KR20170081195A - 수지 조성물, 반도체 장치의 제조 방법 및 반도체 장치 - Google Patents

수지 조성물, 반도체 장치의 제조 방법 및 반도체 장치 Download PDF

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KR20170081195A
KR20170081195A KR1020177014316A KR20177014316A KR20170081195A KR 20170081195 A KR20170081195 A KR 20170081195A KR 1020177014316 A KR1020177014316 A KR 1020177014316A KR 20177014316 A KR20177014316 A KR 20177014316A KR 20170081195 A KR20170081195 A KR 20170081195A
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resin sheet
semiconductor chip
thermosetting resin
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filler
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KR1020177014316A
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English (en)
Korean (ko)
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준 이시이
고지 시가
지에 이이노
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닛토덴코 가부시키가이샤
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Publication of KR20170081195A publication Critical patent/KR20170081195A/ko

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    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
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    • H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
    • C08K3/0033—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
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  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020177014316A 2014-11-07 2015-10-15 수지 조성물, 반도체 장치의 제조 방법 및 반도체 장치 KR20170081195A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014226745A JP5976073B2 (ja) 2014-11-07 2014-11-07 半導体装置の製造方法
JPJP-P-2014-226745 2014-11-07
PCT/JP2015/079172 WO2016072236A1 (ja) 2014-11-07 2015-10-15 樹脂組成物、半導体装置の製造方法及び半導体装置

Publications (1)

Publication Number Publication Date
KR20170081195A true KR20170081195A (ko) 2017-07-11

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KR1020177014316A KR20170081195A (ko) 2014-11-07 2015-10-15 수지 조성물, 반도체 장치의 제조 방법 및 반도체 장치

Country Status (6)

Country Link
JP (1) JP5976073B2 (ja)
KR (1) KR20170081195A (ja)
CN (1) CN107109069A (ja)
SG (1) SG11201703288UA (ja)
TW (1) TW201621000A (ja)
WO (1) WO2016072236A1 (ja)

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JP2018104649A (ja) * 2016-12-28 2018-07-05 日東電工株式会社 樹脂シート
KR102073295B1 (ko) * 2018-06-22 2020-02-04 삼성전자주식회사 반도체 패키지
JP7286676B2 (ja) 2018-12-18 2023-06-05 ローム株式会社 半導体装置
DE112021002956T5 (de) 2020-05-26 2023-03-09 Rohm Co., Ltd. Halbleiterbauteil und verfahren zum herstellen eines halbleiterbauteils

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JP5735029B2 (ja) * 2013-03-28 2015-06-17 日東電工株式会社 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法
JP5793160B2 (ja) * 2013-03-28 2015-10-14 日東電工株式会社 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法
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US11361878B2 (en) 2017-07-14 2022-06-14 Lg Chem, Ltd. Method for manufacturing insulating film and semiconductor package

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