TWI881128B - 硬化性樹脂、硬化性樹脂組成物、硬化物、清漆、預浸體及電路基板 - Google Patents

硬化性樹脂、硬化性樹脂組成物、硬化物、清漆、預浸體及電路基板 Download PDF

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TWI881128B
TWI881128B TW110119101A TW110119101A TWI881128B TW I881128 B TWI881128 B TW I881128B TW 110119101 A TW110119101 A TW 110119101A TW 110119101 A TW110119101 A TW 110119101A TW I881128 B TWI881128 B TW I881128B
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group
curable resin
general formula
resin composition
resins
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TW110119101A
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TW202214731A (zh
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楊立宸
松岡龍一
神成広義
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日商Dic股份有限公司
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F136/00Homopolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
    • C08F136/22Homopolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having three or more carbon-to-carbon double bonds
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    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • C08F20/20Esters of polyhydric alcohols or polyhydric phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
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    • C08F12/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/34Monomers containing two or more unsaturated aliphatic radicals
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    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F120/00Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F120/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F120/10Esters
    • C08F120/20Esters of polyhydric alcohols or polyhydric phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10Esters
    • C08F222/1006Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/104Esters of polyhydric alcohols or polyhydric phenols of tetraalcohols, e.g. pentaerythritol tetra(meth)acrylate
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    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28Chemically modified polycondensates
    • C08G8/30Chemically modified polycondensates by unsaturated compounds, e.g. terpenes
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    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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    • C09D147/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Coating compositions based on derivatives of such polymers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • C08J2333/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2333/04Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • C08J2333/06Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
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  • Chemical & Material Sciences (AREA)
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  • Wood Science & Technology (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Polymerization Catalysts (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW110119101A 2020-06-03 2021-05-26 硬化性樹脂、硬化性樹脂組成物、硬化物、清漆、預浸體及電路基板 TWI881128B (zh)

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Application Number Priority Date Filing Date Title
JP2020-097139 2020-06-03
JP2020097139 2020-06-03
JP2020-214257 2020-12-23
JP2020214257 2020-12-23

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TW202214731A TW202214731A (zh) 2022-04-16
TWI881128B true TWI881128B (zh) 2025-04-21

