KR910007394A - 프린트 배선판 성형용 및 그 재료를 사용한 프린트 배선판 - Google Patents
프린트 배선판 성형용 및 그 재료를 사용한 프린트 배선판 Download PDFInfo
- Publication number
- KR910007394A KR910007394A KR1019900014082A KR900014082A KR910007394A KR 910007394 A KR910007394 A KR 910007394A KR 1019900014082 A KR1019900014082 A KR 1019900014082A KR 900014082 A KR900014082 A KR 900014082A KR 910007394 A KR910007394 A KR 910007394A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- wiring board
- printed wiring
- parts
- forming
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract 17
- 229920000642 polymer Polymers 0.000 claims abstract 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract 11
- 239000003063 flame retardant Substances 0.000 claims abstract 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract 8
- 239000012765 fibrous filler Substances 0.000 claims abstract 4
- 238000013329 compounding Methods 0.000 claims abstract 2
- 238000000465 moulding Methods 0.000 claims abstract 2
- 239000002184 metal Substances 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 239000002216 antistatic agent Substances 0.000 claims 1
- 239000012752 auxiliary agent Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 239000012766 organic filler Substances 0.000 claims 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 239000011888 foil Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
내용없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (14)
- (a)주로 신디오탁틱구조를 갖는 스티렌계 중합체 100-20중량%와 (b) 섬유상 충전재 0-80중량%로 이루어진 중합체 조성물 100중량부에 대하여 (c) 난연제 0-40중량부 및 (d)난연보조제 0-15중량부를 배합하여 제조된 것을 특징으로 하는 프린트 배선판 성형용 재료.
- 제1항에 있어서, (a)성분으로서 스틸렌계 중합체의 결정화도가 25% 이상의 것인 프린트 배선판 성형용 재료.
- 제1항에 있어서, (a)성분으로서 스틸렌계 중합체의 결정화도가 30-65%인 프린트 배선판 성형용 재료.
- 제1항에 있어서, (a)성분으로서 스틸렌계 중합체의 결정화도가 40-60%프인 프린트 배선판 성형용 재료.
- 제1항에 있어서, (a)성분 30-100중량%와 (b)성분 0-70중량%가 배합된 프린트 배선판 성형용 재료.
- 제1항에 있어서, (a)성분 50-90중량%와 (b)성분 10-50중량%가 배합된 프린트 배선판 성형용 재료.
- 제2항에 있어서, (a)주로 신디오탁틱구조를 갖는 스티렌계 중합체 95-20중량%와, (b)섬유상 충전재 5-80중량%로 이루어진 중합체 조성물 100중량부에 대하여 (c)난연제 0-40중량부 및 (d)난연보조제 0-15중량부를 배합하여 제조된 것을 특징으로 하는 프린트 배선판 성형용 재료.
- 제2항에 있어서, (a)주로 신디오탁틱구조를 갖는 스티렌계 중합체 90-50중량%와, (b)섬유상 충전재 10-50중량%로 이루어진 중합체 조성물 100중량부에 대하여 (c)난연제 0-40중량부 및 (d)난연보조제 0-15중량부를 배합하여 제조된 것을 특징으로 하는 프린트 배선판 성형용 재료.
- 제7항에 있어서, (a)성분 및 (b)성분의 100중량부에 대하여 (c) 난연제 5-35중량부 및 (d)난연보조제 2-100중량부가 배합된 것을 특징으로 하는 프린트 배선판 성형용 재료.
- 제1항에 있어서, 그밖에 테트라플루오로에틸렌중합체를 함유하는 프린트 배선판 성형용 재료.
- 제1항에 있어서, 성분 (a)-(d)의 배합비율을 다층 프린트 배선판의 유전율이 3.5이하가 되도록 선택한 프린트 배선판 성형용 재료.
- 제11항에 있어서, 그밖의 산화방지제, 유기충전재, 정전기 방지제, 열가소서성수지, 고무상탄성체 등의 첨가제를 함유한 프린트 배선판 성형용 재료.
- 제1항의 재료로 이루어진 성형체상에 금속층을 설치한 프린트 배선판.
- 제2항의 재료로 이루어진 성형체상에 금속층을 설치한 프린트 배선판.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1-227561 | 1989-09-04 | ||
JP1227561A JP2779224B2 (ja) | 1989-09-04 | 1989-09-04 | プリント配線板成形用材料及び該材料を用いたプリント配線板 |
JP227561/1989 | 1989-09-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910007394A true KR910007394A (ko) | 1991-04-30 |
KR970004753B1 KR970004753B1 (ko) | 1997-04-03 |
Family
ID=16862840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900014082A KR970004753B1 (ko) | 1989-09-04 | 1990-09-04 | 프린트 배선판 성형용 재료 및 그 재료를 사용한 프린트 배선판 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0416461B1 (ko) |
JP (1) | JP2779224B2 (ko) |
KR (1) | KR970004753B1 (ko) |
AT (1) | ATE133022T1 (ko) |
CA (1) | CA2024494C (ko) |
DE (1) | DE69024722T2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3901752B2 (ja) * | 1995-07-20 | 2007-04-04 | 出光興産株式会社 | 難燃性ポリスチレン系樹脂組成物及びポリスチレン系樹脂成形体 |
JP4598903B2 (ja) * | 1998-07-24 | 2010-12-15 | 出光興産株式会社 | 電子部品 |
JP4723775B2 (ja) * | 2001-09-27 | 2011-07-13 | ポリマテック株式会社 | ダンパー及びその取付構造 |
JP2003185064A (ja) | 2001-12-19 | 2003-07-03 | Ge Plastics Japan Ltd | 配管部材 |
JP2007093730A (ja) * | 2005-09-27 | 2007-04-12 | Sharp Corp | ディスプレイ装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1276748C (en) * | 1985-07-29 | 1990-11-20 | Michitake Uoi | Styrene polymers |
DE3780635T2 (de) * | 1987-09-15 | 1992-12-10 | Idemitsu Kosan Co | Harzzusammensetzung auf der basis von polystyrol. |
JP2931597B2 (ja) * | 1988-02-11 | 1999-08-09 | ザ・ダウ・ケミカル・カンパニー | 電気連結器具,その基材及び該基材からなる配線盤と配線コネクター |
JP2744254B2 (ja) * | 1988-09-30 | 1998-04-28 | 出光興産株式会社 | 難燃性樹脂組成物 |
JPH118244A (ja) * | 1997-06-17 | 1999-01-12 | Seiko Epson Corp | 半導体装置の製造方法 |
-
1989
- 1989-09-04 JP JP1227561A patent/JP2779224B2/ja not_active Expired - Fee Related
-
1990
- 1990-08-30 DE DE69024722T patent/DE69024722T2/de not_active Expired - Fee Related
- 1990-08-30 AT AT90116625T patent/ATE133022T1/de not_active IP Right Cessation
- 1990-08-30 EP EP90116625A patent/EP0416461B1/en not_active Expired - Lifetime
- 1990-08-31 CA CA002024494A patent/CA2024494C/en not_active Expired - Fee Related
- 1990-09-04 KR KR1019900014082A patent/KR970004753B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0416461A2 (en) | 1991-03-13 |
EP0416461A3 (en) | 1993-01-27 |
DE69024722D1 (de) | 1996-02-22 |
KR970004753B1 (ko) | 1997-04-03 |
JP2779224B2 (ja) | 1998-07-23 |
DE69024722T2 (de) | 1996-05-23 |
ATE133022T1 (de) | 1996-01-15 |
EP0416461B1 (en) | 1996-01-10 |
CA2024494A1 (en) | 1991-03-05 |
JPH0391549A (ja) | 1991-04-17 |
CA2024494C (en) | 2001-03-06 |
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FPAY | Annual fee payment |
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