KR20200140388A - 패터닝을 위한 고품질 c 막들의 펄스형 플라즈마(dc/rf) 증착 - Google Patents
패터닝을 위한 고품질 c 막들의 펄스형 플라즈마(dc/rf) 증착 Download PDFInfo
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- KR20200140388A KR20200140388A KR1020207034601A KR20207034601A KR20200140388A KR 20200140388 A KR20200140388 A KR 20200140388A KR 1020207034601 A KR1020207034601 A KR 1020207034601A KR 20207034601 A KR20207034601 A KR 20207034601A KR 20200140388 A KR20200140388 A KR 20200140388A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/503—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using DC or AC discharges
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- C23C16/5096—Flat-bed apparatus
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/515—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using pulsed discharges
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
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- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
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- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
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- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
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- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
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- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/405—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their composition, e.g. multilayer masks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020247020744A KR20240097984A (ko) | 2018-05-03 | 2018-10-16 | 패터닝을 위한 고품질 c 막들의 펄스형 플라즈마(dc/rf) 증착 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862666205P | 2018-05-03 | 2018-05-03 | |
| US62/666,205 | 2018-05-03 | ||
| PCT/US2018/056004 WO2019212592A1 (en) | 2018-05-03 | 2018-10-16 | Pulsed plasma (dc/rf) deposition of high quality c films for patterning |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247020744A Division KR20240097984A (ko) | 2018-05-03 | 2018-10-16 | 패터닝을 위한 고품질 c 막들의 펄스형 플라즈마(dc/rf) 증착 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20200140388A true KR20200140388A (ko) | 2020-12-15 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207034601A Ceased KR20200140388A (ko) | 2018-05-03 | 2018-10-16 | 패터닝을 위한 고품질 c 막들의 펄스형 플라즈마(dc/rf) 증착 |
| KR1020247020744A Pending KR20240097984A (ko) | 2018-05-03 | 2018-10-16 | 패터닝을 위한 고품질 c 막들의 펄스형 플라즈마(dc/rf) 증착 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247020744A Pending KR20240097984A (ko) | 2018-05-03 | 2018-10-16 | 패터닝을 위한 고품질 c 막들의 펄스형 플라즈마(dc/rf) 증착 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11603591B2 (https=) |
| JP (2) | JP7591929B2 (https=) |
| KR (2) | KR20200140388A (https=) |
| CN (2) | CN120485731A (https=) |
| SG (1) | SG11202009289PA (https=) |
| WO (1) | WO2019212592A1 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022132642A1 (en) * | 2020-12-18 | 2022-06-23 | Lam Research Corporation | High selectivity, low stress, and low hydrogen carbon hardmasks in low-pressure conditions with wide gap electrode spacing |
| US11837441B2 (en) | 2019-05-29 | 2023-12-05 | Lam Research Corporation | Depositing a carbon hardmask by high power pulsed low frequency RF |
| US12435412B2 (en) | 2019-08-30 | 2025-10-07 | Lam Research Corporation | High density, modulus, and hardness amorphous carbon films at low pressure |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11469097B2 (en) | 2018-04-09 | 2022-10-11 | Applied Materials, Inc. | Carbon hard masks for patterning applications and methods related thereto |
| CN110983300B (zh) * | 2019-12-04 | 2023-06-20 | 江苏菲沃泰纳米科技股份有限公司 | 镀膜设备及其应用 |
| US11773484B2 (en) | 2020-06-26 | 2023-10-03 | Tokyo Electron Limited | Hard mask deposition using direct current superimposed radio frequency plasma |
| EP3945669A1 (en) | 2020-07-27 | 2022-02-02 | TRUMPF Huettinger Sp. Z o. o. | Hv switch unit, pulsing assembly and method of avoiding voltage imbalances in an hv switch |
| EP3945541A1 (en) | 2020-07-29 | 2022-02-02 | TRUMPF Huettinger Sp. Z o. o. | Pulsing assembly, power supply arrangement and method using the assembly |
| EP3952083A1 (en) | 2020-08-06 | 2022-02-09 | TRUMPF Huettinger Sp. Z o. o. | Hv switch unit |
| US11404263B2 (en) * | 2020-08-07 | 2022-08-02 | Applied Materials, Inc. | Deposition of low-stress carbon-containing layers |
| US12142459B2 (en) * | 2020-09-08 | 2024-11-12 | Applied Materials, Inc. | Single chamber flowable film formation and treatments |
| US11699571B2 (en) | 2020-09-08 | 2023-07-11 | Applied Materials, Inc. | Semiconductor processing chambers for deposition and etch |
| JP2022187397A (ja) * | 2021-06-07 | 2022-12-19 | 東京エレクトロン株式会社 | 成膜方法および成膜装置 |
| WO2023196846A1 (en) * | 2022-04-07 | 2023-10-12 | Lam Research Corporation | Hydrogen reduction in amorphous carbon films |
| KR102939653B1 (ko) | 2022-12-09 | 2026-03-13 | 성균관대학교산학협력단 | 고 종횡 비 반도체 구조물의 갭을 채우기 위한 다중 펄스를 이용한 원자층 증착 장치 및 이를 이용한 원자층 증착방법 |
Family Cites Families (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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-
2018
- 2018-10-16 KR KR1020207034601A patent/KR20200140388A/ko not_active Ceased
- 2018-10-16 JP JP2020561008A patent/JP7591929B2/ja active Active
- 2018-10-16 US US16/982,955 patent/US11603591B2/en active Active
- 2018-10-16 SG SG11202009289PA patent/SG11202009289PA/en unknown
- 2018-10-16 CN CN202510649232.8A patent/CN120485731A/zh active Pending
- 2018-10-16 WO PCT/US2018/056004 patent/WO2019212592A1/en not_active Ceased
- 2018-10-16 CN CN201880092808.3A patent/CN112041481B/zh active Active
- 2018-10-16 KR KR1020247020744A patent/KR20240097984A/ko active Pending
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11837441B2 (en) | 2019-05-29 | 2023-12-05 | Lam Research Corporation | Depositing a carbon hardmask by high power pulsed low frequency RF |
| US12435412B2 (en) | 2019-08-30 | 2025-10-07 | Lam Research Corporation | High density, modulus, and hardness amorphous carbon films at low pressure |
| WO2022132642A1 (en) * | 2020-12-18 | 2022-06-23 | Lam Research Corporation | High selectivity, low stress, and low hydrogen carbon hardmasks in low-pressure conditions with wide gap electrode spacing |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240097984A (ko) | 2024-06-27 |
| JP7591929B2 (ja) | 2024-11-29 |
| US12486577B2 (en) | 2025-12-02 |
| JP2021523558A (ja) | 2021-09-02 |
| US20210040618A1 (en) | 2021-02-11 |
| CN112041481A (zh) | 2020-12-04 |
| WO2019212592A1 (en) | 2019-11-07 |
| SG11202009289PA (en) | 2020-11-27 |
| JP2023156333A (ja) | 2023-10-24 |
| US11603591B2 (en) | 2023-03-14 |
| US20230220551A1 (en) | 2023-07-13 |
| CN120485731A (zh) | 2025-08-15 |
| CN112041481B (zh) | 2025-06-06 |
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