KR910015039A - 반도체웨이퍼 - Google Patents

반도체웨이퍼 Download PDF

Info

Publication number
KR910015039A
KR910015039A KR1019910000768A KR910000768A KR910015039A KR 910015039 A KR910015039 A KR 910015039A KR 1019910000768 A KR1019910000768 A KR 1019910000768A KR 910000768 A KR910000768 A KR 910000768A KR 910015039 A KR910015039 A KR 910015039A
Authority
KR
South Korea
Prior art keywords
integrated circuit
pattern
wiring patterns
dicing line
semiconductor wafer
Prior art date
Application number
KR1019910000768A
Other languages
English (en)
Other versions
KR940010641B1 (ko
Inventor
아이치로 사쿠모토
미치오 가와카미
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR910015039A publication Critical patent/KR910015039A/ko
Application granted granted Critical
Publication of KR940010641B1 publication Critical patent/KR940010641B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Dicing (AREA)

Abstract

내용 없음

Description

반도체 웨이퍼
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 반도체웨이퍼의 1실시예의 일부를 나타낸 패턴도, 제2도는 제1도에 도시된 반도체웨이퍼가 다이싱라인(dicing line)에 의해 각각의 집적회로칩영역으로 분할된 상태에 대한 일부를 나타낸 패턴도.

Claims (1)

  1. 다이싱라인(11)에 의해 각각의 집적회로칩으로 분할된 칩영역(12)중 적어도 일부의 칩영역상에 복수의 출력패드(13)에 대해 선택적으로 출력신호를 공급하기 위한 출력절환제어회로를 갖춘 소정의 집적회로의 패턴이 형성된 상태의 반도체웨이퍼에 있어서, 상기 소정의 집적회로패턴이 형성되어 있는 칩영역상에서 선택적으로 출력신호가 공급되는 하나의 세트된 복수의 출력패드마다 이 복수의 출력패드로부터 상기 다이싱라인(11)영역상까지 각각 인출되는 복수의 배선패턴(14)이 형성되고, 상기 다이싱라인(11)영역상에서 상기 복수의 배선패턴(14)을 공통으로 접속하는 배선패턴(14) 및 테스트용 패드(15)가 형성되어 있는 것을 특징으로 하는 반도체웨이퍼.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910000768A 1990-01-19 1991-01-18 반도체 웨이퍼 KR940010641B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP02-009582 1990-01-19
JP958290A JPH0758725B2 (ja) 1990-01-19 1990-01-19 半導体ウェハ

Publications (2)

Publication Number Publication Date
KR910015039A true KR910015039A (ko) 1991-08-31
KR940010641B1 KR940010641B1 (ko) 1994-10-24

Family

ID=11724307

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910000768A KR940010641B1 (ko) 1990-01-19 1991-01-18 반도체 웨이퍼

Country Status (4)

Country Link
EP (1) EP0438127B1 (ko)
JP (1) JPH0758725B2 (ko)
KR (1) KR940010641B1 (ko)
DE (1) DE69105530T2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0678904A1 (en) * 1994-04-12 1995-10-25 Lsi Logic Corporation Multicut wafer saw process
JPH07302773A (ja) * 1994-05-06 1995-11-14 Texas Instr Japan Ltd 半導体ウエハ及び半導体装置
EP0767492A3 (en) * 1995-10-02 1998-09-09 Altera Corporation Integrated circuit test system
US6020758A (en) * 1996-03-11 2000-02-01 Altera Corporation Partially reconfigurable programmable logic device
JPH09252034A (ja) * 1996-03-18 1997-09-22 Mitsubishi Electric Corp 半導体ウエハ，半導体装置及び半導体装置の製造方法
JP2001135597A (ja) * 1999-08-26 2001-05-18 Fujitsu Ltd 半導体装置の製造方法
JP2004505442A (ja) * 2000-07-21 2004-02-19 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 改善されたいわゆるソーボーを有する集積回路を製造する方法
JP4631572B2 (ja) * 2005-07-14 2011-02-16 セイコーエプソン株式会社 液滴吐出ヘッド
JP2013187402A (ja) 2012-03-08 2013-09-19 Mitsubishi Electric Corp 半導体ウェハ及びその検査方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3849872A (en) * 1972-10-24 1974-11-26 Ibm Contacting integrated circuit chip terminal through the wafer kerf
JPH0530361Y2 (ko) * 1988-02-23 1993-08-03
JPH01276735A (ja) * 1988-04-28 1989-11-07 Fuji Electric Co Ltd 集積回路素子ウエハ

Also Published As

Publication number Publication date
EP0438127A3 (en) 1992-03-04
DE69105530D1 (de) 1995-01-19
JPH0758725B2 (ja) 1995-06-21
EP0438127A2 (en) 1991-07-24
DE69105530T2 (de) 1995-05-04
KR940010641B1 (ko) 1994-10-24
EP0438127B1 (en) 1994-12-07
JPH03214638A (ja) 1991-09-19

Similar Documents

Publication Publication Date Title
KR850005059A (ko) 스위칭 잡음을 감소시킨 lsi 게이트 어레이
FR2508255B1 (fr) Dispositif a circuit integre, realise a partir d'une matrice " standard, realisant une multiplicite de fonctions logiques par modification du reseau de calibrage "
TW353223B (en) Semiconductor board providing high signal pin utilization
GB1437024A (en) Semiconductor integrated circuit structures
KR870010628A (ko) 반도체 장치
KR860002866A (ko) 반도체 집적회로장치
KR910013500A (ko) 웨이퍼 형태의 기판상에 집적된 테스트 시스템 및 상기 시스템의 테스트 구조의 파라미터를 측정 및/또는 테스팅하는 방법
KR960006977B1 (ko) 마스터-슬라이스형 반도체집적회로
KR910015039A (ko) 반도체웨이퍼
KR920017126A (ko) 복수의 인터페이스 레벨을 출력 가능한 반도체 집적 회로장치
KR910019236A (ko) 반도체장치
KR970051163A (ko) 반도체 메모리장치
KR900013622A (ko) 반도체 집적회로장치
TW360794B (en) Semiconductor IC device
ATE73273T1 (de) Halbleiter-integrierte schaltungen.
EP0041844A2 (en) Semiconductor integrated circuit devices
KR960042745A (ko) 다수개의 스위칭 수단을 가지는 다용도 패드를 구비한 반도체 메모리장치
KR900017164A (ko) 반도체장치
KR910017638A (ko) 방향처리된 저항패턴을 갖춘 반도체 집적회로
KR920001711A (ko) 반도체집적회로
KR900019214A (ko) 반도체장치
KR900001020A (ko) 반도체 집적회로 장치
KR850006276A (ko) 논리 회로(logic circuit)
EP0321244A3 (en) Semi-conductor integrated circuit for a telephone
KR950007126A (ko) 반도체 기억장치

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20030930

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee