  3. 제2항에 있어서, 보강물질이 하나 이상의 화이버상 충전제 및 비화이버상 충전제를 포함하는 것을 특징으로 하는 성형된 인쇄 회로기판.
  4. 제3항에 있어서, 화이버상 물질이 소량 존재하는 것을 특징으로 하는 성형된 인쇄 회로기판.
  5. 상기 항중 어느 한 항에 있어서, 인쇄 회로기판이 전자기 간섭에 대해 보호를 해주는 물질을 포함하는 하나 이상의 층을 포함하는 것을 특징으로 하는 성형된 인쇄 회로기판.
  6. 상기 항중 어느 한 항에 있어서, 인쇄 회로기판이 케이싱으로도 사용되는 것을 특징으로 하는 성형된 인쇄 회로기판.
  7. 상기 항중 어느 한 항에 따른 성형된 회로기판이 간헐적으로 사용되는 용도.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880017893A 1987-12-31 1988-12-29 성형된 인쇄회로기판 및 그 용도 KR920000967B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8703166 1987-12-31
NL8703166 1987-12-31

Publications (2)

Publication Number Publication Date
KR890011502A true KR890011502A (ko) 1989-08-14
KR920000967B1 KR920000967B1 (ko) 1992-01-31

Family

ID=19851172

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880017893A KR920000967B1 (ko) 1987-12-31 1988-12-29 성형된 인쇄회로기판 및 그 용도

Country Status (10)

Country Link
US (1) US4923735A (ko)
EP (1) EP0323671B1 (ko)
JP (1) JPH01206685A (ko)
KR (1) KR920000967B1 (ko)
CN (1) CN1015771B (ko)
AT (1) ATE110222T1 (ko)
CA (1) CA1300306C (ko)
DE (1) DE3851137T2 (ko)
DK (1) DK729188A (ko)
HK (1) HK8795A (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02253924A (ja) * 1989-03-28 1990-10-12 Unitika Ltd 耐熱性フッ素系重合体２軸配向フィルムおよびその製造方法
JPH07109943B2 (ja) * 1992-12-09 1995-11-22 日本電気株式会社 多層配線基板
US6333468B1 (en) * 1998-06-11 2001-12-25 International Business Machines Corporation Flexible multi-layered printed circuit cable
US6665191B2 (en) * 2001-09-10 2003-12-16 Cardiac Pacemakers, Inc. Multi-folded printed wiring construction for an implantable medical device
CN101640972B (zh) * 2008-07-28 2011-09-07 欣兴电子股份有限公司 一种电路板结构
CN102947391A (zh) * 2010-06-23 2013-02-27 帝斯曼知识产权资产管理有限公司 膜或板
CN107908910A (zh) * 2017-12-21 2018-04-13 曙光信息产业(北京)有限公司 印制电路板的建模方法以及系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2606162A (en) * 1948-01-30 1952-08-05 Ici Ltd Compositions comprising polyisocyanate modified polyesters and vinyl chloride polymers
BE553239A (ko) * 1955-12-15 1900-01-01
CH475846A (de) * 1965-07-05 1969-07-31 Dynamit Nobel Ag Polyamidplatte oder -rohr, als Träger für Kupferschichten bestimmt
US4165303A (en) * 1974-01-16 1979-08-21 Emery Industries, Inc. Polymer compositions containing poly (alkylene ether) esters of polybasic acids
US4532152A (en) * 1982-03-05 1985-07-30 Elarde Vito D Fabrication of a printed circuit board with metal-filled channels
JPS61126169A (ja) * 1984-11-21 1986-06-13 Toray Ind Inc ポリアミド樹脂組成物
GB2172437A (en) * 1985-03-16 1986-09-17 Marconi Electronic Devices Printed circuits
US4722997A (en) * 1985-05-31 1988-02-02 Stamicarbon, B.V. Process for the preparation of nylon 4,6
DE3526931A1 (de) * 1985-07-27 1987-02-05 Bayer Ag Verfahren zur herstellung von poly(tetramethylenadipamid)

Also Published As

Publication number Publication date
JPH01206685A (ja) 1989-08-18
CN1040903A (zh) 1990-03-28
HK8795A (en) 1995-01-27
DE3851137D1 (de) 1994-09-22
CA1300306C (en) 1992-05-05
KR920000967B1 (ko) 1992-01-31
EP0323671B1 (en) 1994-08-17
CN1015771B (zh) 1992-03-04
US4923735A (en) 1990-05-08
DE3851137T2 (de) 1995-04-06
ATE110222T1 (de) 1994-09-15
DK729188A (da) 1989-07-01
EP0323671A1 (en) 1989-07-12
DK729188D0 (da) 1988-12-29

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