DE3823463C1 - - Google Patents

Info

Publication number
DE3823463C1
DE3823463C1 DE3823463A DE3823463A DE3823463C1 DE 3823463 C1 DE3823463 C1 DE 3823463C1 DE 3823463 A DE3823463 A DE 3823463A DE 3823463 A DE3823463 A DE 3823463A DE 3823463 C1 DE3823463 C1 DE 3823463C1
Authority
DE
Germany
Prior art keywords
mask
substrate
openings
coating
side walls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3823463A
Other languages
German (de)
English (en)
Inventor
Andrew Dipl.-Chem. 6072 Dreieich De Adamczyk
William Ellis Hockessin Del. Us Delaney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont de Nemours Deutschland GmbH
Original Assignee
DuPont de Nemours Deutschland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DuPont de Nemours Deutschland GmbH filed Critical DuPont de Nemours Deutschland GmbH
Priority to DE3823463A priority Critical patent/DE3823463C1/de
Priority to US07/367,342 priority patent/US5098815A/en
Priority to KR1019890009870A priority patent/KR900002434A/ko
Priority to EP19890112685 priority patent/EP0350876A3/en
Priority to JP1178883A priority patent/JPH02148881A/ja
Application granted granted Critical
Publication of DE3823463C1 publication Critical patent/DE3823463C1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE3823463A 1988-07-11 1988-07-11 Expired - Fee Related DE3823463C1 (enExample)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE3823463A DE3823463C1 (enExample) 1988-07-11 1988-07-11
US07/367,342 US5098815A (en) 1988-07-11 1989-06-16 Process for the production of dielectric layers in planar circuits on ceramics substrates
KR1019890009870A KR900002434A (ko) 1988-07-11 1989-07-10 세라믹 기판상의 편평한 회로내에 유전층을 제조하는 방법 및 노출 마스크
EP19890112685 EP0350876A3 (en) 1988-07-11 1989-07-11 Process for the production of dielectric layers in planar circuits on ceramic substrates
JP1178883A JPH02148881A (ja) 1988-07-11 1989-07-11 誘電体層の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3823463A DE3823463C1 (enExample) 1988-07-11 1988-07-11

Publications (1)

Publication Number Publication Date
DE3823463C1 true DE3823463C1 (enExample) 1990-02-01

Family

ID=6358435

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3823463A Expired - Fee Related DE3823463C1 (enExample) 1988-07-11 1988-07-11

Country Status (5)

Country Link
US (1) US5098815A (enExample)
EP (1) EP0350876A3 (enExample)
JP (1) JPH02148881A (enExample)
KR (1) KR900002434A (enExample)
DE (1) DE3823463C1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19607671A1 (de) * 1996-02-29 1997-09-04 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung optischer Bauelemente mit angekoppelten Lichtwellenleitern und nach diesem Verfahren hergestellte Bauelemente
DE19724245B4 (de) * 1996-06-12 2009-09-10 Lg Display Co., Ltd. Flüssigkristallanzeige und Herstellungsverfahren dafür

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018793B1 (en) * 1995-12-07 2006-03-28 Diversa Corporation Combinatorial screening of mixed populations of organisms
JP3810043B2 (ja) * 1998-09-30 2006-08-16 ペルメレック電極株式会社 クロムめっき用電極
US6569604B1 (en) * 1999-06-30 2003-05-27 International Business Machines Corporation Blind via formation in a photoimageable dielectric material
US6548224B1 (en) * 2000-03-07 2003-04-15 Kulicke & Soffa Holdings, Inc. Wiring substrate features having controlled sidewall profiles
US20060027307A1 (en) * 2004-08-03 2006-02-09 Bidwell Larry A Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein
US12313297B2 (en) * 2020-01-27 2025-05-27 Lexmark International, Inc. Thin-walled tube heater for fluid

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD234196A3 (de) * 1983-02-09 1986-03-26 Ptnjj Npo Elektronpribor Fotoempfindliche dielektrische mischung
DE3639420A1 (de) * 1985-11-20 1987-05-27 Kollmorgen Tech Corp Elektrisches verbindungsbauteil und verfahren zu dessen herstellung
EP0227851A1 (de) * 1985-12-21 1987-07-08 Ibm Deutschland Gmbh Verfahren zum Herstellen eines Photolackmusters

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5783094A (en) * 1980-11-11 1982-05-24 Nippon Telegraph & Telephone Method of producing multilayer printed circuit board
JPS60135949A (ja) * 1983-12-23 1985-07-19 Matsushita Electric Works Ltd 光成形体の製造方法
JPS62283699A (ja) * 1986-05-31 1987-12-09 旭化成株式会社 多層配線基板の製造法
JPS6318351A (ja) * 1986-07-11 1988-01-26 Hitachi Micro Comput Eng Ltd パタ−ン形成用マスク
US4912022A (en) * 1988-12-27 1990-03-27 Motorola, Inc. Method for sloping the profile of an opening in resist

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD234196A3 (de) * 1983-02-09 1986-03-26 Ptnjj Npo Elektronpribor Fotoempfindliche dielektrische mischung
DE3639420A1 (de) * 1985-11-20 1987-05-27 Kollmorgen Tech Corp Elektrisches verbindungsbauteil und verfahren zu dessen herstellung
EP0227851A1 (de) * 1985-12-21 1987-07-08 Ibm Deutschland Gmbh Verfahren zum Herstellen eines Photolackmusters

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Abolafa, O.R. et.al.: Dual-Density Masks for Photoresist. In: IBM TDB, Bd. 20, Nr. 3, Aug. 1977S. 964-965 *
BAEHRTE, D. et al.: Process for Producing and Enbedded Conductor Structure for Multilayer Circuit Boards, In: IBM TDB, Bd.27, Nr.5, Okt. 1984, S.3086-3087 *
Feder, R. und Spiller, E.: Fabrication of Overlapping Patterns from a Single Exposure X-Ray Lithography. In: IBM TDB, Bd. 17, Nr. 7, Dez. 1974, S. 2168-2169 *
KEISLER, F.Z. u. SCAPPLE, R.Y.: A Thin-Film Multilayering Technique for Hybrid Microcircuits, In: Solid State Technology, Bd.17, H.5, Mai 1974, S.44-47 *
Low Resistance Interconnection Bonding Technique, In: IBM TDB, Bd.30, Nr.11, April 1988, S.487-488 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19607671A1 (de) * 1996-02-29 1997-09-04 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung optischer Bauelemente mit angekoppelten Lichtwellenleitern und nach diesem Verfahren hergestellte Bauelemente
DE19607671B4 (de) * 1996-02-29 2004-08-26 INSTITUT FüR MIKROTECHNIK MAINZ GMBH Verfahren zur Herstellung optischer Bauelemente mit angekoppelten Lichtwellenleitern und nach diesem Verfahren hergestellte Bauelemente
DE19724245B4 (de) * 1996-06-12 2009-09-10 Lg Display Co., Ltd. Flüssigkristallanzeige und Herstellungsverfahren dafür

Also Published As

Publication number Publication date
EP0350876A3 (en) 1991-09-25
KR900002434A (ko) 1990-02-28
US5098815A (en) 1992-03-24
JPH02148881A (ja) 1990-06-07
EP0350876A2 (en) 1990-01-17

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Legal Events

Date Code Title Description
8100 Publication of patent without earlier publication of application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee