JPS5568655A - Manufacturing method of wiring - Google Patents
Manufacturing method of wiringInfo
- Publication number
- JPS5568655A JPS5568655A JP14309678A JP14309678A JPS5568655A JP S5568655 A JPS5568655 A JP S5568655A JP 14309678 A JP14309678 A JP 14309678A JP 14309678 A JP14309678 A JP 14309678A JP S5568655 A JPS5568655 A JP S5568655A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring
- flat surface
- mask
- sio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To obtain a flat surface, by etching an electroconductive layer through a resist mask, covering the layer with an SiO film of the same thickness as the layer, and lifting off the mask.
CONSTITUTION: An aluminum layer 11 is provided on a substrate 1. The layer 11 is etched through a resist mask 12 to make an aluminum wiring layer 13. An SiO-layer 14 of the same thickness as the layer 13 is then evaporated in each opening of the layer 13. When the SiO-layer 14 on the mask is lifted off, a flat surface is produced. When a multilayer wiring is provided on the flat surface, the wiring becomes falt. The wiring does not snap becuase there is no step.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14309678A JPS5831731B2 (en) | 1978-11-20 | 1978-11-20 | Wiring formation method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14309678A JPS5831731B2 (en) | 1978-11-20 | 1978-11-20 | Wiring formation method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5568655A true JPS5568655A (en) | 1980-05-23 |
JPS5831731B2 JPS5831731B2 (en) | 1983-07-08 |
Family
ID=15330809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14309678A Expired JPS5831731B2 (en) | 1978-11-20 | 1978-11-20 | Wiring formation method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5831731B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57176745A (en) * | 1981-04-21 | 1982-10-30 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of multilayer wiring |
JPS6123344A (en) * | 1984-07-11 | 1986-01-31 | Hitachi Ltd | Manufacture of semiconductor integrated circuit |
WO2011010236A1 (en) * | 2009-07-21 | 2011-01-27 | Philips Lumileds Lighting Company, Llc | Reflective contact for a semiconductor light emitting device |
JP2014218705A (en) * | 2013-05-09 | 2014-11-20 | 日本放送協会 | Vacuum suction method, vacuum treatment unit, and sublimation pump |
-
1978
- 1978-11-20 JP JP14309678A patent/JPS5831731B2/en not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57176745A (en) * | 1981-04-21 | 1982-10-30 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of multilayer wiring |
JPS639660B2 (en) * | 1981-04-21 | 1988-03-01 | Nippon Telegraph & Telephone | |
JPS6123344A (en) * | 1984-07-11 | 1986-01-31 | Hitachi Ltd | Manufacture of semiconductor integrated circuit |
JPH0334851B2 (en) * | 1984-07-11 | 1991-05-24 | Hitachi Ltd | |
WO2011010236A1 (en) * | 2009-07-21 | 2011-01-27 | Philips Lumileds Lighting Company, Llc | Reflective contact for a semiconductor light emitting device |
US8076682B2 (en) | 2009-07-21 | 2011-12-13 | Koninklijke Philips Electronics N.V. | Contact for a semiconductor light emitting device |
JP2014218705A (en) * | 2013-05-09 | 2014-11-20 | 日本放送協会 | Vacuum suction method, vacuum treatment unit, and sublimation pump |
Also Published As
Publication number | Publication date |
---|---|
JPS5831731B2 (en) | 1983-07-08 |
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