KR920015971A - 전자부품용 리드프레임에 있어서의 몰드부의 다중 성형방법 - Google Patents

전자부품용 리드프레임에 있어서의 몰드부의 다중 성형방법 Download PDF

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Publication number
KR920015971A
KR920015971A KR1019920000141A KR920000141A KR920015971A KR 920015971 A KR920015971 A KR 920015971A KR 1019920000141 A KR1019920000141 A KR 1019920000141A KR 920000141 A KR920000141 A KR 920000141A KR 920015971 A KR920015971 A KR 920015971A
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KR
South Korea
Prior art keywords
electronic component
lead frames
lead frame
mold part
molding method
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KR1019920000141A
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English (en)
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KR100238845B1 (ko
Inventor
히로유키 니시무라
Original Assignee
사토오 켄이치로오
로움 카부시키가이샤
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Publication of KR920015971A publication Critical patent/KR920015971A/ko
Application granted granted Critical
Publication of KR100238845B1 publication Critical patent/KR100238845B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

내용 없음

Description

전자부품용 리드프레임에 있어서의 몰드부의 다중 성형방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예를 표시하는 아래금형의 평면도이다. 제2도는 제1도에서 Ⅱ - Ⅱ을 따르는 확대단면도이다, 제3도는 본 발명의 제2실시예를 표시하는 아래금형의 평면도이다.

Claims (1)

  1. 아래금형(11)과 위금형(12)의 사이에서, 2개의 리드프레임(A) (B)이 서로 평행하는 상태이면서 대칭이 되도록, 2개의 리드프레임(A) (B)중의 한쪽의 리드프레임을 돌려서 배치하며, 이들 양쪽 리드프레임(A) (B)의 사이에서, 길이방향을 따라서 일정간격으로 형성되어 있는 복수개의 원료 타블렛 콘테이너(13)의 내부에 공급되어 있는 용융상태의 합성수지를, 리너홈(18) (19)을 개재하여, 각각의 몰드부 성형을 캐비티(16) (17)에서의 동일한 모퉁이에 형성된 주입구(16a) (17a)로 공급하도록 한, 다음 성형방법에 있어서, 전기한 양쪽 리드프레임(A) (B)을 길이방향을 따라서 적당한 길이(L)만큼 서로 어긋나게 이동시킨 것을 특징으로 하는 전자부품용 리드프레임에 있어서의 몰드부의 다중 성형방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920000141A 1991-01-09 1992-01-08 전자부품용 리드프레임에 있어서의 몰드부의 다중 성형방법 KR100238845B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-12927 1991-01-09
JP3012927A JP2564707B2 (ja) 1991-01-09 1991-01-09 電子部品用リードフレームにおけるモールド部のマルチ式成形方法及び成形装置

Publications (2)

Publication Number Publication Date
KR920015971A true KR920015971A (ko) 1992-08-27
KR100238845B1 KR100238845B1 (ko) 2000-01-15

Family

ID=11818957

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920000141A KR100238845B1 (ko) 1991-01-09 1992-01-08 전자부품용 리드프레임에 있어서의 몰드부의 다중 성형방법

Country Status (3)

Country Link
US (1) US5302101A (ko)
JP (1) JP2564707B2 (ko)
KR (1) KR100238845B1 (ko)

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US5770128A (en) * 1992-04-13 1998-06-23 Apic Yamada Corporation Method of transfer molding and a transfer molding machine
JPH0677268A (ja) * 1992-08-24 1994-03-18 Nec Corp 半導体樹脂封止用成形金型
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US6465743B1 (en) * 1994-12-05 2002-10-15 Motorola, Inc. Multi-strand substrate for ball-grid array assemblies and method
USH1654H (en) * 1995-01-10 1997-06-03 Rounds; Nicholas A. Transfer molding process for encapsulating semiconductor devices
JP2701766B2 (ja) * 1995-01-27 1998-01-21 日本電気株式会社 半導体装置用リ−ドフレ−ム及びこれを用いるモ−ルド装置
US6531083B1 (en) * 1995-05-02 2003-03-11 Texas Instruments Incorporated Sproutless pre-packaged molding for component encapsulation
DE19524001A1 (de) * 1995-06-30 1997-03-06 Siemens Ag Verfahren zum Verpacken einer druckempfindlichen elektronischen Schaltung mit einer allseitig abdichtenden Schutzumhäusung
JP3483994B2 (ja) * 1995-08-31 2004-01-06 ローム株式会社 樹脂パッケージ型半導体装置の成形用金型装置、および半導体装置の樹脂パッケージング方法
US5766987A (en) * 1995-09-22 1998-06-16 Tessera, Inc. Microelectronic encapsulation methods and equipment
JPH09115936A (ja) * 1995-10-23 1997-05-02 Mitsubishi Electric Corp 半導体装置の樹脂封止用金型
US5876765A (en) * 1995-11-09 1999-03-02 Micron Technology, Inc. Injection molding equipment for encapsulating semiconductor die and the like
US5855924A (en) * 1995-12-27 1999-01-05 Siemens Microelectronics, Inc. Closed-mold for LED alphanumeric displays
US5888443A (en) * 1996-05-02 1999-03-30 Texas Instruments Incorporated Method for manufacturing prepackaged molding compound for component encapsulation
US5776798A (en) * 1996-09-04 1998-07-07 Motorola, Inc. Semiconductor package and method thereof
US6015280A (en) * 1997-04-28 2000-01-18 Advanced Micro Devices Apparatus for reducing warping of plastic packages
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
US7525180B2 (en) * 2005-10-24 2009-04-28 Panasonic Corporation Semiconductor mount substrate, semiconductor device and method of manufacturing semiconductor package
KR20110082422A (ko) * 2010-01-11 2011-07-19 삼성전자주식회사 몰딩 장치 및 몰딩 방법
CN115050720B (zh) * 2022-08-15 2023-01-06 华羿微电子股份有限公司 一种顶部散热功率器件引线框架

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Also Published As

Publication number Publication date
US5302101A (en) 1994-04-12
KR100238845B1 (ko) 2000-01-15
JPH04251943A (ja) 1992-09-08
JP2564707B2 (ja) 1996-12-18

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