KR880009403A - 내부 구리 도체를 갖고 있는 세라믹 다층 구조물 및 이의 제조 방법 - Google Patents

내부 구리 도체를 갖고 있는 세라믹 다층 구조물 및 이의 제조 방법 Download PDF

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Publication number
KR880009403A
KR880009403A KR1019880000150A KR880000150A KR880009403A KR 880009403 A KR880009403 A KR 880009403A KR 1019880000150 A KR1019880000150 A KR 1019880000150A KR 880000150 A KR880000150 A KR 880000150A KR 880009403 A KR880009403 A KR 880009403A
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South Korea
Prior art keywords
ceramic layer
copper
unbaked
unbaked ceramic
unpatterned
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KR1019880000150A
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English (en)
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KR900007896B1 (ko
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번 이안
Original Assignee
제임스 제이.플린
이.아이.듀우판 디 네모아 앤드 캄파니
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Publication of KR880009403A publication Critical patent/KR880009403A/ko
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Publication of KR900007896B1 publication Critical patent/KR900007896B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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    • C04B35/634—Polymers
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5127—Cu, e.g. Cu-CuO eutectic
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    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
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    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
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    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

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  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Capacitors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Conductive Materials (AREA)

Abstract

내용 없음.

Description

내부 구리 도체를 갖고 있는 세라믹 다층 구조물 및 이의 제조 방법
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Claims (20)

  1. 세라믹 절연 물질의 미세 분배 입자를 포함하고, 미소성 세라믹층내의 열가소성 중합체 결합재의 비용제인 유기 용제내에 용해된 비-셀루로오스 중합체 결합재를 포함하는 액체 유기 매체내에 분산된 구리 금속의 미세 분배 입자를 포함하는 도전성 페이스트와 열가소성 아크릴 중합체 결합재의 후막 구리 고상 매트릭스내에 분산된 자용융 유리를 비환원시키는, 미소성 세라믹 층을 사용하여 내부 구리 도체를 갖고 있는 밀봉 융제-소결형 세라믹 다층 요소를 제조하는 방법에 있어서, a. 제1미소성 세라믹층의 비패턴화 표면에 도전성 페이스트의 패턴을 인가하는 수단, b. 제1미소성 세라믹층의 비패턴화 측면에 비패턴화 미소성 세라믹 층을 인가하는 수단, c. 다른 미소성 세라믹층의 비패턴화 표면에 도전성 페이스트의 패턴을 인가하는 수단, d. 미소성 세라미층들 사이에 샌드위치된 다수의 도전성 패턴층을 포함하는 다층 구조물을 형성하기 위해 스텝 b.의 합성 구조물의 외부 표면에 스텝 c. 의 다른 미소성 세라믹층의 패턴화측면을 인가하는 수단. e. 소텝 c 및 d의 순차를 임의로 반복하는 수단, 및 f. 도전성 페이스트내의 구리를 산화시키지 않고서 유기체를 완전히 제거하기에 충분한 시간 및 온도로 버퍼된 저 산소-함유 분위기 내에서 스텝 d 및 e의 합성 구조물을 가열하는 수단을 포함하는 것을 특징으로 하는 방법.
  2. 세라믹 절연 물질의 미세 분배 입자를 포함하고, 미소성 세라믹층내의 열가소성 중합체 결합재의 비용제인 유기 용제내에 용해된 비-셀룰로오스 중합채 결합재를 포함하는 액체 유기 매체내에 분산된 구리 금속의 미세 분배 입자를 포함하는 후막 구리 도전성 페이스트와 열가소성 아크릴 중합체 결합재의 고상 매트릭스내에 분산된 저용융 유리를 비환원시키는 미소성 세라믹층을 사용하여 내부 구리 도체를 갖고 있는 밀봉 융제-소결형 세라믹 다층 요소를 제조하는 방법에 있어서, a. 제1미소성 세라믹층의 비패턴화 표면에 도전성 페이스트의 패턴을 인가하는 수단, b. 제1미소성 세라믹층의 패턴화 측면에 비패턴화 미소성 세락믹층을 인가하는 수단, c. 스텝 b의 합성 구조물의 비패턴화 외부 표면에 도전성 페이스트의 패턴을 인가하는 수단, d. 미소성 세라믹층들 사이에 샌드위치 된 다수의 도전성 패턴층을 포함하는 다층 구조물의 형성하기 위해 스텝 c의 합성 구조물을 패턴화 외부 표면에 비패턴화된 미소성 세라믹층을 인가하는 수단, e. 스텝 c 및 d의 순차를 반복하는 수단, 및 f. 도전성 페이스트내의 구리를 산화시키지 않고서 유기체를 완전히 제거하기에 충분한 산소 부분 압력과 시간 및 온도로 버퍼된 저 산소-함유 분위기에서 스텝 c 및 d 의 합성 구조물을 가열하는 수단을 포함하는 것을 특징으로 하는 방법.
  3. 제1항 또는 제2항에 있어서, 미소성 세라믹층이 세라믹 미소성 테이프인 것을 특징으로 하는 방법.
  4. 제1항 또는 제2항에 있어서, 미소성 세라믹층이 습식공정에 의해 피착되는 것을 특징으로 하는 방법.
  5. 제1항 또는 제2항에 있어서, 비-셀루로오스 중합체 결합재가 아크릴계 중합체인 것을 특징으로 하는 방법.
  6. 제1항 또는 제2항에 있어서, 스텝 a에서, 도전성 페이스트가 미소성 세라믹층의 다수의 라미네이트층을 포함하는 기판에 인가되는 것을 특징으로 하는 방법.
  7. 제1항 또는 제2항에 있어서, 최소한 한 비패턴화 미소성 세라믹층이 도전성 페이스트 패턴을 인가하기 전에 스텝 b의 합성 구조물의 비패턴화 외부 표면상에 제공함으로써 삽입되는 것을 특징으로 하는 방법.
  8. 제1항 또는 제2항에 있어서, 다층 구조물이 전자 부품을 장착하기 위한 기판인 것을 특징으로 하는 방법.
  9. 제1항 또는 제2항에 있어서, 다층 구조물이 세라믹 캐패시터인 것을 특징으로 하는 방법.
  10. 제1항 또는 제2항에 있어서, 다층 구조물이 내부 캐패시터 및 저항기층을 갖고 있는 기판인 것을 특징으로 하는 방법.
  11. 제1항 또는 제2항에 있어서, 미세분배 세라믹 분말이 Al2O3, SiO2, MgO, ZnO 및 이의 합성물 및 혼합물, 및 BaTiO3, SrTiO3,CaTiO3, 및 MgTiO3, 및 이의 합성물 및 혼합물과 같은 알카리 금속 티타네이트로 부터 선택되는 것을 특징으로 하는 방법.
  12. 제1항 또는 제2항에 있어서, 저용융 융제가 필수적으로 B2O3, SiO2, GeO2, P2O5및 이의 선구 물질 및 혼합물로 부터 선택된 산화물을 형성하고, LiO2, ZnO, Al2O3, BaO, CaO, SrO 및 이의 선구 물질 및 혼합물로 부터 선택된 산화물을 변형시키는 유리로 이루어진 것을 특징으로 하는 방법.
  13. 제1항 또는 제2항에 있어서, 미소성 세라믹층내의 열가소성 유기 결합재가 메틸 메타크릴레이트, 에틸메타크릴레이트, 메틸 아크릴레이트 및 이의 혼합물로 부터 선택되는 것을 특징으로 하는 방법.
  14. 제5항에 있어서, 구리 페이스트내의 아크릴 결합재 부틸 메타크릴레이트인 것을 특징으로 하는 방법.
  15. 제1항 또는 제2항에 있어서, 구리 페이스트내의 결합재용 용제가 테르피네올인 것을 특징으로 하는 방법.
  16. 제1항에 있어서, 건식 버퍼된 개스 혼합물이 N2+ CO2+ H2이고, N2대 CO2+ H2의 비가 10 미만이며, CO2대 H2의 비가 10 대 150의 범위에 있는 것을 특징으로 하는 방법.
  17. 제1항에 있어서, 온도가 850-1080℃이고 가열 및 소우크 시간이 5시간 미만인 것을 특징으로 하는 방법.
  18. 다른 비-셀루로오스 중합체가 용해될 수 없는 유기 용제내에 용해된 n-부틸 메타크릴레이트를 포함하는 액체 유기 매체내에 분산된 금속성 구리의 미세 분배 입자의 혼합물을 포함하는 것을 특징으로 하는 것을 후막 구리 페이스트 합성물.
  19. 제18항에 있어서, 유기 용제가 테르피네올인 것을 특징으로 하는 합성물.
  20. 액체 유기 매체내에 분산된 금속성 구리가 다른 아크릴 중합체가 용해될 수 없는 유기 용제내에 용해된 n-부틸 메타크릴레이트를 포함하는 액체 유기 매체내에 분산된 금속구리의 미세 분배 입자의 혼합물을 포함하는 후막 구리 페이스트의 다수의 패턴화 도전성층을 포함하고, 각각의 이 층이 세라믹 절연 물질의 미세 분배 입자를 포함하며, 후막 구리 페이스트의 유기 매체 및 미소성 세라믹층의 중합체 매트릭스의 휘발성을 취하기 위해 버퍼된 저 산소-함유 분위기에서 소성된 열가소성 아크릴 중합체 결합재의 고상 매트릭스내에 분산된 저용융 유리를 비환원시키는 미소성 세라믹층들 사이의 샌드위치 되는 것을 특징으로 하는 다층 전자 요소.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880000150A 1987-01-13 1988-01-12 내부 구리 도체를 갖고 있는 세라믹 다층 구조물 및 이의 제조방법 KR900007896B1 (ko)

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US07/003,259 US4766027A (en) 1987-01-13 1987-01-13 Method for making a ceramic multilayer structure having internal copper conductors

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DE3888370D1 (de) 1994-04-21
DE3888370T2 (de) 1994-09-08
KR900007896B1 (ko) 1990-10-22
EP0275052A2 (en) 1988-07-20
JPH0239108B2 (ko) 1990-09-04
EP0275052A3 (en) 1990-08-01
JPS63198398A (ja) 1988-08-17
EP0275052B1 (en) 1994-03-16
US4766027A (en) 1988-08-23

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