KR900002434A - 세라믹 기판상의 편평한 회로내에 유전층을 제조하는 방법 및 노출 마스크 - Google Patents

세라믹 기판상의 편평한 회로내에 유전층을 제조하는 방법 및 노출 마스크 Download PDF

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Publication number
KR900002434A
KR900002434A KR1019890009870A KR890009870A KR900002434A KR 900002434 A KR900002434 A KR 900002434A KR 1019890009870 A KR1019890009870 A KR 1019890009870A KR 890009870 A KR890009870 A KR 890009870A KR 900002434 A KR900002434 A KR 900002434A
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KR
South Korea
Prior art keywords
coating
transparent
fabrication
exposure mask
dielectric layers
Prior art date
Application number
KR1019890009870A
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English (en)
Inventor
애덤지크 앤드류
엘리스 델라니 윌리엄
Original Assignee
원본미기재
이 아이 듀우판 디 네모아 앤드 캄파니
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Application filed by 원본미기재, 이 아이 듀우판 디 네모아 앤드 캄파니 filed Critical 원본미기재
Publication of KR900002434A publication Critical patent/KR900002434A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음

Description

세라믹 기판상의 편평한 회로내에 유전층을 제조하는 방법 및 노출 마스크
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 예리한 가장자리를 갖는 투명한 지역과 예리하지 않은 가장자리를 갖는 영역의 중심을 통해 마이크로덴시토미터로 샘플링 했을때 알 수 있는 바와 같이, 마스크 평면상에서 공간 좌표 x를 따르는 마스크의 광학적 밀도D를 보여주는 것이다.
제 2도는 기판 평면상에서 x의 직각평행투영에 의해 형성된 공간좌표 x'위에서, 사진형성페이스트 층을 현상시키고 연소시켜, 빛에 노출시킴으로써 제1도에 따르는 마스크에 의해 제조된 유전층 두께 h를 보여주는 것이다.

Claims (4)

  1. (a)양화 사진형성가능한 유전 페이스트를 갖는 전도성 패턴이 임의로 제공된 세라믹 기판을 코우팅시킨 다음 그 코우팅을 건조시키고 ; (b) 경사진 측벽을 갖는 구경이 형성되는 영역에 상응하는, (예리한 경계선이 없는)불투명하고 투명한 영역들을 갖는 마스크를 통하여, 그 코우팅을 빛에 노출시키고 (c) 그 코우팅을 현상시키고 연소시키는 것을 특징으로 하는, 기판의 평면에 대해 예각으로 경사진 측벽을 갖는 구경을 지닌 세라믹 기판상에 편평한 회로의 형성에 있어서 유전층을 제조하는 방법.
  2. 제1항에 있어서, 사진형성 가능한 유전 페이스트가 양화 포토레지스트 및 분말형태의 유전물질을 함유하는 방법.
  3. 예리한 경계선이 없는 투명하고 불투명한 영역을 갖는 노출 마스크.
  4. 제3항에 있어서, 투명하고 불투명한 영역사이에 예리한 경계선이 포함된 노출 마스크.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890009870A 1988-07-11 1989-07-10 세라믹 기판상의 편평한 회로내에 유전층을 제조하는 방법 및 노출 마스크 KR900002434A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3823463.7 1988-07-11
DE3823463A DE3823463C1 (ko) 1988-07-11 1988-07-11

Publications (1)

Publication Number Publication Date
KR900002434A true KR900002434A (ko) 1990-02-28

Family

ID=6358435

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890009870A KR900002434A (ko) 1988-07-11 1989-07-10 세라믹 기판상의 편평한 회로내에 유전층을 제조하는 방법 및 노출 마스크

Country Status (5)

Country Link
US (1) US5098815A (ko)
EP (1) EP0350876A3 (ko)
JP (1) JPH02148881A (ko)
KR (1) KR900002434A (ko)
DE (1) DE3823463C1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018793B1 (en) * 1995-12-07 2006-03-28 Diversa Corporation Combinatorial screening of mixed populations of organisms
DE19607671B4 (de) * 1996-02-29 2004-08-26 INSTITUT FüR MIKROTECHNIK MAINZ GMBH Verfahren zur Herstellung optischer Bauelemente mit angekoppelten Lichtwellenleitern und nach diesem Verfahren hergestellte Bauelemente
KR100229611B1 (ko) * 1996-06-12 1999-11-15 구자홍 액정표시장치의 제조방법
JP3810043B2 (ja) * 1998-09-30 2006-08-16 ペルメレック電極株式会社 クロムめっき用電極
US6569604B1 (en) * 1999-06-30 2003-05-27 International Business Machines Corporation Blind via formation in a photoimageable dielectric material
US6548224B1 (en) * 2000-03-07 2003-04-15 Kulicke & Soffa Holdings, Inc. Wiring substrate features having controlled sidewall profiles
US20060027307A1 (en) * 2004-08-03 2006-02-09 Bidwell Larry A Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein
US20210231345A1 (en) * 2020-01-27 2021-07-29 Lexmark International, Inc. Thin-walled tube heater for fluid

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5783094A (en) * 1980-11-11 1982-05-24 Nippon Telegraph & Telephone Method of producing multilayer printed circuit board
DD234196A3 (de) * 1983-02-09 1986-03-26 Ptnjj Npo Elektronpribor Fotoempfindliche dielektrische mischung
JPS60135949A (ja) * 1983-12-23 1985-07-19 Matsushita Electric Works Ltd 光成形体の製造方法
US4750092A (en) * 1985-11-20 1988-06-07 Kollmorgen Technologies Corporation Interconnection package suitable for electronic devices and methods for producing same
DE3581941D1 (de) * 1985-12-21 1991-04-04 Ibm Deutschland Verfahren zum herstellen eines photolackmusters.
JPS62283699A (ja) * 1986-05-31 1987-12-09 旭化成株式会社 多層配線基板の製造法
JPS6318351A (ja) * 1986-07-11 1988-01-26 Hitachi Micro Comput Eng Ltd パタ−ン形成用マスク
US4912022A (en) * 1988-12-27 1990-03-27 Motorola, Inc. Method for sloping the profile of an opening in resist

Also Published As

Publication number Publication date
US5098815A (en) 1992-03-24
EP0350876A3 (en) 1991-09-25
DE3823463C1 (ko) 1990-02-01
JPH02148881A (ja) 1990-06-07
EP0350876A2 (en) 1990-01-17

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