KR870010612A - 멀치플런저형의 반도체소자의 수지봉지(seal)장치 - Google Patents

멀치플런저형의 반도체소자의 수지봉지(seal)장치 Download PDF

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Publication number
KR870010612A
KR870010612A KR870003443A KR870003443A KR870010612A KR 870010612 A KR870010612 A KR 870010612A KR 870003443 A KR870003443 A KR 870003443A KR 870003443 A KR870003443 A KR 870003443A KR 870010612 A KR870010612 A KR 870010612A
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KR
South Korea
Prior art keywords
mold base
plunger
cavity
plunger type
type semiconductor
Prior art date
Application number
KR870003443A
Other languages
English (en)
Other versions
KR930004628B1 (ko
Inventor
미찌오 나가다
Original Assignee
미찌오 나가다
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1986055057U external-priority patent/JPH0719146Y2/ja
Priority claimed from JP61113353A external-priority patent/JP2802272B2/ja
Application filed by 미찌오 나가다 filed Critical 미찌오 나가다
Publication of KR870010612A publication Critical patent/KR870010612A/ko
Application granted granted Critical
Publication of KR930004628B1 publication Critical patent/KR930004628B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • B29C2045/4052—Ejector boxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C2045/4094—Ejectors located on the fixed mould half

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

내용 없음

Description

멀치플런저형의 반도체소자의 수지봉지(seal)장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도면은 본 발명의 바람직한 실시예를 표시하는 것으로서,
제 1 도는 본 발명에 관한 반도체소자의 수지봉지장치의 기본적인 구성예를 표시하는 일부절결 종단정면도
제 2 도는 그 장치에 고정금형 및 가동금형의 일부를 분해하여서 표시하는 전체 사시도
제 3 도는 그 장치의 형을 조일때에 있어서의 일부 절결 종단 측면도

Claims (6)

  1. 고정된 쪽의 금형베이스와, 그 고정된 금형베이스에 대향시킨 가동하는 쪽의 금형베이스와, 상기한 고정금형베이스 및 가동하는 금형베이스에 대향배치된 고정된 쪽의 캐비티 블럭(7) 및 가동하는 쪽의 캐비티블럭과, 상기한 양쪽 캐비티블럭(8)중의 아래쪽의 캐비티블럭에 배치하여 설치한 복수개의 폿트(9)와 그 각 폿트(9)에 각각 끼워서 장착시키는 플런저(13a)를 배치한 플런저 홀더(13)와, 상기한 양쪽 캐비티블럭의 파아팅라인(P.L)면에 대향설치한 복수개의 캐비티와, 상기한 각 폿트에 위치에 대향하는 다른쪽의 캐비티블럭에 있어서의 파아팅라인 면에 형성한 컬(cull(24) 및 그 캐비티블럭(7)에 있어서의 소정의 캐비티와 상기한 컬을 연통시킨 게이트(26)와, 상기한 양쪽 캐비티블럭에 있어서의 양쪽 캐비티 및 상기한 컬(24) 내부의 수지성형체 돌출용의 이젝터 핀을 배치하여 설치한 양쪽 이젝터 플레이트와, 상기한 양쪽 캐비리부분에 대한 가열용 수단을 갖춘 멀티플런저 형의 반도체소자의 수지봉지 장치에 있어서, 상기한 플런저홀더를 아래쪽의 금형베이스에 배치함과 아울러, 이것을 그 금형베이스에 대하여 붙였다 떼었다 하는 것이 자유자재롭게 장착하여서 구성한 것을 특징으로하는 멀티플런저형의 반도체소자의 수지봉지장치.
  2. 제 1 항에 있어서.
    아래쪽의 금형베이스에 플런저 홀더의 붙였다 떼었다하는 공간 구성되어 있는 것을 특징으로 하는 멀티플런저형의 반도체소자의 수지봉지장치.
  3. 제 1 항에 있어서.
    플런저의 배치간격을 넓게하나 좁게하는 것의 조정을 자유자재롭게 구성한 것을 특징으로 하는 멀티플런저형의 반도체소자의 수지봉지장치.
  4. 제 1 항 또는 제 3 항에 있어서.
    플런저를 길이가 긴쪽 방향으로 분할 조립이 자유 자재롭게 구성한 것을 특징으로 하는 멀티플런저형의 반도체소자의 수지봉지장치.
  5. 제 1 항에 있어서.
    고정된쪽의 캐비티 블럭 및 가동하는 쪽의 캐비티 블럭을 고정금형베이스 및 가동하는 금형베이스에 대하여 각각 붙였다 떼었다 하는 것이 자유자재롭게 끼워 맞추어져 장착됨과 아울러, 상기한 양쪽 캐비티 블럭에 대하여 이젝터핀을 갖춘 이젝터 플레이트를 각각 붙였다 떼었다 하는 것이 자유자재롭게 장착하여서 구성한 것을 특징으로하는 멀티플런저형의 반도체소자의 수지봉지장치.
  6. 제 1 항에 있어서.
    고정된 쪽의 캐비티 블럭 및 가동하는 쪽의 캐비티 블럭에 각각 그것의 이젝터 플레이트를 지지시키기 위한 홀더를 각각 고정시켜서 구성한 것을 특징으로 하는 멀티 플런저형의 반도체소자의 수지봉지장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870003443A 1986-04-11 1987-04-10 멀티플런저형의 반도체소자의 수지봉지(seal)장치 KR930004628B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP1986055057U JPH0719146Y2 (ja) 1986-04-11 1986-04-11 半導体素子の樹脂封止用金型装置
JP86-55057 1986-04-11
JP55057 1986-04-11
JP86-113353 1986-05-17
JP113353 1986-05-17
JP61113353A JP2802272B2 (ja) 1986-05-17 1986-05-17 多品種少量生産に適した半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR870010612A true KR870010612A (ko) 1987-11-30
KR930004628B1 KR930004628B1 (ko) 1993-06-02

Family

ID=26395903

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870003443A KR930004628B1 (ko) 1986-04-11 1987-04-10 멀티플런저형의 반도체소자의 수지봉지(seal)장치

Country Status (6)

Country Link
US (1) US4793785A (ko)
KR (1) KR930004628B1 (ko)
GB (1) GB2189182B (ko)
HK (1) HK19791A (ko)
NL (1) NL194468C (ko)
SG (1) SG93990G (ko)

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Also Published As

Publication number Publication date
KR930004628B1 (ko) 1993-06-02
GB8708796D0 (en) 1987-05-20
GB2189182B (en) 1990-04-18
HK19791A (en) 1991-03-28
NL8700850A (nl) 1987-11-02
US4793785A (en) 1988-12-27
SG93990G (en) 1991-01-18
GB2189182A (en) 1987-10-21
NL194468C (nl) 2002-05-03
NL194468B (nl) 2002-01-02

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