DE3765592D1 - Halbleitervorrichtung angebracht in einem hochflexiblen, segmentierten gehaeuse und mit einem kuehlkoerper ausgeruestet. - Google Patents

Halbleitervorrichtung angebracht in einem hochflexiblen, segmentierten gehaeuse und mit einem kuehlkoerper ausgeruestet.

Info

Publication number
DE3765592D1
DE3765592D1 DE8787830272T DE3765592T DE3765592D1 DE 3765592 D1 DE3765592 D1 DE 3765592D1 DE 8787830272 T DE8787830272 T DE 8787830272T DE 3765592 T DE3765592 T DE 3765592T DE 3765592 D1 DE3765592 D1 DE 3765592D1
Authority
DE
Germany
Prior art keywords
refrigerator
semiconductor device
device mounted
highly flexible
segmented housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787830272T
Other languages
English (en)
Inventor
Luigi Romano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
SGS Thomson Microelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics SRL filed Critical SGS Thomson Microelectronics SRL
Application granted granted Critical
Publication of DE3765592D1 publication Critical patent/DE3765592D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
DE8787830272T 1986-07-17 1987-07-15 Halbleitervorrichtung angebracht in einem hochflexiblen, segmentierten gehaeuse und mit einem kuehlkoerper ausgeruestet. Expired - Fee Related DE3765592D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT83632/86A IT1201836B (it) 1986-07-17 1986-07-17 Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico

Publications (1)

Publication Number Publication Date
DE3765592D1 true DE3765592D1 (de) 1990-11-22

Family

ID=11323425

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787830272T Expired - Fee Related DE3765592D1 (de) 1986-07-17 1987-07-15 Halbleitervorrichtung angebracht in einem hochflexiblen, segmentierten gehaeuse und mit einem kuehlkoerper ausgeruestet.

Country Status (6)

Country Link
US (1) US4887149A (de)
EP (1) EP0254692B1 (de)
JP (1) JPH0744245B2 (de)
KR (1) KR950013046B1 (de)
DE (1) DE3765592D1 (de)
IT (1) IT1201836B (de)

Families Citing this family (40)

