KR900002434A - 세라믹 기판상의 편평한 회로내에 유전층을 제조하는 방법 및 노출 마스크 - Google Patents

세라믹 기판상의 편평한 회로내에 유전층을 제조하는 방법 및 노출 마스크 Download PDF

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Publication number
KR900002434A
KR900002434A KR1019890009870A KR890009870A KR900002434A KR 900002434 A KR900002434 A KR 900002434A KR 1019890009870 A KR1019890009870 A KR 1019890009870A KR 890009870 A KR890009870 A KR 890009870A KR 900002434 A KR900002434 A KR 900002434A
Authority
KR
South Korea
Prior art keywords
coating
transparent
fabrication
exposure mask
dielectric layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019890009870A
Other languages
English (en)
Korean (ko)
Inventor
애덤지크 앤드류
엘리스 델라니 윌리엄
Original Assignee
원본미기재
이 아이 듀우판 디 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 이 아이 듀우판 디 네모아 앤드 캄파니 filed Critical 원본미기재
Publication of KR900002434A publication Critical patent/KR900002434A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Gas-Filled Discharge Tubes (AREA)
KR1019890009870A 1988-07-11 1989-07-10 세라믹 기판상의 편평한 회로내에 유전층을 제조하는 방법 및 노출 마스크 Ceased KR900002434A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3823463A DE3823463C1 (enExample) 1988-07-11 1988-07-11
DEP3823463.7 1988-07-11

Publications (1)

Publication Number Publication Date
KR900002434A true KR900002434A (ko) 1990-02-28

Family

ID=6358435

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890009870A Ceased KR900002434A (ko) 1988-07-11 1989-07-10 세라믹 기판상의 편평한 회로내에 유전층을 제조하는 방법 및 노출 마스크

Country Status (5)

Country Link
US (1) US5098815A (enExample)
EP (1) EP0350876A3 (enExample)
JP (1) JPH02148881A (enExample)
KR (1) KR900002434A (enExample)
DE (1) DE3823463C1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018793B1 (en) * 1995-12-07 2006-03-28 Diversa Corporation Combinatorial screening of mixed populations of organisms
DE19607671B4 (de) * 1996-02-29 2004-08-26 INSTITUT FüR MIKROTECHNIK MAINZ GMBH Verfahren zur Herstellung optischer Bauelemente mit angekoppelten Lichtwellenleitern und nach diesem Verfahren hergestellte Bauelemente
KR100229611B1 (ko) * 1996-06-12 1999-11-15 구자홍 액정표시장치의 제조방법
JP3810043B2 (ja) * 1998-09-30 2006-08-16 ペルメレック電極株式会社 クロムめっき用電極
US6569604B1 (en) * 1999-06-30 2003-05-27 International Business Machines Corporation Blind via formation in a photoimageable dielectric material
US6548224B1 (en) * 2000-03-07 2003-04-15 Kulicke & Soffa Holdings, Inc. Wiring substrate features having controlled sidewall profiles
US20060027307A1 (en) * 2004-08-03 2006-02-09 Bidwell Larry A Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein
US12313297B2 (en) * 2020-01-27 2025-05-27 Lexmark International, Inc. Thin-walled tube heater for fluid

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5783094A (en) * 1980-11-11 1982-05-24 Nippon Telegraph & Telephone Method of producing multilayer printed circuit board
DD234196A3 (de) * 1983-02-09 1986-03-26 Ptnjj Npo Elektronpribor Fotoempfindliche dielektrische mischung
JPS60135949A (ja) * 1983-12-23 1985-07-19 Matsushita Electric Works Ltd 光成形体の製造方法
US4750092A (en) * 1985-11-20 1988-06-07 Kollmorgen Technologies Corporation Interconnection package suitable for electronic devices and methods for producing same
EP0227851B1 (de) * 1985-12-21 1991-02-27 Ibm Deutschland Gmbh Verfahren zum Herstellen eines Photolackmusters
JPS62283699A (ja) * 1986-05-31 1987-12-09 旭化成株式会社 多層配線基板の製造法
JPS6318351A (ja) * 1986-07-11 1988-01-26 Hitachi Micro Comput Eng Ltd パタ−ン形成用マスク
US4912022A (en) * 1988-12-27 1990-03-27 Motorola, Inc. Method for sloping the profile of an opening in resist

Also Published As

Publication number Publication date
EP0350876A3 (en) 1991-09-25
US5098815A (en) 1992-03-24
EP0350876A2 (en) 1990-01-17
DE3823463C1 (enExample) 1990-02-01
JPH02148881A (ja) 1990-06-07

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