JP7045131B2 - 光電変換素子、撮像装置 - Google Patents
光電変換素子、撮像装置 Download PDFInfo
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- JP7045131B2 JP7045131B2 JP2016096943A JP2016096943A JP7045131B2 JP 7045131 B2 JP7045131 B2 JP 7045131B2 JP 2016096943 A JP2016096943 A JP 2016096943A JP 2016096943 A JP2016096943 A JP 2016096943A JP 7045131 B2 JP7045131 B2 JP 7045131B2
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- oxide
- layer
- photoelectric conversion
- conversion element
- image pickup
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/121—Active materials comprising only selenium or only tellurium
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- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
- H10F39/8027—Geometry of the photosensitive area
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/222—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN heterojunction
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- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/016—Manufacture or treatment of image sensors covered by group H10F39/12 of thin-film-based image sensors
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
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- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
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- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
- H10F39/192—Colour image sensors
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- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022043580A JP2022084781A (ja) | 2015-05-14 | 2022-03-18 | 光電変換素子 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015099011 | 2015-05-14 | ||
| JP2015099011 | 2015-05-14 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022043580A Division JP2022084781A (ja) | 2015-05-14 | 2022-03-18 | 光電変換素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016219800A JP2016219800A (ja) | 2016-12-22 |
| JP2016219800A5 JP2016219800A5 (enExample) | 2019-06-13 |
| JP7045131B2 true JP7045131B2 (ja) | 2022-03-31 |
Family
ID=57277849
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016096943A Active JP7045131B2 (ja) | 2015-05-14 | 2016-05-13 | 光電変換素子、撮像装置 |
| JP2022043580A Withdrawn JP2022084781A (ja) | 2015-05-14 | 2022-03-18 | 光電変換素子 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022043580A Withdrawn JP2022084781A (ja) | 2015-05-14 | 2022-03-18 | 光電変換素子 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11728356B2 (enExample) |
| JP (2) | JP7045131B2 (enExample) |
| KR (1) | KR20160134533A (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9754980B2 (en) | 2015-06-30 | 2017-09-05 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion element and imaging device |
| TWI738569B (zh) | 2015-07-07 | 2021-09-01 | 日商半導體能源研究所股份有限公司 | 成像裝置及其運作方法 |
| KR102698685B1 (ko) | 2015-09-10 | 2024-08-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치, 모듈, 전자 기기, 및 촬상 장치의 동작 방법 |
| EP3400616B1 (en) * | 2016-01-07 | 2020-12-30 | The Research Foundation for The State University of New York | Selenium photomultiplier |
| JPWO2018146579A1 (ja) * | 2017-02-10 | 2020-01-23 | 株式会社半導体エネルギー研究所 | 光電変換素子、撮像装置、電子機器及び光電変換素子の作製方法 |
| WO2018172880A1 (en) * | 2017-03-24 | 2018-09-27 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion element and manufacturing method thereof |
| JP6937189B2 (ja) * | 2017-08-21 | 2021-09-22 | 日本放送協会 | 光電変換素子の製造方法 |
| CN111448663B (zh) | 2017-12-05 | 2024-04-16 | 索尼公司 | 摄像元件、层叠型摄像元件和固态摄像装置 |
| JP2019145594A (ja) * | 2018-02-16 | 2019-08-29 | シャープ株式会社 | アクティブマトリクス基板及びそれを備えた撮像パネルと製造方法 |
| JP2019145596A (ja) * | 2018-02-16 | 2019-08-29 | シャープ株式会社 | アクティブマトリクス基板及びそれを備えたx線撮像パネルと製造方法 |
| CN111971796B (zh) | 2018-04-20 | 2024-07-19 | 索尼公司 | 摄像器件、堆叠式摄像器件和固态摄像装置 |
| JP7624608B2 (ja) * | 2019-04-25 | 2025-01-31 | パナソニックIpマネジメント株式会社 | 撮像装置 |
| JP7446786B2 (ja) * | 2019-11-18 | 2024-03-11 | 株式会社ジャパンディスプレイ | 検出装置及び表示装置 |
| TWI798767B (zh) * | 2021-07-25 | 2023-04-11 | 袁知賢 | 光電轉換元件及其製作方法 |
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| JP2008251999A (ja) | 2007-03-30 | 2008-10-16 | Fujifilm Corp | 放射線検出器 |
| JP2012169517A (ja) | 2011-02-16 | 2012-09-06 | Seiko Epson Corp | 光電変換装置、電子機器 |
| JP2014017440A (ja) | 2012-07-11 | 2014-01-30 | Nippon Hoso Kyokai <Nhk> | 光電変換素子、及び、イメージセンサ |
| JP2014120616A (ja) | 2012-12-17 | 2014-06-30 | Nippon Hoso Kyokai <Nhk> | 有機光電変換素子、それを備えた積層型有機撮像素子及び積層型有機太陽電池、並びに有機光電変換素子の製造方法 |
| CN103945136A (zh) | 2014-04-04 | 2014-07-23 | 沈洪泉 | 高用户使用体验度的虹膜图像光电成像系统 |
| JP2015079944A (ja) | 2013-09-10 | 2015-04-23 | 株式会社半導体エネルギー研究所 | 半導体装置 |
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| JP2016219800A (ja) | 2016-12-22 |
| KR20160134533A (ko) | 2016-11-23 |
| JP2022084781A (ja) | 2022-06-07 |
| US20160336363A1 (en) | 2016-11-17 |
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