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JP2602545B2 (ja) * 1989-03-30 1997-04-23 山一電機工業株式会社 Ｉｃキャリア
JP2670517B2 (ja) * 1989-03-30 1997-10-29 山一電機株式会社 Ｉｃキャリア搭載形ソケットにおける接触機構
JP2594355B2 (ja) * 1989-04-28 1997-03-26 山一電機工業株式会社 Ｉｃキャリア
US5227663A (en) * 1989-12-19 1993-07-13 Lsi Logic Corporation Integral dam and heat sink for semiconductor device assembly
US5334872A (en) * 1990-01-29 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad
EP0463758A1 (de) * 1990-06-22 1992-01-02 Digital Equipment Corporation Hohlpackung für Chip und Herstellungsverfahren
IT220643Z2 (it) * 1990-10-22 1993-10-07 Marelli Autronica Dispositivo di fissaggio di componenti elettronici di potenza ad un dissipatore termico
JP2857492B2 (ja) * 1990-11-28 1999-02-17 シャープ株式会社 Ｔａｂパッケージ
US5155579A (en) * 1991-02-05 1992-10-13 Advanced Micro Devices Molded heat sink for integrated circuit package
US5107328A (en) * 1991-02-13 1992-04-21 Micron Technology, Inc. Packaging means for a semiconductor die having particular shelf structure
JP2538112Y2 (ja) * 1991-05-21 1997-06-11 シャープ株式会社 実装基板
JPH05144982A (ja) * 1991-11-19 1993-06-11 Nippon Precision Circuits Kk 集積回路装置
IT1252575B (it) * 1991-12-20 1995-06-19 Sgs Thomson Microelectronics Stampo e procedimento per la fabbricazione di dispositivi a semiconduttore in plastica, con dissipatore metallico visibile per il controllo della saldatura
US5195023A (en) * 1991-12-23 1993-03-16 At&T Bell Laboratories Integrated circuit package with strain relief grooves
FR2706729B1 (fr) * 1993-06-09 1995-09-08 Sagem Radiateur pour composants électroniques de puissance.
US5827999A (en) * 1994-05-26 1998-10-27 Amkor Electronics, Inc. Homogeneous chip carrier package
US5650593A (en) * 1994-05-26 1997-07-22 Amkor Electronics, Inc. Thermally enhanced chip carrier package
DE19609929B4 (de) * 1996-03-14 2006-10-26 Ixys Semiconductor Gmbh Leistungshalbleitermodul
DE19615481C5 (de) * 1996-04-03 2013-03-14 Curamik Electronics Gmbh Gewölbtes Metall-Keramik-Substrat
EP0805492B1 (de) * 1996-04-03 2004-06-30 Jürgen Dr.-Ing. Schulz-Harder Gewölbtes Metall-Keramik-Substrat
US6881611B1 (en) * 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
WO1998002919A1 (fr) * 1996-07-12 1998-01-22 Fujitsu Limited Procede et moule de fabrication d'un dispositif a semiconducteur, dispositif a semiconducteur, et procede de montage du dispositif
US6088226A (en) * 1999-03-31 2000-07-11 Lucent Technologies, Inc. Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink
US6589820B1 (en) 2000-06-16 2003-07-08 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6483044B1 (en) 2000-08-23 2002-11-19 Micron Technology, Inc. Interconnecting substrates for electrical coupling of microelectronic components
US6979595B1 (en) * 2000-08-24 2005-12-27 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US6838760B1 (en) 2000-08-28 2005-01-04 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units
JP2002110718A (ja) * 2000-09-29 2002-04-12 Hitachi Ltd 半導体装置の製造方法
US6710457B1 (en) * 2000-10-20 2004-03-23 Silverbrook Research Pty Ltd Integrated circuit carrier
DE10149886A1 (de) 2001-10-10 2003-04-30 Eupec Gmbh & Co Kg Leistunghalbleitermodul
US7187545B2 (en) 2002-05-22 2007-03-06 Siemens Aktiengesellschaft Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support
US6700195B1 (en) * 2003-03-26 2004-03-02 Delphi Technologies, Inc. Electronic assembly for removing heat from a flip chip
DE10326176A1 (de) * 2003-06-10 2005-01-05 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Leistungshalbleitermodul
US7833456B2 (en) 2007-02-23 2010-11-16 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
TWI425907B (zh) * 2010-09-21 2014-02-01 Delta Electronics Inc 電子元件和散熱裝置之組合結構及其絕緣元件
JP6208447B2 (ja) * 2013-03-28 2017-10-04 京セラ株式会社 電子素子収納用パッケージおよび電子装置
DE102013220880B4 (de) * 2013-10-15 2016-08-18 Infineon Technologies Ag Elektronisches Halbleitergehäuse mit einer elektrisch isolierenden, thermischen Schnittstellenstruktur auf einer Diskontinuität einer Verkapselungsstruktur sowie ein Herstellungsverfahren dafür und eine elektronische Anordung dies aufweisend
EP2940718B1 (de) * 2014-04-30 2018-04-18 Vincotech GmbH Anordnung zur Kühlung eines Leistungsmoduls
JP6301857B2 (ja) * 2015-02-24 2018-03-28 株式会社東芝 半導体モジュール
JP7325316B2 (ja) * 2019-12-16 2023-08-14 三菱電機株式会社 半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3839660A (en) * 1973-02-05 1974-10-01 Gen Motors Corp Power semiconductor device package
DE2712543C2 (de) * 1976-03-24 1982-11-11 Hitachi, Ltd., Tokyo Anordnung eines Halbleiterbauelements auf einer Montageplatte
US4224663A (en) * 1979-02-01 1980-09-23 Power Control Corporation Mounting assembly for semiconductive controlled rectifiers
JPS55113349A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Semiconductor device
FR2455785A1 (fr) * 1979-05-02 1980-11-28 Thomson Csf Support isolateur electrique, a faible resistance thermique, et embase ou boitier pour composant de puissance, comportant un tel support
IT1212780B (it) * 1983-10-21 1989-11-30 Ates Componenti Elettron Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.
US4577387A (en) * 1983-10-31 1986-03-25 Kaufman Lance R Method of mounting a compact circuit package to a heat sink or the like
JPS59161055A (ja) * 1984-02-20 1984-09-11 Hitachi Ltd 樹脂封止型電子装置
US4777520A (en) * 1986-03-27 1988-10-11 Oki Electric Industry Co. Ltd. Heat-resistant plastic semiconductor device

Also Published As

Publication number Publication date
EP0254692A1 (de) 1988-01-27
JPS6331144A (ja) 1988-02-09
KR880001051A (ko) 1988-03-31
IT8683632A0 (it) 1986-07-17
IT1201836B (it) 1989-02-02
US4887149A (en) 1989-12-12
JPH0744245B2 (ja) 1995-05-15
EP0254692B1 (de) 1990-10-17
KR950013046B1 (ko) 1995-10-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee