JPS6465110A - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
JPS6465110A
JPS6465110A JP22033987A JP22033987A JPS6465110A JP S6465110 A JPS6465110 A JP S6465110A JP 22033987 A JP22033987 A JP 22033987A JP 22033987 A JP22033987 A JP 22033987A JP S6465110 A JPS6465110 A JP S6465110A
Authority
JP
Japan
Prior art keywords
compd
residue
arom
molecule
polyhydric phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22033987A
Other languages
Japanese (ja)
Other versions
JPH0710902B2 (en
Inventor
Toshiaki Haniyuda
Joji Shibata
Kazuo Otani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Highpolymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Highpolymer Co Ltd filed Critical Showa Highpolymer Co Ltd
Priority to JP22033987A priority Critical patent/JPH0710902B2/en
Publication of JPS6465110A publication Critical patent/JPS6465110A/en
Publication of JPH0710902B2 publication Critical patent/JPH0710902B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

PURPOSE:To obtain the title compsn. which has a low curing temp. and a small curing time and is excellent in heat-resistance, heat stability and mechanical properties, by blending a specified maleimide compd. and vinylbenzyl ether compd. CONSTITUTION:A chloromethylstyrene monomer is reacted with a polyhydric phenol compd. (e.g., bisphenol A) to remove hydrogen chloride in the presence of an inorg. alkali in a dimethyl sulfoxide solvent to give a compd. having at least two vinylbenzyl ether units bonded to an arom. residue in the molecule of the formula as shown [where X is an arom. residue (a residue of polyhydric phenol compd. from which hydroxy groups having been removed)], (b). A compd. having at least two maleimide groups in the molecule (a) (e.g., N,N'- phenylenebismaleimide) and component (b) are blended so that the ratio of their unsatd. group equivalents is 100/30-1/100.
JP22033987A 1987-09-04 1987-09-04 Curable resin composition Expired - Lifetime JPH0710902B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22033987A JPH0710902B2 (en) 1987-09-04 1987-09-04 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22033987A JPH0710902B2 (en) 1987-09-04 1987-09-04 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS6465110A true JPS6465110A (en) 1989-03-10
JPH0710902B2 JPH0710902B2 (en) 1995-02-08

Family

ID=16749598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22033987A Expired - Lifetime JPH0710902B2 (en) 1987-09-04 1987-09-04 Curable resin composition

Country Status (1)

Country Link
JP (1) JPH0710902B2 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02173017A (en) * 1988-12-26 1990-07-04 Tokuyama Soda Co Ltd Organic glass
JPH0320312A (en) * 1989-06-16 1991-01-29 Showa Highpolymer Co Ltd Curable resin composition
JPH0392343A (en) * 1989-09-04 1991-04-17 Showa Highpolymer Co Ltd Laminated sheet for electric application using vinyl benzyl ether compound
JPH03190912A (en) * 1989-12-19 1991-08-20 Showa Highpolymer Co Ltd Heat-resistant molding material
JP2010189469A (en) * 2009-02-16 2010-09-02 Hitachi Chem Co Ltd Adhesive composition, adhesive sheet, and semiconductor device
WO2018016640A1 (en) * 2016-07-21 2018-01-25 三菱瓦斯化学株式会社 Compound, resin, composition, resist pattern formation method, and circuit pattern formation method
KR20220164699A (en) 2020-04-06 2022-12-13 디아이씨 가부시끼가이샤 Curable resin, curable resin composition, and cured product
KR20220165275A (en) 2020-05-28 2022-12-14 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 Multifunctional vinyl resin and its manufacturing method
KR20230020387A (en) 2020-06-03 2023-02-10 디아이씨 가부시끼가이샤 Curable resin, curable resin composition, and cured product
KR20230022397A (en) 2020-06-09 2023-02-15 디아이씨 가부시끼가이샤 Curable resin, curable resin composition, and cured product
KR20230051434A (en) 2020-08-19 2023-04-18 디아이씨 가부시끼가이샤 Curable resin, curable resin composition, and cured product
KR20230122014A (en) 2020-12-22 2023-08-22 디아이씨 가부시끼가이샤 Curable resin, curable resin composition, and cured product
WO2023224021A1 (en) * 2022-05-19 2023-11-23 株式会社レゾナック Resin composition, prepreg, laminate, resin film, printed wiring board and semiconductor package
KR20230170971A (en) 2021-07-29 2023-12-19 디아이씨 가부시끼가이샤 Curable resin composition, and cured product

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02173017A (en) * 1988-12-26 1990-07-04 Tokuyama Soda Co Ltd Organic glass
JPH0320312A (en) * 1989-06-16 1991-01-29 Showa Highpolymer Co Ltd Curable resin composition
JPH0392343A (en) * 1989-09-04 1991-04-17 Showa Highpolymer Co Ltd Laminated sheet for electric application using vinyl benzyl ether compound
JPH03190912A (en) * 1989-12-19 1991-08-20 Showa Highpolymer Co Ltd Heat-resistant molding material
JP2010189469A (en) * 2009-02-16 2010-09-02 Hitachi Chem Co Ltd Adhesive composition, adhesive sheet, and semiconductor device
JPWO2018016640A1 (en) * 2016-07-21 2019-05-09 三菱瓦斯化学株式会社 Compound, resin, composition, resist pattern forming method and circuit pattern forming method
WO2018016640A1 (en) * 2016-07-21 2018-01-25 三菱瓦斯化学株式会社 Compound, resin, composition, resist pattern formation method, and circuit pattern formation method
KR20220164699A (en) 2020-04-06 2022-12-13 디아이씨 가부시끼가이샤 Curable resin, curable resin composition, and cured product
KR20220165275A (en) 2020-05-28 2022-12-14 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 Multifunctional vinyl resin and its manufacturing method
KR20230020387A (en) 2020-06-03 2023-02-10 디아이씨 가부시끼가이샤 Curable resin, curable resin composition, and cured product
KR20230022397A (en) 2020-06-09 2023-02-15 디아이씨 가부시끼가이샤 Curable resin, curable resin composition, and cured product
KR20230051434A (en) 2020-08-19 2023-04-18 디아이씨 가부시끼가이샤 Curable resin, curable resin composition, and cured product
KR20230122014A (en) 2020-12-22 2023-08-22 디아이씨 가부시끼가이샤 Curable resin, curable resin composition, and cured product
KR20230170971A (en) 2021-07-29 2023-12-19 디아이씨 가부시끼가이샤 Curable resin composition, and cured product
WO2023224021A1 (en) * 2022-05-19 2023-11-23 株式会社レゾナック Resin composition, prepreg, laminate, resin film, printed wiring board and semiconductor package

Also Published As

Publication number Publication date
JPH0710902B2 (en) 1995-02-08

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