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US (1) US12606655B2 (https=)
JP (1) JP7060181B1 (https=)
KR (1) KR20230020387A (https=)
CN (1) CN115916894B (https=)
TW (1) TWI881128B (https=)
WO (1) WO2021246182A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7060181B1 (ja) 2020-06-03 2022-04-26 Dic株式会社 硬化性樹脂、硬化性樹脂組成物、及び、硬化物
US20230391905A1 (en) * 2020-12-22 2023-12-07 Dic Corporation Curable resin, curable resin composition, and cured product
US20240317916A1 (en) * 2021-07-29 2024-09-26 Dic Corporation Curable resin composition and cured product
KR20240076816A (ko) * 2021-11-18 2024-05-30 디아이씨 가부시끼가이샤 경화성 수지, 경화성 수지 조성물 및 경화물
JP7275247B1 (ja) 2021-12-28 2023-05-17 Apb株式会社 二次電池モジュール
JP2024048460A (ja) * 2022-09-28 2024-04-09 四国化成工業株式会社 テトラキスフェノールエタン誘導体、その合成方法およびその利用
KR20250093335A (ko) * 2022-10-19 2025-06-24 스미또모 가가꾸 가부시키가이샤 비닐 화합물, 비닐 조성물, 비닐 수지 경화물, 프리프레그, 수지 구비 필름, 수지 구비 금속박, 금속 피복 적층판 및 프린트 배선판
JP2024077814A (ja) * 2022-11-29 2024-06-10 四国化成工業株式会社 テトラキスフェノール誘導体、その合成方法およびその利用
TWI845363B (zh) * 2023-06-29 2024-06-11 南亞塑膠工業股份有限公司 改質萘酚樹脂及其製備方法及包含其的樹脂組合物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102026950A (zh) * 2008-03-12 2011-04-20 陶氏环球技术公司 包含脂族和芳族基团的烯键式不饱和单体
CN102947261A (zh) * 2010-04-29 2013-02-27 陶氏环球技术有限责任公司 聚环戊二烯多酚的聚(烯丙基醚)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707558A (en) 1986-09-03 1987-11-17 The Dow Chemical Company Monomers and oligomers containing a plurality of vinylbenzyl ether groups, method for their preparation and cured products therefrom
JPS6368537U (https=) 1986-10-23 1988-05-09
DE3773398D1 (de) 1986-12-29 1991-10-31 Allied Signal Inc Thermohaertbare polymere von mit styrol endenden tetrakis-phenolen.
JPH0543623Y2 (https=) 1987-04-04 1993-11-04
JPH0710902B2 (ja) 1987-09-04 1995-02-08 昭和高分子株式会社 硬化性樹脂組成物
JPH0543623A (ja) 1991-08-12 1993-02-23 Sumitomo Chem Co Ltd ポリ(アルケニルアリールメチル)エーテル化合物
JP3414556B2 (ja) 1995-07-24 2003-06-09 昭和高分子株式会社 ポリビニルベンジルエーテル化合物およびその製造方法
JP4599869B2 (ja) 2004-03-30 2010-12-15 住友ベークライト株式会社 熱硬化性樹脂組成物
JP4591946B2 (ja) 2004-04-28 2010-12-01 日本化薬株式会社 ポリ(ビニルベンジル)エーテル化合物およびその製造方法
JP4661196B2 (ja) * 2004-07-27 2011-03-30 日立化成工業株式会社 低誘電率絶縁性樹脂組成物
EP2563755A1 (en) 2010-04-29 2013-03-06 Dow Global Technologies LLC Vinylbenzyl ethers of polycyclopentadiene polyphenol
EP2878591B1 (en) * 2012-07-25 2020-09-16 DIC Corporation Radically curable compound, method for producing radically curable compound, radically curable composition, cured product thereof, and composition for resist material
JP6216179B2 (ja) * 2013-08-01 2017-10-18 新日鉄住金化学株式会社 硬化性樹脂組成物、及び硬化物
JP5741669B2 (ja) * 2013-11-20 2015-07-01 Dic株式会社 アクリル重合体、硬化性組成物、その硬化物、及びレジスト材料用組成物
JP6457187B2 (ja) 2014-03-28 2019-01-23 日鉄ケミカル&マテリアル株式会社 ビニルベンジルエーテル樹脂、その製造方法、これを含有する硬化性樹脂組成物、硬化物
JP6435830B2 (ja) * 2014-12-11 2018-12-12 Dic株式会社 (メタ)アクリレート化合物、ラジカル硬化性樹脂、ラジカル硬化性組成物、その硬化物、レジスト材料、及びラジカル硬化性樹脂の製造方法
CN109305896B (zh) * 2017-07-26 2022-07-19 郑州大学 一种低极性树脂及其制备方法和应用
JP2019172917A (ja) * 2018-03-29 2019-10-10 旭化成株式会社 ポリフェニレンエーテル、ポリフェニレンエーテル組成物、硬化剤組成物、及びポリフェニレンエーテルの製造方法
JP6922822B2 (ja) * 2018-04-16 2021-08-18 味の素株式会社 樹脂組成物
JP7060181B1 (ja) 2020-06-03 2022-04-26 Dic株式会社 硬化性樹脂、硬化性樹脂組成物、及び、硬化物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102026950A (zh) * 2008-03-12 2011-04-20 陶氏环球技术公司 包含脂族和芳族基团的烯键式不饱和单体
CN102947261A (zh) * 2010-04-29 2013-02-27 陶氏环球技术有限责任公司 聚环戊二烯多酚的聚(烯丙基醚)

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WO2021246182A1 (ja) 2021-12-09
CN115916894B (zh) 2024-07-26
JP7060181B1 (ja) 2022-04-26
US12606655B2 (en) 2026-04-21
TW202214731A (zh) 2022-04-16
JPWO2021246182A1 (https=) 2021-12-09
US20230242691A1 (en) 2023-08-03
CN115916894A (zh) 2023-04-04
KR20230020387A (ko) 2023-02-10

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