TWI881128B - 硬化性樹脂、硬化性樹脂組成物、硬化物、清漆、預浸體及電路基板 - Google Patents
硬化性樹脂、硬化性樹脂組成物、硬化物、清漆、預浸體及電路基板 Download PDFInfo
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- TWI881128B TWI881128B TW110119101A TW110119101A TWI881128B TW I881128 B TWI881128 B TW I881128B TW 110119101 A TW110119101 A TW 110119101A TW 110119101 A TW110119101 A TW 110119101A TW I881128 B TWI881128 B TW I881128B
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- curable resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F136/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
- C08F136/22—Homopolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having three or more carbon-to-carbon double bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/20—Esters of polyhydric alcohols or polyhydric phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F120/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F120/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F120/10—Esters
- C08F120/20—Esters of polyhydric alcohols or polyhydric phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/104—Esters of polyhydric alcohols or polyhydric phenols of tetraalcohols, e.g. pentaerythritol tetra(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
- C08G8/30—Chemically modified polycondensates by unsaturated compounds, e.g. terpenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D147/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Coating compositions based on derivatives of such polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2333/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2333/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2347/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Derivatives of such polymers
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Polymerization Catalysts (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-097139 | 2020-06-03 | ||
| JP2020097139 | 2020-06-03 | ||
| JP2020-214257 | 2020-12-23 | ||
| JP2020214257 | 2020-12-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202214731A TW202214731A (zh) | 2022-04-16 |
| TWI881128B true TWI881128B (zh) | 2025-04-21 |
Family
ID=78830467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110119101A TWI881128B (zh) | 2020-06-03 | 2021-05-26 | 硬化性樹脂、硬化性樹脂組成物、硬化物、清漆、預浸體及電路基板 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12606655B2 (https=) |
| JP (1) | JP7060181B1 (https=) |
| KR (1) | KR20230020387A (https=) |
| CN (1) | CN115916894B (https=) |
| TW (1) | TWI881128B (https=) |
| WO (1) | WO2021246182A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7060181B1 (ja) | 2020-06-03 | 2022-04-26 | Dic株式会社 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
| US20230391905A1 (en) * | 2020-12-22 | 2023-12-07 | Dic Corporation | Curable resin, curable resin composition, and cured product |
| US20240317916A1 (en) * | 2021-07-29 | 2024-09-26 | Dic Corporation | Curable resin composition and cured product |
| KR20240076816A (ko) * | 2021-11-18 | 2024-05-30 | 디아이씨 가부시끼가이샤 | 경화성 수지, 경화성 수지 조성물 및 경화물 |
| JP7275247B1 (ja) | 2021-12-28 | 2023-05-17 | Apb株式会社 | 二次電池モジュール |
| JP2024048460A (ja) * | 2022-09-28 | 2024-04-09 | 四国化成工業株式会社 | テトラキスフェノールエタン誘導体、その合成方法およびその利用 |
| KR20250093335A (ko) * | 2022-10-19 | 2025-06-24 | 스미또모 가가꾸 가부시키가이샤 | 비닐 화합물, 비닐 조성물, 비닐 수지 경화물, 프리프레그, 수지 구비 필름, 수지 구비 금속박, 금속 피복 적층판 및 프린트 배선판 |
| JP2024077814A (ja) * | 2022-11-29 | 2024-06-10 | 四国化成工業株式会社 | テトラキスフェノール誘導体、その合成方法およびその利用 |
| TWI845363B (zh) * | 2023-06-29 | 2024-06-11 | 南亞塑膠工業股份有限公司 | 改質萘酚樹脂及其製備方法及包含其的樹脂組合物 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026950A (zh) * | 2008-03-12 | 2011-04-20 | 陶氏环球技术公司 | 包含脂族和芳族基团的烯键式不饱和单体 |
| CN102947261A (zh) * | 2010-04-29 | 2013-02-27 | 陶氏环球技术有限责任公司 | 聚环戊二烯多酚的聚(烯丙基醚) |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4707558A (en) | 1986-09-03 | 1987-11-17 | The Dow Chemical Company | Monomers and oligomers containing a plurality of vinylbenzyl ether groups, method for their preparation and cured products therefrom |
| JPS6368537U (https=) | 1986-10-23 | 1988-05-09 | ||
| DE3773398D1 (de) | 1986-12-29 | 1991-10-31 | Allied Signal Inc | Thermohaertbare polymere von mit styrol endenden tetrakis-phenolen. |
| JPH0543623Y2 (https=) | 1987-04-04 | 1993-11-04 | ||
| JPH0710902B2 (ja) | 1987-09-04 | 1995-02-08 | 昭和高分子株式会社 | 硬化性樹脂組成物 |
| JPH0543623A (ja) | 1991-08-12 | 1993-02-23 | Sumitomo Chem Co Ltd | ポリ(アルケニルアリールメチル)エーテル化合物 |
| JP3414556B2 (ja) | 1995-07-24 | 2003-06-09 | 昭和高分子株式会社 | ポリビニルベンジルエーテル化合物およびその製造方法 |
| JP4599869B2 (ja) | 2004-03-30 | 2010-12-15 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物 |
| JP4591946B2 (ja) | 2004-04-28 | 2010-12-01 | 日本化薬株式会社 | ポリ(ビニルベンジル)エーテル化合物およびその製造方法 |
| JP4661196B2 (ja) * | 2004-07-27 | 2011-03-30 | 日立化成工業株式会社 | 低誘電率絶縁性樹脂組成物 |
| EP2563755A1 (en) | 2010-04-29 | 2013-03-06 | Dow Global Technologies LLC | Vinylbenzyl ethers of polycyclopentadiene polyphenol |
| EP2878591B1 (en) * | 2012-07-25 | 2020-09-16 | DIC Corporation | Radically curable compound, method for producing radically curable compound, radically curable composition, cured product thereof, and composition for resist material |
| JP6216179B2 (ja) * | 2013-08-01 | 2017-10-18 | 新日鉄住金化学株式会社 | 硬化性樹脂組成物、及び硬化物 |
| JP5741669B2 (ja) * | 2013-11-20 | 2015-07-01 | Dic株式会社 | アクリル重合体、硬化性組成物、その硬化物、及びレジスト材料用組成物 |
| JP6457187B2 (ja) | 2014-03-28 | 2019-01-23 | 日鉄ケミカル&マテリアル株式会社 | ビニルベンジルエーテル樹脂、その製造方法、これを含有する硬化性樹脂組成物、硬化物 |
| JP6435830B2 (ja) * | 2014-12-11 | 2018-12-12 | Dic株式会社 | (メタ)アクリレート化合物、ラジカル硬化性樹脂、ラジカル硬化性組成物、その硬化物、レジスト材料、及びラジカル硬化性樹脂の製造方法 |
| CN109305896B (zh) * | 2017-07-26 | 2022-07-19 | 郑州大学 | 一种低极性树脂及其制备方法和应用 |
| JP2019172917A (ja) * | 2018-03-29 | 2019-10-10 | 旭化成株式会社 | ポリフェニレンエーテル、ポリフェニレンエーテル組成物、硬化剤組成物、及びポリフェニレンエーテルの製造方法 |
| JP6922822B2 (ja) * | 2018-04-16 | 2021-08-18 | 味の素株式会社 | 樹脂組成物 |
| JP7060181B1 (ja) | 2020-06-03 | 2022-04-26 | Dic株式会社 | 硬化性樹脂、硬化性樹脂組成物、及び、硬化物 |
-
2021
- 2021-05-20 JP JP2022505300A patent/JP7060181B1/ja active Active
- 2021-05-20 US US18/007,742 patent/US12606655B2/en active Active
- 2021-05-20 KR KR1020227038036A patent/KR20230020387A/ko active Pending
- 2021-05-20 WO PCT/JP2021/019096 patent/WO2021246182A1/ja not_active Ceased
- 2021-05-20 CN CN202180038963.9A patent/CN115916894B/zh active Active
- 2021-05-26 TW TW110119101A patent/TWI881128B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026950A (zh) * | 2008-03-12 | 2011-04-20 | 陶氏环球技术公司 | 包含脂族和芳族基团的烯键式不饱和单体 |
| CN102947261A (zh) * | 2010-04-29 | 2013-02-27 | 陶氏环球技术有限责任公司 | 聚环戊二烯多酚的聚(烯丙基醚) |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021246182A1 (ja) | 2021-12-09 |
| CN115916894B (zh) | 2024-07-26 |
| JP7060181B1 (ja) | 2022-04-26 |
| US12606655B2 (en) | 2026-04-21 |
| TW202214731A (zh) | 2022-04-16 |
| JPWO2021246182A1 (https=) | 2021-12-09 |
| US20230242691A1 (en) | 2023-08-03 |
| CN115916894A (zh) | 2023-04-04 |
| KR20230020387A (ko) | 2023-02-10 |
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