JPS6465110A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS6465110A JPS6465110A JP22033987A JP22033987A JPS6465110A JP S6465110 A JPS6465110 A JP S6465110A JP 22033987 A JP22033987 A JP 22033987A JP 22033987 A JP22033987 A JP 22033987A JP S6465110 A JPS6465110 A JP S6465110A
- Authority
- JP
- Japan
- Prior art keywords
- compd
- residue
- arom
- molecule
- polyhydric phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
PURPOSE:To obtain the title compsn. which has a low curing temp. and a small curing time and is excellent in heat-resistance, heat stability and mechanical properties, by blending a specified maleimide compd. and vinylbenzyl ether compd. CONSTITUTION:A chloromethylstyrene monomer is reacted with a polyhydric phenol compd. (e.g., bisphenol A) to remove hydrogen chloride in the presence of an inorg. alkali in a dimethyl sulfoxide solvent to give a compd. having at least two vinylbenzyl ether units bonded to an arom. residue in the molecule of the formula as shown [where X is an arom. residue (a residue of polyhydric phenol compd. from which hydroxy groups having been removed)], (b). A compd. having at least two maleimide groups in the molecule (a) (e.g., N,N'- phenylenebismaleimide) and component (b) are blended so that the ratio of their unsatd. group equivalents is 100/30-1/100.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22033987A JPH0710902B2 (en) | 1987-09-04 | 1987-09-04 | Curable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22033987A JPH0710902B2 (en) | 1987-09-04 | 1987-09-04 | Curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6465110A true JPS6465110A (en) | 1989-03-10 |
JPH0710902B2 JPH0710902B2 (en) | 1995-02-08 |
Family
ID=16749598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22033987A Expired - Lifetime JPH0710902B2 (en) | 1987-09-04 | 1987-09-04 | Curable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0710902B2 (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02173017A (en) * | 1988-12-26 | 1990-07-04 | Tokuyama Soda Co Ltd | Organic glass |
JPH0320312A (en) * | 1989-06-16 | 1991-01-29 | Showa Highpolymer Co Ltd | Curable resin composition |
JPH0392343A (en) * | 1989-09-04 | 1991-04-17 | Showa Highpolymer Co Ltd | Laminated sheet for electric application using vinyl benzyl ether compound |
JPH03190912A (en) * | 1989-12-19 | 1991-08-20 | Showa Highpolymer Co Ltd | Heat-resistant molding material |
JP2010189469A (en) * | 2009-02-16 | 2010-09-02 | Hitachi Chem Co Ltd | Adhesive composition, adhesive sheet, and semiconductor device |
WO2018016640A1 (en) * | 2016-07-21 | 2018-01-25 | 三菱瓦斯化学株式会社 | Compound, resin, composition, resist pattern formation method, and circuit pattern formation method |
KR20220164699A (en) | 2020-04-06 | 2022-12-13 | 디아이씨 가부시끼가이샤 | Curable resin, curable resin composition, and cured product |
KR20220165275A (en) | 2020-05-28 | 2022-12-14 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | Multifunctional vinyl resin and its manufacturing method |
KR20230020387A (en) | 2020-06-03 | 2023-02-10 | 디아이씨 가부시끼가이샤 | Curable resin, curable resin composition, and cured product |
KR20230022397A (en) | 2020-06-09 | 2023-02-15 | 디아이씨 가부시끼가이샤 | Curable resin, curable resin composition, and cured product |
KR20230051434A (en) | 2020-08-19 | 2023-04-18 | 디아이씨 가부시끼가이샤 | Curable resin, curable resin composition, and cured product |
KR20230122014A (en) | 2020-12-22 | 2023-08-22 | 디아이씨 가부시끼가이샤 | Curable resin, curable resin composition, and cured product |
WO2023224021A1 (en) * | 2022-05-19 | 2023-11-23 | 株式会社レゾナック | Resin composition, prepreg, laminate, resin film, printed wiring board and semiconductor package |
KR20230170971A (en) | 2021-07-29 | 2023-12-19 | 디아이씨 가부시끼가이샤 | Curable resin composition, and cured product |
-
1987
- 1987-09-04 JP JP22033987A patent/JPH0710902B2/en not_active Expired - Lifetime
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02173017A (en) * | 1988-12-26 | 1990-07-04 | Tokuyama Soda Co Ltd | Organic glass |
JPH0320312A (en) * | 1989-06-16 | 1991-01-29 | Showa Highpolymer Co Ltd | Curable resin composition |
JPH0392343A (en) * | 1989-09-04 | 1991-04-17 | Showa Highpolymer Co Ltd | Laminated sheet for electric application using vinyl benzyl ether compound |
JPH03190912A (en) * | 1989-12-19 | 1991-08-20 | Showa Highpolymer Co Ltd | Heat-resistant molding material |
JP2010189469A (en) * | 2009-02-16 | 2010-09-02 | Hitachi Chem Co Ltd | Adhesive composition, adhesive sheet, and semiconductor device |
JPWO2018016640A1 (en) * | 2016-07-21 | 2019-05-09 | 三菱瓦斯化学株式会社 | Compound, resin, composition, resist pattern forming method and circuit pattern forming method |
WO2018016640A1 (en) * | 2016-07-21 | 2018-01-25 | 三菱瓦斯化学株式会社 | Compound, resin, composition, resist pattern formation method, and circuit pattern formation method |
KR20220164699A (en) | 2020-04-06 | 2022-12-13 | 디아이씨 가부시끼가이샤 | Curable resin, curable resin composition, and cured product |
KR20220165275A (en) | 2020-05-28 | 2022-12-14 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | Multifunctional vinyl resin and its manufacturing method |
KR20230020387A (en) | 2020-06-03 | 2023-02-10 | 디아이씨 가부시끼가이샤 | Curable resin, curable resin composition, and cured product |
KR20230022397A (en) | 2020-06-09 | 2023-02-15 | 디아이씨 가부시끼가이샤 | Curable resin, curable resin composition, and cured product |
KR20230051434A (en) | 2020-08-19 | 2023-04-18 | 디아이씨 가부시끼가이샤 | Curable resin, curable resin composition, and cured product |
KR20230122014A (en) | 2020-12-22 | 2023-08-22 | 디아이씨 가부시끼가이샤 | Curable resin, curable resin composition, and cured product |
KR20230170971A (en) | 2021-07-29 | 2023-12-19 | 디아이씨 가부시끼가이샤 | Curable resin composition, and cured product |
WO2023224021A1 (en) * | 2022-05-19 | 2023-11-23 | 株式会社レゾナック | Resin composition, prepreg, laminate, resin film, printed wiring board and semiconductor package |
Also Published As
Publication number | Publication date |
---|---|
JPH0710902B2 (en) | 1995-02-08 |
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Legal Events
Date | Code | Title | Description |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 13 Free format text: PAYMENT UNTIL: 20080208 |