KR880001051A - 히트싱크에 부착사용하는 유연한 세그먼트 패키지속에 장치된 반도체장치 - Google Patents

히트싱크에 부착사용하는 유연한 세그먼트 패키지속에 장치된 반도체장치 Download PDF

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Publication number
KR880001051A
KR880001051A KR1019870007397A KR870007397A KR880001051A KR 880001051 A KR880001051 A KR 880001051A KR 1019870007397 A KR1019870007397 A KR 1019870007397A KR 870007397 A KR870007397 A KR 870007397A KR 880001051 A KR880001051 A KR 880001051A
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South Korea
Prior art keywords
resin body
resin
heat sink
metal body
semiconductor device
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KR1019870007397A
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English (en)
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KR950013046B1 (ko
Inventor
로마노 루이지
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원본미기재
에스지에스 마이끄로엘레뜨로니까 에스.피.에이.
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Publication of KR880001051A publication Critical patent/KR880001051A/ko
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Publication of KR950013046B1 publication Critical patent/KR950013046B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음

Description

히트싱크에 부착사용하는 유연한 세그먼트 패키지속에 장치된 반도체장비
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 외부싱크의 표면위에 고정된 본 발명의 장치의 설명도. 제2도는 장치를 형성하는 여러가지 부품들을 나타내는 제1도의 단면도. 제3도는 본 발명에 의하여 제조된 반도체 장치의 정면도 및 측면도.

Claims (5)

  1. 히트싱크 금속체의 표면위에 설치된 반도체 물질의 침과 ; 상기한 반도체 칩의 표면상의 각 연결부위에 연결도선의 수단에 의하여 적합하게 연결된 다수의 핀과 ; 상기한 칩, 상기한 연결도선, 상기한 핀, 그 자유단은 제외하고, 적어도 부분적으로 상기한 히트싱크 금속체와, 외부 지지 히트싱크에 장치를 조정하는 수단을 캡슐화하는 실질적으로 평평한 수지의 몸체를 포함하고 ; 상기한 수지몸체의 양측 세그먼트를 형성하는 적어도 두개의 상반되는 쪽으로 상기한 금속체의 주변을 넘어서 연장된 상기한 수지몸체와 ; 상기한 수지몸체의 상기한 측부 세그먼트의 각각에 존재하는 장치고정수단과 ; 수지몸체의 측부 세그먼트를 상기한 금속체로부터 기계적으로 비결합하는 굴곡부위를 마련하고, 상기한 히트싱크 금속체를 함유하는 상기한 수지몸체의 중앙부위로 부터 장치고정수단을 갖는 상기한 측부 세그먼트를 분리하는 상기한 수지몸체의 양주 표면상에 형성된 적어도 한쌍이상의 대립하는 홈들로 특징지워지는 반도체장치.
  2. 청구범위 제1항에서, 평평한 수지몸체의 두께는 상기한 두쌍의 대립하는 홈의 각각에서 전두께의 40내지 80%로 감소된 반도체 장치.
  3. 청구범위 제1항에서, 장치 고정수단은 고정나사의 스템을 수용하도록 수지몸체의 상기한 측부 세그먼트의 횡측 끝에 반원형 요입부를 갖는 반도체장치.
  4. 청구범위 제1항에서, 상기한 히트싱크 금속체는 원반의 모양을 가지며 수지 몸체의 표면으로 부터 그 두께의 일부분을 돌출시킨 반도체장치.
  5. 실질적으로 평평한 모양의 사전형성된 열가소성 수지몸체와 중앙부 및 두개의 측부분으로 세그먼트되고, 그 측부는 상기한 중앙부의 두개의 대향하는 측으로 연장되고 패키지를 고정하는 수단을 가지며, 상기한 평평한 모양의 사전형성된 수지몸체의 주표면들 상에 형성된 서로 대향하는 각정점을 갖는 두쌍 이상의 홈 수단을 포함하고 ; 상기한 홈의 쌍들은 상기한 두개의 측부분의 각각으로 부터 상기한 중앙부위를 기계적으로 분리하는 굴곡부위를 각각 정하고 ; 사전형성된 수지몸체의 상기한 중앙부위의 주표면상의 수지속에 부분적으로 포장된 히트싱크 금속체와 상기한 금속체의 주변은 상기한 사전형성된 수지몸체의 상기한 중앙부분의 주변속에 완전히 내접된 반도체장치용 패키지.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870007397A 1986-07-17 1987-07-10 히트싱크에 부착사용하는 유연한 세그먼트 패키지속에 장치된 반도체장치 KR950013046B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT83632/86A IT1201836B (it) 1986-07-17 1986-07-17 Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
IT?????86-83632A 1986-07-17
IT83632A/86 1986-07-17

Publications (2)

Publication Number Publication Date
KR880001051A true KR880001051A (ko) 1988-03-31
KR950013046B1 KR950013046B1 (ko) 1995-10-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870007397A KR950013046B1 (ko) 1986-07-17 1987-07-10 히트싱크에 부착사용하는 유연한 세그먼트 패키지속에 장치된 반도체장치

Country Status (6)

Country Link
US (1) US4887149A (ko)
EP (1) EP0254692B1 (ko)
JP (1) JPH0744245B2 (ko)
KR (1) KR950013046B1 (ko)
DE (1) DE3765592D1 (ko)
IT (1) IT1201836B (ko)

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Also Published As

Publication number Publication date
IT8683632A0 (it) 1986-07-17
US4887149A (en) 1989-12-12
EP0254692B1 (en) 1990-10-17
KR950013046B1 (ko) 1995-10-24
IT1201836B (it) 1989-02-02
DE3765592D1 (de) 1990-11-22
EP0254692A1 (en) 1988-01-27
JPS6331144A (ja) 1988-02-09
JPH0744245B2 (ja) 1995-05-15

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