IT1394811B1 - Apparato e procedimento per la manipolazione di substrati danneggiati in sistemi di lavorazione substrati - Google Patents

Apparato e procedimento per la manipolazione di substrati danneggiati in sistemi di lavorazione substrati

Info

Publication number
IT1394811B1
IT1394811B1 ITUD2009A000131A ITUD20090131A IT1394811B1 IT 1394811 B1 IT1394811 B1 IT 1394811B1 IT UD2009A000131 A ITUD2009A000131 A IT UD2009A000131A IT UD20090131 A ITUD20090131 A IT UD20090131A IT 1394811 B1 IT1394811 B1 IT 1394811B1
Authority
IT
Italy
Prior art keywords
manipulation
procedure
substrate processing
processing systems
damaged substrates
Prior art date
Application number
ITUD2009A000131A
Other languages
English (en)
Inventor
Andrea Baccini
Marco Galiazzo
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to ITUD2009A000131A priority Critical patent/IT1394811B1/it
Priority to CN2009801603662A priority patent/CN102473671A/zh
Priority to US13/382,992 priority patent/US20120136476A1/en
Priority to PCT/EP2009/063031 priority patent/WO2011003484A1/en
Priority to EP09736889A priority patent/EP2452358A1/en
Priority to TW099122385A priority patent/TW201104910A/zh
Publication of ITUD20090131A1 publication Critical patent/ITUD20090131A1/it
Application granted granted Critical
Publication of IT1394811B1 publication Critical patent/IT1394811B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
ITUD2009A000131A 2009-07-08 2009-07-08 Apparato e procedimento per la manipolazione di substrati danneggiati in sistemi di lavorazione substrati IT1394811B1 (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ITUD2009A000131A IT1394811B1 (it) 2009-07-08 2009-07-08 Apparato e procedimento per la manipolazione di substrati danneggiati in sistemi di lavorazione substrati
CN2009801603662A CN102473671A (zh) 2009-07-08 2009-10-07 用于衬底处理系统的损坏衬底处置设备及方法
US13/382,992 US20120136476A1 (en) 2009-07-08 2009-10-07 Damaged substrate handling apparatus and method for substrate processing systems
PCT/EP2009/063031 WO2011003484A1 (en) 2009-07-08 2009-10-07 Damaged substrate handling apparatus and method for substrate processing systems
EP09736889A EP2452358A1 (en) 2009-07-08 2009-10-07 Damaged substrate handling apparatus and method for substrate processing systems
TW099122385A TW201104910A (en) 2009-07-08 2010-07-07 Damaged substrate handling apparatus and method for substrate processing systems

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2009A000131A IT1394811B1 (it) 2009-07-08 2009-07-08 Apparato e procedimento per la manipolazione di substrati danneggiati in sistemi di lavorazione substrati

Publications (2)

Publication Number Publication Date
ITUD20090131A1 ITUD20090131A1 (it) 2011-01-09
IT1394811B1 true IT1394811B1 (it) 2012-07-13

Family

ID=41268477

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2009A000131A IT1394811B1 (it) 2009-07-08 2009-07-08 Apparato e procedimento per la manipolazione di substrati danneggiati in sistemi di lavorazione substrati

Country Status (6)

Country Link
US (1) US20120136476A1 (it)
EP (1) EP2452358A1 (it)
CN (1) CN102473671A (it)
IT (1) IT1394811B1 (it)
TW (1) TW201104910A (it)
WO (1) WO2011003484A1 (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090308860A1 (en) * 2008-06-11 2009-12-17 Applied Materials, Inc. Short thermal profile oven useful for screen printing
WO2011095175A1 (en) * 2010-02-08 2011-08-11 3Shape A/S Object feeder system
NL2006113C2 (en) * 2011-02-01 2012-08-02 Otb Solar Bv Water inspection system.
WO2012115483A2 (ko) 2011-02-24 2012-08-30 주식회사 엘지화학 롤 프린팅 장치 및 이를 이용한 롤 프린팅 방법
DE102011005157A1 (de) * 2011-03-04 2012-09-27 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate, insbesondere Solarzellen
WO2013086432A2 (en) * 2011-12-07 2013-06-13 Intevac, Inc. High throughput load lock for solar wafers
DE102012100929A1 (de) * 2012-02-06 2013-08-08 Roth & Rau Ag Substratbearbeitungsanlage
CN106206376A (zh) * 2016-07-15 2016-12-07 无锡宏纳科技有限公司 集成电路制造用多平台工作台
WO2019205351A1 (zh) * 2018-04-24 2019-10-31 君泰创新（北京）科技有限公司 双面镀膜设备及其载板处理单元
US11423364B2 (en) * 2018-11-29 2022-08-23 Capital One Services, Llc Device and method for facilitating recycling
US10937683B1 (en) 2019-09-30 2021-03-02 Applied Materials, Inc. Conveyor inspection system, substrate rotator, and test system having the same
WO2021202029A1 (en) * 2020-04-02 2021-10-07 Applied Materials, Inc. Inspection system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7189647B2 (en) * 2001-04-05 2007-03-13 Novellus Systems, Inc. Sequential station tool for wet processing of semiconductor wafers
US6935922B2 (en) * 2002-02-04 2005-08-30 Kla-Tencor Technologies Corp. Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing
JP4293150B2 (ja) * 2005-03-29 2009-07-08 セイコーエプソン株式会社 基板移載装置、基板移載方法、および電気光学装置の製造方法
JP2008078630A (ja) * 2006-08-24 2008-04-03 Hitachi Kokusai Electric Inc 基板処理システム
ITUD20070198A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Dispositivo di posizionamento per posizionare una o piu' piastre di circuiti elettronici, in un'unita' di deposizione del metallo, e relativo procedimento
ITUD20070195A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Procedimento di produzione e controllo di piastre per elettronica e relativo apparato

Also Published As

Publication number Publication date
WO2011003484A1 (en) 2011-01-13
CN102473671A (zh) 2012-05-23
TW201104910A (en) 2011-02-01
US20120136476A1 (en) 2012-05-31
EP2452358A1 (en) 2012-05-16
ITUD20090131A1 (it) 2011-01-09

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