KR20160134533A - 광전 변환 소자, 촬상 장치 - Google Patents
광전 변환 소자, 촬상 장치 Download PDFInfo
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- KR20160134533A KR20160134533A KR1020160057983A KR20160057983A KR20160134533A KR 20160134533 A KR20160134533 A KR 20160134533A KR 1020160057983 A KR1020160057983 A KR 1020160057983A KR 20160057983 A KR20160057983 A KR 20160057983A KR 20160134533 A KR20160134533 A KR 20160134533A
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- H01L31/0272—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
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- H10F39/8027—Geometry of the photosensitive area
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/40—Crystalline structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D87/00—Integrated devices comprising both bulk components and either SOI or SOS components on the same substrate
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- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
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| KR20180092323A (ko) * | 2016-01-07 | 2018-08-17 | 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 | 셀레늄 포토멀티플라이어 및 이의 제조방법 |
| JP2019036693A (ja) * | 2017-08-21 | 2019-03-07 | 日本放送協会 | 光電変換素子およびその製造方法 |
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| US9754980B2 (en) | 2015-06-30 | 2017-09-05 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion element and imaging device |
| TWI738569B (zh) | 2015-07-07 | 2021-09-01 | 日商半導體能源研究所股份有限公司 | 成像裝置及其運作方法 |
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| JPWO2018146579A1 (ja) * | 2017-02-10 | 2020-01-23 | 株式会社半導体エネルギー研究所 | 光電変換素子、撮像装置、電子機器及び光電変換素子の作製方法 |
| WO2018172880A1 (en) * | 2017-03-24 | 2018-09-27 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion element and manufacturing method thereof |
| CN111448663B (zh) | 2017-12-05 | 2024-04-16 | 索尼公司 | 摄像元件、层叠型摄像元件和固态摄像装置 |
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| CN111971796B (zh) | 2018-04-20 | 2024-07-19 | 索尼公司 | 摄像器件、堆叠式摄像器件和固态摄像装置 |
| JP7624608B2 (ja) * | 2019-04-25 | 2025-01-31 | パナソニックIpマネジメント株式会社 | 撮像装置 |
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| US11728356B2 (en) | 2023-08-15 |
| JP2016219800A (ja) | 2016-12-22 |
| JP2022084781A (ja) | 2022-06-07 |
| US20160336363A1 (en) | 2016-11-17 |
| JP7045131B2 (ja) | 2022-03-31 |
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