KR900009289A - 발광장치 - Google Patents

발광장치 Download PDF

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Publication number
KR900009289A
KR900009289A KR1019880016846A KR880016846A KR900009289A KR 900009289 A KR900009289 A KR 900009289A KR 1019880016846 A KR1019880016846 A KR 1019880016846A KR 880016846 A KR880016846 A KR 880016846A KR 900009289 A KR900009289 A KR 900009289A
Authority
KR
South Korea
Prior art keywords
light emitting
emitting device
substrate
insulator
coated
Prior art date
Application number
KR1019880016846A
Other languages
English (en)
Other versions
KR910003735B1 (ko
Inventor
김번중
Original Assignee
안시환
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 안시환, 삼성전자 주식회사 filed Critical 안시환
Priority to KR1019880016846A priority Critical patent/KR910003735B1/ko
Priority to JP1194408A priority patent/JPH02185076A/ja
Priority to US07/399,951 priority patent/US4910534A/en
Priority to DE3930031A priority patent/DE3930031C2/de
Priority to GB8928564A priority patent/GB2226185B/en
Publication of KR900009289A publication Critical patent/KR900009289A/ko
Application granted granted Critical
Publication of KR910003735B1 publication Critical patent/KR910003735B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars

Abstract

내용 없음

Description

발광장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명 발광장치의 프린터 헤드 기판의 사시도, 제3도 본 발명 발광장치의 단면도, 제4도는 본 발명 발광장치의 사시도.

Claims (6)

  1. 기판(6)의 한쪽 모서리를 면(11)에 대하여 소정의 각도로 가공하고, 광선을 발사시킬수 있는 반사면(8)을 형성하며, 상기 기판(6)의 면(11)에 배선(7,7-11…)및 공통 전극용 배선(4)을 형성하고 그 위에 발광부(2)의 배열을 갖는 발광소자(1,1,-1…,1-M)를 설치하되 그 발광부가 반사면(8)과 대향되도록 하여, 각 발광부(2)의 패드(3,3-1,…)가 배선(7,7-1,…)이 대향되는 패턴을 갖임을 특징으로 하는 발광장치.
  2. 제1항에 있어서, 공통 전극배선(4)이 없고, 각 칩의 전극(10,10-1,10-2,…)이 1개 이상의 본딩 와이어나 본딩 리본으로 본딩되어 공통 전극으로 연결됨을 특징으로 하는 발광장치.
  3. 제1항에 있어서, 반사면(8)은 헤드기판(6)이 세라믹 등의 절연체의 경우에는 Al,Cu,Au,Ag등의 박, 후막으로 코팅되고, 도전성 방열판 위에 절연체가 코딩된 헤드기판의 경우에는 상기 박막이 코팅되거나 방열판 자체가 경면 연마된 것을 특징으로 하는 발광장치.
  4. 제3항에 있어서, 반사면(3)위에 질화규소, 산화규소, 또는 산화세륨등이 피막 코팅되어 있음을 특징으로 하는 발광장치.
  5. 제1항에 있어서, 헤드기판(6)의 재질이 절연물이 코팅된 도전성 기판의 경우, 도전성 기판의 재료가 Al,두탈루민.Cu.Cu 합금계, 등의 지지강도 및 방열 특성을 갖고 절연물은 PCB용 절연수지나 SOG(Spin on glass)등의 절연체를 사용함을 특징으로 하는 발광장치.
  6. 제1항에 있어서, 발광부(2) 혹은 기판면(11)과 반사면(8)이 이루는 각은 0-90°가 됨을 특징으로 하는 발광장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880016846A 1988-12-17 1988-12-17 발광장치 KR910003735B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1019880016846A KR910003735B1 (ko) 1988-12-17 1988-12-17 발광장치
JP1194408A JPH02185076A (ja) 1988-12-17 1989-07-28 発光装置
US07/399,951 US4910534A (en) 1988-12-17 1989-08-29 Light emitting apparatus
DE3930031A DE3930031C2 (de) 1988-12-17 1989-09-08 Druckzeile für einen optischen Drucker
GB8928564A GB2226185B (en) 1988-12-17 1989-12-18 A light emitting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019880016846A KR910003735B1 (ko) 1988-12-17 1988-12-17 발광장치

Publications (2)

Publication Number Publication Date
KR900009289A true KR900009289A (ko) 1990-07-04
KR910003735B1 KR910003735B1 (ko) 1991-06-10

Family

ID=19280269

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880016846A KR910003735B1 (ko) 1988-12-17 1988-12-17 발광장치

Country Status (5)

Country Link
US (1) US4910534A (ko)
JP (1) JPH02185076A (ko)
KR (1) KR910003735B1 (ko)
DE (1) DE3930031C2 (ko)
GB (1) GB2226185B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101329435B1 (ko) * 2006-05-03 2013-11-14 오스람 옵토 세미컨덕터스 게엠베하 지지 기판을 포함하는 복사-방출 반도체 몸체 및 이의 제조방법

Families Citing this family (5)

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Publication number Priority date Publication date Assignee Title
US5138347A (en) * 1988-09-23 1992-08-11 Westinghouse Electric Corp. Thin film electroluminescent edge emitter structure with optical lens and multi-color light emission systems
JP2001102486A (ja) * 1999-07-28 2001-04-13 Seiko Epson Corp 半導体装置用基板、半導体チップ搭載基板、半導体装置及びその製造方法、回路基板並びに電子機器
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
JP2007207869A (ja) * 2006-01-31 2007-08-16 Rohm Co Ltd 窒化物半導体発光素子
CN108717708B (zh) * 2018-03-30 2021-04-13 深圳怡化电脑股份有限公司 规则图像的边沿斜率的计算方法及装置

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US3686543A (en) * 1968-02-08 1972-08-22 Rca Corp Angled array semiconductor light sources
JPS5347348B2 (ko) * 1972-05-04 1978-12-20
US4205100A (en) * 1976-05-19 1980-05-27 Xerox Corporation System for providing electrolessly nickel coated polished high speed multi-faceted polygonal scanners
DE2641540C2 (de) * 1976-09-15 1981-10-29 Siemens AG, 1000 Berlin und 8000 München Lumineszenzdiodenzeile zur Erzeugung eines sehr feinen Rasters von Lichtpunkten
JPS5349974A (en) * 1976-10-18 1978-05-06 Mitsubishi Electric Corp Semiconductor laser device
FR2378325A1 (fr) * 1977-01-20 1978-08-18 Radiotechnique Compelec Element d'affichage electroluminescent
JPS5438106A (en) * 1977-08-31 1979-03-22 Fujitsu Ltd Mirror making method
JPS5833099B2 (ja) * 1978-11-13 1983-07-18 日本発条株式会社 多層コ−テイング反射板
JPS5891402A (ja) * 1981-11-27 1983-05-31 Yoshino Kogyosho Co Ltd 鏡体
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101329435B1 (ko) * 2006-05-03 2013-11-14 오스람 옵토 세미컨덕터스 게엠베하 지지 기판을 포함하는 복사-방출 반도체 몸체 및 이의 제조방법

Also Published As

Publication number Publication date
DE3930031A1 (de) 1990-06-28
GB2226185B (en) 1993-06-02
GB2226185A (en) 1990-06-20
DE3930031C2 (de) 1994-10-13
KR910003735B1 (ko) 1991-06-10
JPH02185076A (ja) 1990-07-19
GB8928564D0 (en) 1990-02-21
US4910534A (en) 1990-03-20

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