KR900009289A - 발광장치 - Google Patents
발광장치 Download PDFInfo
- Publication number
- KR900009289A KR900009289A KR1019880016846A KR880016846A KR900009289A KR 900009289 A KR900009289 A KR 900009289A KR 1019880016846 A KR1019880016846 A KR 1019880016846A KR 880016846 A KR880016846 A KR 880016846A KR 900009289 A KR900009289 A KR 900009289A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting device
- substrate
- insulator
- coated
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229910000420 cerium oxide Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010408 film Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Led Device Packages (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명 발광장치의 프린터 헤드 기판의 사시도, 제3도 본 발명 발광장치의 단면도, 제4도는 본 발명 발광장치의 사시도.
Claims (6)
- 기판(6)의 한쪽 모서리를 면(11)에 대하여 소정의 각도로 가공하고, 광선을 발사시킬수 있는 반사면(8)을 형성하며, 상기 기판(6)의 면(11)에 배선(7,7-11…)및 공통 전극용 배선(4)을 형성하고 그 위에 발광부(2)의 배열을 갖는 발광소자(1,1,-1…,1-M)를 설치하되 그 발광부가 반사면(8)과 대향되도록 하여, 각 발광부(2)의 패드(3,3-1,…)가 배선(7,7-1,…)이 대향되는 패턴을 갖임을 특징으로 하는 발광장치.
- 제1항에 있어서, 공통 전극배선(4)이 없고, 각 칩의 전극(10,10-1,10-2,…)이 1개 이상의 본딩 와이어나 본딩 리본으로 본딩되어 공통 전극으로 연결됨을 특징으로 하는 발광장치.
- 제1항에 있어서, 반사면(8)은 헤드기판(6)이 세라믹 등의 절연체의 경우에는 Al,Cu,Au,Ag등의 박, 후막으로 코팅되고, 도전성 방열판 위에 절연체가 코딩된 헤드기판의 경우에는 상기 박막이 코팅되거나 방열판 자체가 경면 연마된 것을 특징으로 하는 발광장치.
- 제3항에 있어서, 반사면(3)위에 질화규소, 산화규소, 또는 산화세륨등이 피막 코팅되어 있음을 특징으로 하는 발광장치.
- 제1항에 있어서, 헤드기판(6)의 재질이 절연물이 코팅된 도전성 기판의 경우, 도전성 기판의 재료가 Al,두탈루민.Cu.Cu 합금계, 등의 지지강도 및 방열 특성을 갖고 절연물은 PCB용 절연수지나 SOG(Spin on glass)등의 절연체를 사용함을 특징으로 하는 발광장치.
- 제1항에 있어서, 발광부(2) 혹은 기판면(11)과 반사면(8)이 이루는 각은 0-90°가 됨을 특징으로 하는 발광장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019880016846A KR910003735B1 (ko) | 1988-12-17 | 1988-12-17 | 발광장치 |
JP1194408A JPH02185076A (ja) | 1988-12-17 | 1989-07-28 | 発光装置 |
US07/399,951 US4910534A (en) | 1988-12-17 | 1989-08-29 | Light emitting apparatus |
DE3930031A DE3930031C2 (de) | 1988-12-17 | 1989-09-08 | Druckzeile für einen optischen Drucker |
GB8928564A GB2226185B (en) | 1988-12-17 | 1989-12-18 | A light emitting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019880016846A KR910003735B1 (ko) | 1988-12-17 | 1988-12-17 | 발광장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900009289A true KR900009289A (ko) | 1990-07-04 |
KR910003735B1 KR910003735B1 (ko) | 1991-06-10 |
Family
ID=19280269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880016846A KR910003735B1 (ko) | 1988-12-17 | 1988-12-17 | 발광장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4910534A (ko) |
JP (1) | JPH02185076A (ko) |
KR (1) | KR910003735B1 (ko) |
DE (1) | DE3930031C2 (ko) |
GB (1) | GB2226185B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101329435B1 (ko) * | 2006-05-03 | 2013-11-14 | 오스람 옵토 세미컨덕터스 게엠베하 | 지지 기판을 포함하는 복사-방출 반도체 몸체 및 이의 제조방법 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138347A (en) * | 1988-09-23 | 1992-08-11 | Westinghouse Electric Corp. | Thin film electroluminescent edge emitter structure with optical lens and multi-color light emission systems |
JP2001102486A (ja) * | 1999-07-28 | 2001-04-13 | Seiko Epson Corp | 半導体装置用基板、半導体チップ搭載基板、半導体装置及びその製造方法、回路基板並びに電子機器 |
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
JP2007207869A (ja) * | 2006-01-31 | 2007-08-16 | Rohm Co Ltd | 窒化物半導体発光素子 |
CN108717708B (zh) * | 2018-03-30 | 2021-04-13 | 深圳怡化电脑股份有限公司 | 规则图像的边沿斜率的计算方法及装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3686543A (en) * | 1968-02-08 | 1972-08-22 | Rca Corp | Angled array semiconductor light sources |
JPS5347348B2 (ko) * | 1972-05-04 | 1978-12-20 | ||
US4205100A (en) * | 1976-05-19 | 1980-05-27 | Xerox Corporation | System for providing electrolessly nickel coated polished high speed multi-faceted polygonal scanners |
DE2641540C2 (de) * | 1976-09-15 | 1981-10-29 | Siemens AG, 1000 Berlin und 8000 München | Lumineszenzdiodenzeile zur Erzeugung eines sehr feinen Rasters von Lichtpunkten |
JPS5349974A (en) * | 1976-10-18 | 1978-05-06 | Mitsubishi Electric Corp | Semiconductor laser device |
FR2378325A1 (fr) * | 1977-01-20 | 1978-08-18 | Radiotechnique Compelec | Element d'affichage electroluminescent |
JPS5438106A (en) * | 1977-08-31 | 1979-03-22 | Fujitsu Ltd | Mirror making method |
JPS5833099B2 (ja) * | 1978-11-13 | 1983-07-18 | 日本発条株式会社 | 多層コ−テイング反射板 |
JPS5891402A (ja) * | 1981-11-27 | 1983-05-31 | Yoshino Kogyosho Co Ltd | 鏡体 |
FR2547087B1 (fr) * | 1983-05-30 | 1985-07-12 | Radiotechnique Compelec | Element de panneau d'affichage a cristaux semi-conducteurs et panneau comportant ledit element |
US4784722A (en) * | 1985-01-22 | 1988-11-15 | Massachusetts Institute Of Technology | Method forming surface emitting diode laser |
JPS61189965A (ja) * | 1985-02-19 | 1986-08-23 | Oki Electric Ind Co Ltd | 光プリントヘツド |
DE3683195D1 (de) * | 1985-06-28 | 1992-02-13 | Takiron Co | Matrix aus optischen leitern fuer eine punktmatrix-leuchtanzeige. |
JPS62261465A (ja) * | 1986-05-08 | 1987-11-13 | Mitsubishi Electric Corp | 光プリンタヘツド |
JPS6320132U (ko) * | 1986-07-21 | 1988-02-09 | ||
JPS6348502A (ja) * | 1986-08-18 | 1988-03-01 | Nikon Corp | 反射鏡 |
US4779108A (en) * | 1986-11-18 | 1988-10-18 | Sanyo Electric Co., Ltd. | Optical printer head |
JPS63142685A (ja) * | 1986-12-04 | 1988-06-15 | Yokogawa Electric Corp | Ledアレ− |
JPS63256466A (ja) * | 1987-04-14 | 1988-10-24 | Fuji Photo Film Co Ltd | 記録用ヘツド |
US4766448A (en) * | 1987-08-19 | 1988-08-23 | Sanders Associates, Inc. | Electrostatic printhead method and apparatus |
-
1988
- 1988-12-17 KR KR1019880016846A patent/KR910003735B1/ko not_active IP Right Cessation
-
1989
- 1989-07-28 JP JP1194408A patent/JPH02185076A/ja active Pending
- 1989-08-29 US US07/399,951 patent/US4910534A/en not_active Expired - Lifetime
- 1989-09-08 DE DE3930031A patent/DE3930031C2/de not_active Expired - Lifetime
- 1989-12-18 GB GB8928564A patent/GB2226185B/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101329435B1 (ko) * | 2006-05-03 | 2013-11-14 | 오스람 옵토 세미컨덕터스 게엠베하 | 지지 기판을 포함하는 복사-방출 반도체 몸체 및 이의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR910003735B1 (ko) | 1991-06-10 |
JPH02185076A (ja) | 1990-07-19 |
GB2226185B (en) | 1993-06-02 |
GB8928564D0 (en) | 1990-02-21 |
US4910534A (en) | 1990-03-20 |
GB2226185A (en) | 1990-06-20 |
DE3930031A1 (de) | 1990-06-28 |
DE3930031C2 (de) | 1994-10-13 |
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Legal Events
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
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GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20050506 Year of fee payment: 15 |
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