GB2280144B - Apparatus for molding resin to seal an electronic part - Google Patents

Apparatus for molding resin to seal an electronic part

Info

Publication number
GB2280144B
GB2280144B GB9418909A GB9418909A GB2280144B GB 2280144 B GB2280144 B GB 2280144B GB 9418909 A GB9418909 A GB 9418909A GB 9418909 A GB9418909 A GB 9418909A GB 2280144 B GB2280144 B GB 2280144B
Authority
GB
United Kingdom
Prior art keywords
seal
molding resin
electronic part
molding
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9418909A
Other versions
GB2280144A (en
GB9418909D0 (en
Inventor
Michio Osada
Yoshihisa Kawamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3018352A external-priority patent/JP2639858B2/en
Priority claimed from JP15571991A external-priority patent/JPH04350949A/en
Priority claimed from JP3166501A external-priority patent/JPH0737051B2/en
Application filed by Towa Corp filed Critical Towa Corp
Priority claimed from GB9200609A external-priority patent/GB2252746B/en
Publication of GB9418909D0 publication Critical patent/GB9418909D0/en
Publication of GB2280144A publication Critical patent/GB2280144A/en
Application granted granted Critical
Publication of GB2280144B publication Critical patent/GB2280144B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/306—Exchangeable mould parts, e.g. cassette moulds, mould inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
    • B29C45/2675—Mounting of exchangeable mould inserts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
GB9418909A 1991-01-17 1992-01-10 Apparatus for molding resin to seal an electronic part Expired - Fee Related GB2280144B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP3018352A JP2639858B2 (en) 1991-01-17 1991-01-17 Resin sealing molding method for electronic parts
JP15571991A JPH04350949A (en) 1991-05-28 1991-05-28 Resin sealed molded device for electronic component
JP3166501A JPH0737051B2 (en) 1991-06-10 1991-06-10 Method and apparatus for resin encapsulation molding of electronic parts
GB9200609A GB2252746B (en) 1991-01-17 1992-01-10 A method of molding resin to seal an electronic part on a lead frame and apparatus therefor

Publications (3)

Publication Number Publication Date
GB9418909D0 GB9418909D0 (en) 1994-11-09
GB2280144A GB2280144A (en) 1995-01-25
GB2280144B true GB2280144B (en) 1995-07-12

Family

ID=27450801

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9418909A Expired - Fee Related GB2280144B (en) 1991-01-17 1992-01-10 Apparatus for molding resin to seal an electronic part

Country Status (1)

Country Link
GB (1) GB2280144B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3423766B2 (en) * 1994-03-11 2003-07-07 Ｔｏｗａ株式会社 Resin encapsulation molding method and mold device for electronic components
KR102445089B1 (en) 2018-10-09 2022-09-21 애리스 컴포지트 아이엔씨. Method for Composite Flow Molding

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2126155A (en) * 1982-08-25 1984-03-21 Bucher Guyer Ag Masch Evacuating injection moulding machine
US4793785A (en) * 1986-04-11 1988-12-27 Michio Osada Apparatus of multiplunger type for enclosing semiconductor elements with resin

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2126155A (en) * 1982-08-25 1984-03-21 Bucher Guyer Ag Masch Evacuating injection moulding machine
US4793785A (en) * 1986-04-11 1988-12-27 Michio Osada Apparatus of multiplunger type for enclosing semiconductor elements with resin

Also Published As

Publication number Publication date
GB2280144A (en) 1995-01-25
GB9418909D0 (en) 1994-11-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20100110