KR20110030564A - 스크린 인쇄에 유용한 짧은 서멀 프로파일 오븐 - Google Patents

스크린 인쇄에 유용한 짧은 서멀 프로파일 오븐 Download PDF

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Publication number
KR20110030564A
KR20110030564A KR1020117000750A KR20117000750A KR20110030564A KR 20110030564 A KR20110030564 A KR 20110030564A KR 1020117000750 A KR1020117000750 A KR 1020117000750A KR 20117000750 A KR20117000750 A KR 20117000750A KR 20110030564 A KR20110030564 A KR 20110030564A
Authority
KR
South Korea
Prior art keywords
substrate
gas
heat exchange
conveyor
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020117000750A
Other languages
English (en)
Korean (ko)
Inventor
안드레아 바씨니
Original Assignee
어플라이드 머티어리얼스 이탈리아 에스.알.엘.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ITUD20080135 external-priority patent/ITUD20080135A1/it
Priority claimed from ITUD20080154 external-priority patent/ITUD20080154A1/it
Application filed by 어플라이드 머티어리얼스 이탈리아 에스.알.엘. filed Critical 어플라이드 머티어리얼스 이탈리아 에스.알.엘.
Publication of KR20110030564A publication Critical patent/KR20110030564A/ko
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Drying Of Solid Materials (AREA)
  • Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
  • Screen Printers (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020117000750A 2008-06-11 2009-05-29 스크린 인쇄에 유용한 짧은 서멀 프로파일 오븐 Abandoned KR20110030564A (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
ITUD2008A000135 2008-06-11
ITUD20080135 ITUD20080135A1 (it) 2008-06-11 2008-06-11 Forno a basso profilo termico per stampa serigrafica
ITUD2008A000154 2008-06-27
ITUD20080154 ITUD20080154A1 (it) 2008-06-27 2008-06-27 Forno a basso profilo termico per stampa serigrafica
US12/240,955 US20090308860A1 (en) 2008-06-11 2008-09-29 Short thermal profile oven useful for screen printing
US12/240,955 2008-09-29
US12/273,442 US20090311439A1 (en) 2008-06-11 2008-11-18 Short Thermal Profile Oven Useful For Screen Printing
US12/273,442 2008-11-18

Publications (1)

Publication Number Publication Date
KR20110030564A true KR20110030564A (ko) 2011-03-23

Family

ID=41151966

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117000750A Abandoned KR20110030564A (ko) 2008-06-11 2009-05-29 스크린 인쇄에 유용한 짧은 서멀 프로파일 오븐

Country Status (7)

Country Link
US (2) US20090308860A1 (enExample)
EP (1) EP2301064B1 (enExample)
JP (1) JP2011526734A (enExample)
KR (1) KR20110030564A (enExample)
CN (2) CN103227127A (enExample)
TW (1) TWI479590B (enExample)
WO (1) WO2009150070A1 (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150074190A (ko) * 2012-11-30 2015-07-01 카티바, 인크. 가스 인클로저 조립체 및 시스템
US10442226B2 (en) 2008-06-13 2019-10-15 Kateeva, Inc. Gas enclosure assembly and system
US11034176B2 (en) 2008-06-13 2021-06-15 Kateeva, Inc. Gas enclosure assembly and system
US11107712B2 (en) 2013-12-26 2021-08-31 Kateeva, Inc. Techniques for thermal treatment of electronic devices
US11338319B2 (en) 2014-04-30 2022-05-24 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
US11489119B2 (en) 2014-01-21 2022-11-01 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
US11633968B2 (en) 2008-06-13 2023-04-25 Kateeva, Inc. Low-particle gas enclosure systems and methods
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods

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CN104441956B (zh) * 2014-12-10 2017-05-24 苏州互强工业设备有限公司 一种丝印烘干线
CN104527218B (zh) * 2014-12-24 2016-01-13 庄统壹 一种网版印刷机及利用该网版印刷机印刷的工艺方法
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WO2019081041A1 (en) * 2017-10-27 2019-05-02 Applied Materials Italia S.R.L. CONFIGURED APPARATUS FOR DETERMINING A STATE OF A DEPOSITION ARRANGEMENT, A SYSTEM FOR MANUFACTURING A SOLAR CELL, AND A METHOD FOR DETERMINING A STATUS OF A DEPOSIT ARRANGEMENT
CN110534611A (zh) * 2018-05-25 2019-12-03 米亚索乐装备集成（福建）有限公司 一种用于片状电池的加热设备
DE102018210558A1 (de) * 2018-06-28 2019-02-28 Heidelberger Druckmaschinen Ag Druckvorrichtung mit einem Planarmotorsystem
KR102088778B1 (ko) * 2018-08-07 2020-03-13 김영택 수용성 잉크를 이용한 인쇄기의 열 건조장치
PT3725523T (pt) 2019-04-18 2024-05-02 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais
HUE068309T2 (hu) 2019-04-18 2024-12-28 Exentis Knowledge Gmbh Eljárás háromdimenziós szitanyomó munkadarabok elõállítására
ES2978787T3 (es) * 2019-04-18 2024-09-20 Exentis Knowledge Gmbh Dispositivo y procedimiento para la fabricación de piezas de trabajo de serigrafía tridimensionales
ES2973939T3 (es) * 2019-04-18 2024-06-25 Exentis Knowledge Gmbh Dispositivo y procedimiento para la fabricación de piezas de trabajo de serigrafía tridimensionales
CN111186211B (zh) * 2020-02-04 2021-06-04 北部湾大学 一种用于陶瓷花纸印刷机的油墨干燥装置
CN114801452A (zh) * 2021-01-18 2022-07-29 博泽精密科技(苏州)有限公司 一种印刷机械自动上料机构
CN215305176U (zh) * 2021-06-15 2021-12-28 江门市新会恒隆家居创新用品有限公司 多士炉

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10442226B2 (en) 2008-06-13 2019-10-15 Kateeva, Inc. Gas enclosure assembly and system
US11034176B2 (en) 2008-06-13 2021-06-15 Kateeva, Inc. Gas enclosure assembly and system
US11633968B2 (en) 2008-06-13 2023-04-25 Kateeva, Inc. Low-particle gas enclosure systems and methods
US12018857B2 (en) 2008-06-13 2024-06-25 Kateeva, Inc. Gas enclosure assembly and system
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US12344014B2 (en) 2008-06-13 2025-07-01 Kateeva, Inc. Gas enclosure assembly and system
KR20150074190A (ko) * 2012-11-30 2015-07-01 카티바, 인크. 가스 인클로저 조립체 및 시스템
US11107712B2 (en) 2013-12-26 2021-08-31 Kateeva, Inc. Techniques for thermal treatment of electronic devices
US12040203B2 (en) 2013-12-26 2024-07-16 Kateeva, Inc. Techniques for thermal treatment of electronic devices
US11489119B2 (en) 2014-01-21 2022-11-01 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
US11338319B2 (en) 2014-04-30 2022-05-24 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating

Also Published As

Publication number Publication date
JP2011526734A (ja) 2011-10-13
CN103227127A (zh) 2013-07-31
WO2009150070A1 (en) 2009-12-17
TWI479590B (zh) 2015-04-01
US20090311439A1 (en) 2009-12-17
EP2301064A1 (en) 2011-03-30
CN102057462B (zh) 2013-05-15
TW201009990A (en) 2010-03-01
EP2301064B1 (en) 2018-08-29
CN102057462A (zh) 2011-05-11
US20090308860A1 (en) 2009-12-17

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