KR910007394A - 프린트 배선판 성형용 및 그 재료를 사용한 프린트 배선판 - Google Patents

프린트 배선판 성형용 및 그 재료를 사용한 프린트 배선판 Download PDF

Info

Publication number
KR910007394A
KR910007394A KR1019900014082A KR900014082A KR910007394A KR 910007394 A KR910007394 A KR 910007394A KR 1019900014082 A KR1019900014082 A KR 1019900014082A KR 900014082 A KR900014082 A KR 900014082A KR 910007394 A KR910007394 A KR 910007394A
Authority
KR
South Korea
Prior art keywords
weight
wiring board
printed wiring
parts
forming
Prior art date
Application number
KR1019900014082A
Other languages
English (en)
Other versions
KR970004753B1 (ko
Inventor
아끼까즈 나까노
Original Assignee
이데미쓰 쇼스께
이데미쓰 고산 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이데미쓰 쇼스께, 이데미쓰 고산 가부시끼가이샤 filed Critical 이데미쓰 쇼스께
Publication of KR910007394A publication Critical patent/KR910007394A/ko
Application granted granted Critical
Publication of KR970004753B1 publication Critical patent/KR970004753B1/ko

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/012Flame-retardant; Preventing of inflammation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0212Resin particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0242Shape of an individual particle
    • H05K2201/0251Non-conductive microfibers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/122Organic non-polymeric compounds, e.g. oil, wax or thiol

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

내용없음.

Description

프린트 배선판 성형용 재료 및 그 재료를 사용한 프린트 배선판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (14)

  1. (a)주로 신디오탁틱구조를 갖는 스티렌계 중합체 100-20중량%와 (b) 섬유상 충전재 0-80중량%로 이루어진 중합체 조성물 100중량부에 대하여 (c) 난연제 0-40중량부 및 (d)난연보조제 0-15중량부를 배합하여 제조된 것을 특징으로 하는 프린트 배선판 성형용 재료.
  2. 제1항에 있어서, (a)성분으로서 스틸렌계 중합체의 결정화도가 25% 이상의 것인 프린트 배선판 성형용 재료.
  3. 제1항에 있어서, (a)성분으로서 스틸렌계 중합체의 결정화도가 30-65%인 프린트 배선판 성형용 재료.
  4. 제1항에 있어서, (a)성분으로서 스틸렌계 중합체의 결정화도가 40-60%프인 프린트 배선판 성형용 재료.
  5. 제1항에 있어서, (a)성분 30-100중량%와 (b)성분 0-70중량%가 배합된 프린트 배선판 성형용 재료.
  6. 제1항에 있어서, (a)성분 50-90중량%와 (b)성분 10-50중량%가 배합된 프린트 배선판 성형용 재료.
  7. 제2항에 있어서, (a)주로 신디오탁틱구조를 갖는 스티렌계 중합체 95-20중량%와, (b)섬유상 충전재 5-80중량%로 이루어진 중합체 조성물 100중량부에 대하여 (c)난연제 0-40중량부 및 (d)난연보조제 0-15중량부를 배합하여 제조된 것을 특징으로 하는 프린트 배선판 성형용 재료.
  8. 제2항에 있어서, (a)주로 신디오탁틱구조를 갖는 스티렌계 중합체 90-50중량%와, (b)섬유상 충전재 10-50중량%로 이루어진 중합체 조성물 100중량부에 대하여 (c)난연제 0-40중량부 및 (d)난연보조제 0-15중량부를 배합하여 제조된 것을 특징으로 하는 프린트 배선판 성형용 재료.
  9. 제7항에 있어서, (a)성분 및 (b)성분의 100중량부에 대하여 (c) 난연제 5-35중량부 및 (d)난연보조제 2-100중량부가 배합된 것을 특징으로 하는 프린트 배선판 성형용 재료.
  10. 제1항에 있어서, 그밖에 테트라플루오로에틸렌중합체를 함유하는 프린트 배선판 성형용 재료.
  11. 제1항에 있어서, 성분 (a)-(d)의 배합비율을 다층 프린트 배선판의 유전율이 3.5이하가 되도록 선택한 프린트 배선판 성형용 재료.
  12. 제11항에 있어서, 그밖의 산화방지제, 유기충전재, 정전기 방지제, 열가소서성수지, 고무상탄성체 등의 첨가제를 함유한 프린트 배선판 성형용 재료.
  13. 제1항의 재료로 이루어진 성형체상에 금속층을 설치한 프린트 배선판.
  14. 제2항의 재료로 이루어진 성형체상에 금속층을 설치한 프린트 배선판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900014082A 1989-09-04 1990-09-04 프린트 배선판 성형용 재료 및 그 재료를 사용한 프린트 배선판 KR970004753B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1-227561 1989-09-04
JP1227561A JP2779224B2 (ja) 1989-09-04 1989-09-04 プリント配線板成形用材料及び該材料を用いたプリント配線板
JP227561/1989 1989-09-04

Publications (2)

Publication Number Publication Date
KR910007394A true KR910007394A (ko) 1991-04-30
KR970004753B1 KR970004753B1 (ko) 1997-04-03

Family

ID=16862840

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900014082A KR970004753B1 (ko) 1989-09-04 1990-09-04 프린트 배선판 성형용 재료 및 그 재료를 사용한 프린트 배선판

Country Status (6)

Country Link
EP (1) EP0416461B1 (ko)
JP (1) JP2779224B2 (ko)
KR (1) KR970004753B1 (ko)
AT (1) ATE133022T1 (ko)
CA (1) CA2024494C (ko)
DE (1) DE69024722T2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3901752B2 (ja) * 1995-07-20 2007-04-04 出光興産株式会社 難燃性ポリスチレン系樹脂組成物及びポリスチレン系樹脂成形体
JP4598903B2 (ja) * 1998-07-24 2010-12-15 出光興産株式会社 電子部品
JP4723775B2 (ja) * 2001-09-27 2011-07-13 ポリマテック株式会社 ダンパー及びその取付構造
JP2003185064A (ja) 2001-12-19 2003-07-03 Ge Plastics Japan Ltd 配管部材
JP2007093730A (ja) * 2005-09-27 2007-04-12 Sharp Corp ディスプレイ装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1276748C (en) * 1985-07-29 1990-11-20 Michitake Uoi Styrene polymers
DE3780635T2 (de) * 1987-09-15 1992-12-10 Idemitsu Kosan Co Harzzusammensetzung auf der basis von polystyrol.
JP2931597B2 (ja) * 1988-02-11 1999-08-09 ザ・ダウ・ケミカル・カンパニー 電気連結器具,その基材及び該基材からなる配線盤と配線コネクター
JP2744254B2 (ja) * 1988-09-30 1998-04-28 出光興産株式会社 難燃性樹脂組成物
JPH118244A (ja) * 1997-06-17 1999-01-12 Seiko Epson Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
EP0416461A2 (en) 1991-03-13
EP0416461A3 (en) 1993-01-27
DE69024722D1 (de) 1996-02-22
KR970004753B1 (ko) 1997-04-03
JP2779224B2 (ja) 1998-07-23
DE69024722T2 (de) 1996-05-23
ATE133022T1 (de) 1996-01-15
EP0416461B1 (en) 1996-01-10
CA2024494A1 (en) 1991-03-05
JPH0391549A (ja) 1991-04-17
CA2024494C (en) 2001-03-06

Similar Documents

Publication Publication Date Title
EP0808866A3 (de) Laserbeschriftbare Polymerformmassen
EP1050559A4 (en) RECOVERED PET RESIN COMPOSITION, CORRESPONDING MOLDED ARTICLE, FLAME RETARDANT RESIN COMPOSITION, CORRESPONDING MOLDED ARTICLE
CA2026560A1 (en) Flame-retardant resin composition and molded article for electrical parts
TW375569B (en) Electroconductive, multi-layered hollow moldings and electroconductive resin compositions
DE68909059D1 (de) Harzmischung auf Styrolbasis.
EP0071773A3 (en) Molded articles of improved impact resistance and compositions thereof
KR880014034A (ko) 스티렌계 수지조성물 및 이로부터 제조되는 성형체
KR910007394A (ko) 프린트 배선판 성형용 및 그 재료를 사용한 프린트 배선판
KR960031535A (ko) 시클로올레핀 수지조성물
ES8401114A1 (es) Una composicion polimerica de poliamida.
MY109686A (en) Flame-retardant resin composition.
KR900007954A (ko) 열가소성 성형 조성물 및 이의 제조방법
KR910018487A (ko) 도전성 폴리술폰수지 조성물 및 이것으로 부터 얻어지는 고내열 도전성 반도체용 성형품
SG166665A1 (en) Electroconductive resin compositions
DE50114886D1 (de) Additivmischungen für die verwendung in vinylaromatischen harzmischungen
KR970061984A (ko) 발포성 성형 조성물
KR890011502A (ko) 성형된 인쇄회로기판 및 그 용도
KR930006111A (ko) 폴리아릴렌 설파이드 수지 조성물
KR950003382A (ko) 난연성 열가소성 수지조성물
EP0375961A3 (de) Schlagzähe, thermoplastiche Polyethersulfon-Formmassen
KR970001453A (ko) 열가소성 수지 조성물
KR910020081A (ko) 난연성 열가소성 수지의 제조방법
JPS55129422A (en) Preparation of graft copolymer
KR940014644A (ko) 열가소성 수지 조성물
KR940014622A (ko) 열가소성 수지 조성물

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20031216

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee