KR20230020387A - 경화성 수지, 경화성 수지 조성물, 및, 경화물 - Google Patents

경화성 수지, 경화성 수지 조성물, 및, 경화물 Download PDF

Info

Publication number
KR20230020387A
KR20230020387A KR1020227038036A KR20227038036A KR20230020387A KR 20230020387 A KR20230020387 A KR 20230020387A KR 1020227038036 A KR1020227038036 A KR 1020227038036A KR 20227038036 A KR20227038036 A KR 20227038036A KR 20230020387 A KR20230020387 A KR 20230020387A
Authority
KR
South Korea
Prior art keywords
group
curable resin
general formula
resin composition
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227038036A
Other languages
English (en)
Korean (ko)
Inventor
리첸 양
류이치 마츠오카
히로요시 간나리
Original Assignee
디아이씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤
Publication of KR20230020387A publication Critical patent/KR20230020387A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F136/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
    • C08F136/22—Homopolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having three or more carbon-to-carbon double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/20—Esters of polyhydric alcohols or polyhydric phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F120/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F120/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F120/10—Esters
    • C08F120/20—Esters of polyhydric alcohols or polyhydric phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/104—Esters of polyhydric alcohols or polyhydric phenols of tetraalcohols, e.g. pentaerythritol tetra(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C08G8/30—Chemically modified polycondensates by unsaturated compounds, e.g. terpenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D147/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Coating compositions based on derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2347/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymerization Catalysts (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020227038036A 2020-06-03 2021-05-20 경화성 수지, 경화성 수지 조성물, 및, 경화물 Pending KR20230020387A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020097139 2020-06-03
JPJP-P-2020-097139 2020-06-03
JPJP-P-2020-214257 2020-12-23
JP2020214257 2020-12-23
PCT/JP2021/019096 WO2021246182A1 (ja) 2020-06-03 2021-05-20 硬化性樹脂、硬化性樹脂組成物、及び、硬化物

Publications (1)

Publication Number Publication Date
KR20230020387A true KR20230020387A (ko) 2023-02-10

Family

ID=78830467

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227038036A Pending KR20230020387A (ko) 2020-06-03 2021-05-20 경화성 수지, 경화성 수지 조성물, 및, 경화물

Country Status (6)

Country Link
US (1) US12606655B2 (https=)
JP (1) JP7060181B1 (https=)
KR (1) KR20230020387A (https=)
CN (1) CN115916894B (https=)
TW (1) TWI881128B (https=)
WO (1) WO2021246182A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7060181B1 (ja) 2020-06-03 2022-04-26 Dic株式会社 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
US20230391905A1 (en) * 2020-12-22 2023-12-07 Dic Corporation Curable resin, curable resin composition, and cured product
US20240317916A1 (en) * 2021-07-29 2024-09-26 Dic Corporation Curable resin composition and cured product
KR20240076816A (ko) * 2021-11-18 2024-05-30 디아이씨 가부시끼가이샤 경화성 수지, 경화성 수지 조성물 및 경화물
JP7275247B1 (ja) 2021-12-28 2023-05-17 Ａｐｂ株式会社 二次電池モジュール
JP2024048460A (ja) * 2022-09-28 2024-04-09 四国化成工業株式会社 テトラキスフェノールエタン誘導体、その合成方法およびその利用
KR20250093335A (ko) * 2022-10-19 2025-06-24 스미또모 가가꾸 가부시키가이샤 비닐 화합물, 비닐 조성물, 비닐 수지 경화물, 프리프레그, 수지 구비 필름, 수지 구비 금속박, 금속 피복 적층판 및 프린트 배선판
JP2024077814A (ja) * 2022-11-29 2024-06-10 四国化成工業株式会社 テトラキスフェノール誘導体、その合成方法およびその利用
TWI845363B (zh) * 2023-06-29 2024-06-11 南亞塑膠工業股份有限公司 改質萘酚樹脂及其製備方法及包含其的樹脂組合物

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6368537A (ja) 1986-09-03 1988-03-28 ザ・ダウ・ケミカル・カンパニー 新規な多数のビニルベンジルエーテル基を含有するモノマーおよびオリゴマー，その製造方法およびそれからつくられたキュア生成物
JPS6465110A (en) 1987-09-04 1989-03-10 Showa Highpolymer Curable resin composition
JPH01503238A (ja) 1986-12-29 1989-11-02 アライド・コーポレーション スチレン末端基付きテトラキスフェノールの熱硬化ポリマー
JPH0543623A (ja) 1991-08-12 1993-02-23 Sumitomo Chem Co Ltd ポリ（アルケニルアリールメチル）エーテル化合物
JPH0931006A (ja) 1995-07-24 1997-02-04 Showa Highpolymer Co Ltd ポリビニルベンジルエーテル化合物およびその製造方法
JP2005281618A (ja) 2004-03-30 2005-10-13 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物
JP2005314556A (ja) 2004-04-28 2005-11-10 Nippon Kayaku Co Ltd ポリ（ビニルベンジル）エーテル化合物およびその製造方法
JP2015030776A (ja) 2013-08-01 2015-02-16 新日鉄住金化学株式会社 硬化性樹脂組成物、及び硬化物
JP2015189925A (ja) 2014-03-28 2015-11-02 新日鉄住金化学株式会社 ビニルベンジルエーテル樹脂、その製造方法、これを含有する硬化性樹脂組成物、硬化物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6368537U (https=) 1986-10-23 1988-05-09
JPH0543623Y2 (https=) 1987-04-04 1993-11-04
JP4661196B2 (ja) * 2004-07-27 2011-03-30 日立化成工業株式会社 低誘電率絶縁性樹脂組成物
JP6101418B2 (ja) * 2008-03-12 2017-03-22 ブルー キューブ アイピー エルエルシー 脂肪族および芳香族部分を含むエチレン性不飽和モノマー
CN102947261A (zh) 2010-04-29 2013-02-27 陶氏环球技术有限责任公司 聚环戊二烯多酚的聚(烯丙基醚)
EP2563755A1 (en) 2010-04-29 2013-03-06 Dow Global Technologies LLC Vinylbenzyl ethers of polycyclopentadiene polyphenol
EP2878591B1 (en) * 2012-07-25 2020-09-16 DIC Corporation Radically curable compound, method for producing radically curable compound, radically curable composition, cured product thereof, and composition for resist material
JP5741669B2 (ja) * 2013-11-20 2015-07-01 Dic株式会社 アクリル重合体、硬化性組成物、その硬化物、及びレジスト材料用組成物
JP6435830B2 (ja) * 2014-12-11 2018-12-12 Dic株式会社 （メタ）アクリレート化合物、ラジカル硬化性樹脂、ラジカル硬化性組成物、その硬化物、レジスト材料、及びラジカル硬化性樹脂の製造方法
CN109305896B (zh) * 2017-07-26 2022-07-19 郑州大学 一种低极性树脂及其制备方法和应用
JP2019172917A (ja) * 2018-03-29 2019-10-10 旭化成株式会社 ポリフェニレンエーテル、ポリフェニレンエーテル組成物、硬化剤組成物、及びポリフェニレンエーテルの製造方法
JP6922822B2 (ja) * 2018-04-16 2021-08-18 味の素株式会社 樹脂組成物
JP7060181B1 (ja) 2020-06-03 2022-04-26 Dic株式会社 硬化性樹脂、硬化性樹脂組成物、及び、硬化物

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6368537A (ja) 1986-09-03 1988-03-28 ザ・ダウ・ケミカル・カンパニー 新規な多数のビニルベンジルエーテル基を含有するモノマーおよびオリゴマー，その製造方法およびそれからつくられたキュア生成物
JPH01503238A (ja) 1986-12-29 1989-11-02 アライド・コーポレーション スチレン末端基付きテトラキスフェノールの熱硬化ポリマー
JPS6465110A (en) 1987-09-04 1989-03-10 Showa Highpolymer Curable resin composition
JPH0543623A (ja) 1991-08-12 1993-02-23 Sumitomo Chem Co Ltd ポリ（アルケニルアリールメチル）エーテル化合物
JPH0931006A (ja) 1995-07-24 1997-02-04 Showa Highpolymer Co Ltd ポリビニルベンジルエーテル化合物およびその製造方法
JP2005281618A (ja) 2004-03-30 2005-10-13 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物
JP2005314556A (ja) 2004-04-28 2005-11-10 Nippon Kayaku Co Ltd ポリ（ビニルベンジル）エーテル化合物およびその製造方法
JP2015030776A (ja) 2013-08-01 2015-02-16 新日鉄住金化学株式会社 硬化性樹脂組成物、及び硬化物
JP2015189925A (ja) 2014-03-28 2015-11-02 新日鉄住金化学株式会社 ビニルベンジルエーテル樹脂、その製造方法、これを含有する硬化性樹脂組成物、硬化物

Also Published As

Publication number Publication date
WO2021246182A1 (ja) 2021-12-09
CN115916894B (zh) 2024-07-26
JP7060181B1 (ja) 2022-04-26
US12606655B2 (en) 2026-04-21
TW202214731A (zh) 2022-04-16
JPWO2021246182A1 (https=) 2021-12-09
US20230242691A1 (en) 2023-08-03
CN115916894A (zh) 2023-04-04
TWI881128B (zh) 2025-04-21

Similar Documents

Publication Publication Date Title
JP7060181B1 (ja) 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
JP7229422B2 (ja) 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
KR101710854B1 (ko) N-치환 말레이미드기를 갖는 폴리페닐렌에테르 유도체, 및 그것을 사용한 열경화성 수지 조성물, 수지 바니시, 프리프레그, 금속 피복 적층판 및 다층 프린트 배선판
KR102669009B1 (ko) 경화성 수지 조성물
US9957389B2 (en) Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminate
US20100233486A1 (en) Flame-retardant resin composition, and prepreg, resin sheet and molded article using the same
JP6216179B2 (ja) 硬化性樹脂組成物、及び硬化物
JP7082454B2 (ja) プリプレグ、積層体及びプリント配線基板
JP6307236B2 (ja) 硬化性樹脂組成物、硬化物、電気・電子部品及び回路基板材料
JP2021130743A (ja) 硬化性樹脂組成物、及び、硬化物
KR102675519B1 (ko) 경화성 수지 조성물
JP7415272B2 (ja) インダンビスフェノール化合物、硬化性樹脂組成物、及び、硬化物
WO2023008079A1 (ja) 硬化性樹脂組成物、および、硬化物
JP6277594B2 (ja) 硬化性組成物、硬化物、及びプリント配線基板
JP2002338806A (ja) 変性シアネートエステル系樹脂組成物、それを用いる樹脂フィルム、多層プリント配線板およびそれらの製造方法
JP7318831B2 (ja) 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
JP7765759B2 (ja) 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
JP5432791B2 (ja) エポキシ樹脂組成物、プリプレグ、金属箔付き樹脂シート、樹脂シート、積層板、多層板
JP2013189580A (ja) 樹脂組成物、これを用いたプリプレグ及び積層板
CN119219813A (zh) 固化性树脂组合物、固化物、预浸料、电路基板、积层薄膜、半导体密封材料和半导体装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000