JP5520243B2 - 電力表面取り付けの発光ダイ・パッケージ - Google Patents
電力表面取り付けの発光ダイ・パッケージ Download PDFInfo
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- JP5520243B2 JP5520243B2 JP2011032604A JP2011032604A JP5520243B2 JP 5520243 B2 JP5520243 B2 JP 5520243B2 JP 2011032604 A JP2011032604 A JP 2011032604A JP 2011032604 A JP2011032604 A JP 2011032604A JP 5520243 B2 JP5520243 B2 JP 5520243B2
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- Prior art keywords
- light emitting
- substrate
- die package
- emitting die
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229920003023 plastic Polymers 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002775 capsule Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000003989 dielectric material Substances 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 abstract description 8
- 239000012777 electrically insulating material Substances 0.000 abstract description 2
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- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 239000005997 Calcium carbide Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
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- 229920001109 fluorescent polymer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- CLZWAWBPWVRRGI-UHFFFAOYSA-N tert-butyl 2-[2-[2-[2-[bis[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]amino]-5-bromophenoxy]ethoxy]-4-methyl-n-[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]anilino]acetate Chemical compound CC1=CC=C(N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)C(OCCOC=2C(=CC=C(Br)C=2)N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)=C1 CLZWAWBPWVRRGI-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Knives (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
本発明は、添付の特許請求の範囲によって制限される。次において、複数の請求項は、米国特許法112条に定められた”手段又は工程(means or step for)”の利益を得るために作成された複数の請求項は、”ための手段(means for)”なる句によって特定される。
Claims (15)
- 基板と、
前記基板上に設けられた第1の伝導部と、
前記第1の伝導部から離間した、前記基板上に設けられた第2の伝導部であって、前記第1及び第2の伝導部の少なくとも1つが、発光ダイを取り付けるための取り付けパッドを有する、第2の伝導部と、
前記基板に機械的に係合する少なくとも1つの脚を備え、前記取り付けパッドを略囲い、自身に棚を有する反射体と、
前記発光ダイをカプセル化するために光学的に透明なポリマを有し、前記取り付けパッド及び前記棚上で前記反射体内に位置するエンカプセレーション材料と、
前記取り付けパッドを被い、前記反射体の前記棚の上方で前記エンカプセレーション材料上に位置するレンズであって、光学的材料を受容するように適合した空間を備えるレンズと、を備える発光ダイ・パッケージ。 - 前記基板に取り付けられ、前記第1及び第2の伝導部に接続される発光ダイオード(LED)を更に備える、請求項1に記載の発光ダイ・パッケージ。
- 前記第1及び第2の伝導部は、複数の金属トレースを含む、請求項1に記載の発光ダイ・パッケージ。
- 前記反射体は、銅及びアルミニウムからなる1つの郡から選択される金属を含む、請求項1に記載の発光ダイ・パッケージ。
- 前記反射体は、銅及びアルミニウムの合金からなる金属を含む、請求項1に記載の発光ダイ・パッケージ。
- 前記基板は、第1の表面と、前記第1の表面に対向する第2の表面と、前記基板を通る少なくとも1つのバイヤ・ホールと、を更に備える、請求項1に記載の発光ダイ・パッケージ。
- 前記第1及び第2の伝導部を被覆して前記第1及び第2の伝導部を密封するための誘電体材料を更に備え、前記誘電体材料による被覆により前記反射体から前記基板が絶縁される、請求項1に記載の発光ダイ・パッケージ。
- 前記基板に結合される外部ヒート・シンクを更に備える、請求項1に記載の発光ダイ・パッケージ。
- 前記基板は、前記外部ヒート・シンクとの結合のために複数の金属でメッキされた底部を有する、請求項8に記載の発光ダイ・パッケージ。
- 前記伝導部の少なくとも1つは、前記取り付けパッドから前記基板の1つの面へ延びる、請求項1に記載の発光ダイ・パッケージ。
- 前記基板が、前記反射体に機械的に係合する1つ以上の側面に沿って複数のフランジを備える、請求項1に記載の発光ダイ・パッケージ。
- 前記反射体は、反射表面を画定する、請求項1に記載の発光ダイ・パッケージ。
- 前記反射体は、アルミニウム、銅、セラミックス及びプラスチックからなる1つの郡から選択される材料を含む、請求項1に記載の発光ダイ・パッケージ。
- 前記レンズは拡散剤を備える、請求項1に記載の発光ダイ・パッケージ。
- 前記レンズは1つの発光体を備える、請求項1に記載の発光ダイ・パッケージ。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40825402P | 2002-09-04 | 2002-09-04 | |
US60/408,254 | 2002-09-04 | ||
US10/446,532 US7264378B2 (en) | 2002-09-04 | 2003-05-27 | Power surface mount light emitting die package |
US10/446,532 | 2003-05-27 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004534428A Division JP4731906B2 (ja) | 2002-09-04 | 2003-09-02 | 電力表面取り付けの発光ダイ・パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011129950A JP2011129950A (ja) | 2011-06-30 |
JP5520243B2 true JP5520243B2 (ja) | 2014-06-11 |
Family
ID=31981582
Family Applications (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004534428A Expired - Lifetime JP4731906B2 (ja) | 2002-09-04 | 2003-09-02 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032598A Expired - Lifetime JP5746877B2 (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032602A Pending JP2011129949A (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032600A Expired - Lifetime JP5629601B2 (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032601A Expired - Lifetime JP5520242B2 (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032599A Expired - Lifetime JP5520241B2 (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032604A Expired - Lifetime JP5520243B2 (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032603A Pending JP2011139087A (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
Family Applications Before (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004534428A Expired - Lifetime JP4731906B2 (ja) | 2002-09-04 | 2003-09-02 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032598A Expired - Lifetime JP5746877B2 (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032602A Pending JP2011129949A (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032600A Expired - Lifetime JP5629601B2 (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032601A Expired - Lifetime JP5520242B2 (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
JP2011032599A Expired - Lifetime JP5520241B2 (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011032603A Pending JP2011139087A (ja) | 2002-09-04 | 2011-02-17 | 電力表面取り付けの発光ダイ・パッケージ |
Country Status (11)
Country | Link |
---|---|
US (1) | US7264378B2 (ja) |
EP (2) | EP1537603B1 (ja) |
JP (8) | JP4731906B2 (ja) |
KR (5) | KR101082145B1 (ja) |
CN (1) | CN100414698C (ja) |
AT (1) | ATE400896T1 (ja) |
AU (1) | AU2003276860A1 (ja) |
CA (1) | CA2496937A1 (ja) |
DE (1) | DE60322074D1 (ja) |
TW (1) | TWI331380B (ja) |
WO (1) | WO2004023522A2 (ja) |
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