KR910003790A - 반도체 수지봉합용 금형장치 - Google Patents
반도체 수지봉합용 금형장치 Download PDFInfo
- Publication number
- KR910003790A KR910003790A KR1019900010954A KR900010954A KR910003790A KR 910003790 A KR910003790 A KR 910003790A KR 1019900010954 A KR1019900010954 A KR 1019900010954A KR 900010954 A KR900010954 A KR 900010954A KR 910003790 A KR910003790 A KR 910003790A
- Authority
- KR
- South Korea
- Prior art keywords
- resin sealing
- molding device
- semiconductor resin
- mold
- separation layer
- Prior art date
Links
- 239000011347 resin Substances 0.000 title claims description 5
- 229920005989 resin Polymers 0.000 title claims description 5
- 238000007789 sealing Methods 0.000 title claims description 4
- 239000004065 semiconductor Substances 0.000 title claims description 4
- 238000000465 moulding Methods 0.000 title claims 2
- 238000000926 separation method Methods 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 반도체 수지봉합용 금형장치의 한 실시예를 나타낸 측단면도,
제2도는 반도체 수지봉합용 금형장치의 분해 사시도.
Claims (1)
- 리드프레임(5)의 상하 방향에 배치된 윗금형(3) 및 아랫금형(4)으로 이루어진 금형체(2)와 분리층(9)을 순차적으로 적층하고, 상기 분리층(9)에 상기 금형체(2)의 수지공간과 연통하는 연통구멍(10)을 형성하는 것을 특징으로 하는 반도체 수지봉합용 금형장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1-186636 | 1989-07-19 | ||
| JP89-186636 | 1989-07-19 | ||
| JP1186636A JPH0350841A (ja) | 1989-07-19 | 1989-07-19 | 半導体樹脂封止用金型装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR910003790A true KR910003790A (ko) | 1991-02-28 |
| KR930006590B1 KR930006590B1 (ko) | 1993-07-21 |
Family
ID=16192054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019900010954A KR930006590B1 (ko) | 1989-07-19 | 1990-07-19 | 반도체 수지봉합용 금형장치 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0350841A (ko) |
| KR (1) | KR930006590B1 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998047174A1 (fr) * | 1997-04-16 | 1998-10-22 | Hitachi, Ltd. | Moule, dispositif et procede pour mouler un element stratifie |
| JP4855026B2 (ja) * | 2005-09-27 | 2012-01-18 | Ｔｏｗａ株式会社 | 電子部品の樹脂封止成形方法及び装置 |
| JP2007095804A (ja) * | 2005-09-27 | 2007-04-12 | Towa Corp | 電子部品の樹脂封止成形方法及び装置 |
| JP2008235489A (ja) * | 2007-03-19 | 2008-10-02 | Fujitsu Ltd | 樹脂封止方法、樹脂封止用金型、及び樹脂封止装置 |
-
1989
- 1989-07-19 JP JP1186636A patent/JPH0350841A/ja active Granted
-
1990
- 1990-07-19 KR KR1019900010954A patent/KR930006590B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0350841A (ja) | 1991-03-05 |
| JPH0572102B2 (ko) | 1993-10-08 |
| KR930006590B1 (ko) | 1993-07-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| G160 | Decision to publish patent application | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20030701 Year of fee payment: 11 |
|
| LAPS | Lapse due to unpaid annual fee |